MT45W1MW16BAFB-856 WT TR Micron Technology Inc, MT45W1MW