AT93C56A-10PI-1.8 Atmel, AT93C56A-10PI-1.8 Datasheet

IC EEPROM 2KBIT 2MHZ 8DIP

AT93C56A-10PI-1.8

Manufacturer Part Number
AT93C56A-10PI-1.8
Description
IC EEPROM 2KBIT 2MHZ 8DIP
Manufacturer
Atmel
Datasheet

Specifications of AT93C56A-10PI-1.8

Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Memory Size
2K (256 x 8 or 128 x 16)
Speed
250kHz, 1MHz, 2MHz
Interface
3-Wire Serial
Voltage - Supply
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
1. Features
2. Description
The AT93C56A/66A provides 2048/4096 bits of serial electrically erasable program-
mable read-only memory (EEPROM) organized as 128/256 words of 16 bits each
(when the ORG pin is connected to VCC) and 256/512 words of 8 bits each (when the
ORG pin is tied to ground). The device is optimized for use in many industrial and
commercial applications where low-power and low-voltage operations are essential.
The AT93C56A/66A is available in space-saving 8-lead PDIP, 8-lead JEDEC SOIC, 8-
lead EIAJ SOIC,
Grid Array (ULA), 8-lead TSSOP, and 8-ball dBGA2 packages.
The AT93C56A/66A is enabled through the Chip Select pin (CS) and accessed via a
three-wire serial interface consisting of Data Input (DI), Data Output (DO), and Shift
Clock (SK). Upon receiving a read instruction at DI, the address is decoded and the
data is clocked out serially on the data output pin DO. The write cycle is completely
self-timed and no separate erase cycle is required before write. The write cycle is only
enabled when the part is in the Erase/Write Enable State. When CS is brought “high”
following the initiation of a write cycle, the DO pin outputs the Ready/Busy status of
the part.
The AT93C56A/66A is available in 2.7V to 5.5V and 1.8V to 5.5V versions.
Low-voltage and Standard-voltage Operation
User-selectable Internal Organization
Three-wire Serial Interface
Sequential Read Operation
2 MHz Clock Rate (5V)
Self-timed Write Cycle (10 ms Max)
High Reliability
Automotive Devices Available
8-lead JEDEC PDIP, 8-lead JEDEC SOIC, 8-lead EIAJ SOIC, 8-lead Ultra Thin mini-MAP
(MLP 2x3), 8-lead Ultra Lead Frame Land Grid Array (ULA), 8-lead TSSOP and 8-ball
dBGA2 Packages
– 2.7 (V
– 1.8 (V
– 2K: 256 x 8 or 128 x 16
– 4K: 512 x 8 or 256 x 16
– Endurance: 1 Million Write Cycles
– Data Retention: 100 Years
CC
CC
= 2.7V to 5.5V)
= 1.8V to 5.5V)
8-lead Ultra Thin mini-MAP (MLP 2x3)
, 8-lead Ultra Lead Frame Land
Three-wire
Serial
EEPROM
2K (256 x 8 or 128 x 16)
4K (512 x 8 or 256 x 16)
AT93C56A
AT93C66A
3378O–SEEPR–11/09

Related parts for AT93C56A-10PI-1.8

AT93C56A-10PI-1.8 Summary of contents

Page 1

... Ultra Thin mini-MAP (MLP 2x3) Grid Array (ULA), 8-lead TSSOP, and 8-ball dBGA2 packages. The AT93C56A/66A is enabled through the Chip Select pin (CS) and accessed via a three-wire serial interface consisting of Data Input (DI), Data Output (DO), and Shift Clock (SK). Upon receiving a read instruction at DI, the address is decoded and the data is clocked out serially on the data output pin DO ...

Page 2

... Internal Organization NC No Connect 3. Absolute Maximum Ratings* Operating Temperature .................................... −55°C to +125°C Storage Temperature........................................ −65°C to +150°C Voltage on Any Pin with Respect to Ground ........................................ −1.0V to +7.0V Maximum Operating Voltage .......................................... 6.25V DC Output Current........................................................ 5.0 mA AT93C56A/66A 2 8-lead SOIC 8-ball dBGA2 CS 1 VCC ...

Page 3

... When the ORG pin is connected to VCC, the x 16 organization is selected. When it is connected to ground, the x 8 organization is selected. If the ORG pin is left unconnected and the application does not load the input beyond the capability of the internal 1 Meg ohm pullup, then the x 16 organization is selected. 3378O–SEEPR–11/09 AT93C56A/66A 3 ...

Page 4

... Output High Voltage OH1 V Output Low Voltage OL2 V Output High Voltage OH2 Note min and V max are reference only and are not tested AT93C56A/66A 4 = 25° 1.0 MHz − = 40°C to +85° Test Condition READ at 1.0 MHz V = 5.0V CC WRITE at 1.0 MHz ...

Page 5

... AC Test 1.8V ≤ V ≤ 5.5V CC 2.7V ≤ V ≤ 5. Test 1.8V ≤ V ≤ 5.5V CC 2.7V ≤ V ≤ 5.5V AC Test CC 1.8V ≤ V ≤ 5. 1.8V ≤ V ≤ 5.5V CC AT93C56A/66A = As Specified, CC Min Typ Max 0.25 250 1000 250 1000 250 1000 50 200 100 400 0 100 ...

Page 6

... Table 3-4. Instruction Set for the AT93C56A and AT93C66A Op Instruction SB Code READ 1 10 EWEN 1 00 11XXXXXXX ERASE 1 11 WRITE 1 01 ERAL 1 00 10XXXXXXX WRAL 1 00 01XXXXXXX EWDS 1 00 00XXXXXXX Note: The X’s in the address field represent don’t care values and must be clocked. ...

Page 7

... Functional Description The AT93C56A/66A is accessed via a simple and versatile three-wire serial communication interface. Device operation is controlled by seven instructions issued by the host processor. A valid instruction starts with a rising edge of CS and consists of a Start Bit (logic “1”) followed by the appropriate Op Code and the desired memory address location. ...

Page 8

... Figure 5-1. Synchronous Data Timing Note: 1. This is the minimum SK period. Table 5-1. Notes: Figure 5-2. READ Timing High Impedance DO AT93C56A/66A 8 Organization Key for Timing Diagrams AT93C56A (2K DON’T CARE value, but the extra clock is required DON’T CARE value, but the extra clock is required. ...

Page 9

... Figure 5-3. EWEN Timing Figure 5-4. EWDS Timing Figure 5-5. WRITE Timing HIGH IMPEDANCE DO 3378O–SEEPR–11/09 ... ... ... ... AT93C56A/66A BUSY READY ...

Page 10

... Figure 5-6. WRAL Timing HIGH IMPEDANCE DO Note: 1. Valid only 4.5V to 5.5V. CC Figure 5-7. ERASE Timing HIGH IMPEDANCE DO AT93C56A/66A ... ... N-1 N ... D0 N BUSY READY STANDBY CHECK STATUS HIGH IMPEDANCE BUSY READY t WP 3378O–SEEPR–11/09 ...

Page 11

... Figure 5-8. ERAL Timing HIGH IMPEDANCE DO Note: 1. Valid only 4.5V to 5.5V. CC 3378O–SEEPR–11/ AT93C56A/66A t CS STANDBY CHECK STATUS BUSY HIGH IMPEDANCE READY ...

Page 12

... AT93C56A Ordering Information Ordering Code (2) AT93C56A-10PU-2.7 (2) AT93C56A-10PU-1.8 (2) AT93C56A-10SU-2.7 (2) AT93C56A-10SU-1.8 (2) AT93C56AW-10SU-2.7 (2) AT93C56AW-10SU-1.8 (2) AT93C56A-10TU-2.7 (2) AT93C56A-10TU-1.8 (2) AT93C56AU3-10UU-1.8 (3) AT93C56AD3-10DH-1.8 (2) AT93C56AY1-10YU-1.8 (Not recommended for new design) (3) AT93C56AY6-10YH-1.8 (4) AT93C56A-W1.8-11 Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table. 2. “U” designates Green package + RoHS compliant. ...

Page 13

... Low-voltage (1.8V to 5.5V) 3378O–SEEPR–11/09 (1) Package 8P3 8P3 8S1 8S1 8S2 8S2 8A2 8A2 8U3-1 8D3 8Y1 8Y6 Die Sale Package Type Options AT93C56A/66A Operation Range Lead-free/Halogen-free/ Industrial Temperature (−40°C to 85°C) Industrial Temperature (−40°C to 85°C) 13 ...

Page 14

... D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch and eA measured with the leads constrained to be perpendicular to datum. 5. Pointed or rounded lead tips are preferred to ease insertion and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm). 2325 Orchard Parkway San Jose, CA 95131 R AT93C56A/66A ...

Page 15

... These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc. 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 R 3378O–SEEPR–11/ Top View TITLE 8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC) AT93C56A/66A ∅ End View COMMON DIMENSIONS (Unit of Measure = mm) MIN MAX SYMBOL NOM A 1.35 – 1. ...

Page 16

... It is recommended that upper and lower cavities be equal. If they are different, the larger dimension shall be regarded. 4. Determines the true geometric position. 5. Values b,C apply to plated terminal. The standard thickness of the plating layer shall measure between 0.007 to .021 mm. 2325 Orchard Parkway San Jose, CA 95131 R 2325 Orchard Parkway San Jose, CA 95131 R AT93C56A/66A ∅ End View ...

Page 17

... SYMBOL TITLE 8Y6, 8-lead 2.0x3.0 mm Body, 0.50 mm Pitch, UltraThin Mini-MAP, Dual No Lead Package (Sawn)(UDFN) AT93C56A/66A (8X) (8X) Pin 1 ID Pin (8X) L (8X) e (6X) e (6X) 1.50 REF. 1.50 REF. COMMON DIMENSIONS (Unit of Measure = mm) MIN NOM MAX NOTE 2.00 BSC 3.00 BSC 1.40 1.50 1 ...

Page 18

... Map D E Top View Side View 2325 Orchard Parkway San Jose, CA 95131 R AT93C56A/66A End View A SYMBOL TITLE 8Y1, 8-lead (4.90 x 3.00 mm Body) MSOP Array Package (MAP PIN 1 INDEX AREA Bottom View COMMON DIMENSIONS (Unit of Measure = mm) MIN NOM MAX NOTE – ...

Page 19

... Dimension D and determined at Datum Plane H. 2325 Orchard Parkway San Jose, CA 95131 R 3378O–SEEPR–11/ TITLE 8A2, 8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP) AT93C56A/66A L1 L End View COMMON DIMENSIONS (Unit of Measure = mm) MIN MAX SYMBOL NOM D 2.90 3.00 3 ...

Page 20

... Top View PIN 1 BALL PAD CORNER (d1 (e1) Bottom View 8 Solder Balls 1. This drawing is for general information only. 2. Dimension ‘b’ is measured at maximum solder ball diameter 1150E Cheyenne Mt. Blvd Colorado Springs, CO 80906 R AT93C56A/66A SYMBOL TITLE 8U3-1, 8-ball, 1.50 x 2.00 mm Body, 0.50 mm pitch, Small Die Ball Grid Array Package (dBGA2) 1 ...

Page 21

... Colorado Springs, CO 80906 R 3378O–SEEPR–11/ SIDE VIEW SYMBOL TITLE 8D3, 8-lead (1.80 x 2.20 mm Body) Ultra Leadframe Land Grid Array (ULLGA) D3 AT93C56A/66A e1 PIN # BOTTOM VIEW COMMON DIMENSIONS (Unit of Measure = mm) MIN NOM MAX NOTE – – 0.40 0.00 – 0.05 1.70 1.80 1.90 2.10 2 ...

Page 22

... Revision History Revision No. 3378O 3378N 3378M 3378L 3378K AT93C56A/66A 22 Date Comments 11/2009 Added 8S2 package drawing 1/2009 Updated 8Y6 package drawing 7/2008 Updated Ordering Codes Updated to new template 11/2007 Added ULA package offering Removed DC/Don’t Connect and replaced with NC/No Conenct Adjusted size of Block diagram on pg ...

Page 23

... Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDI- TIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT ...

Related keywords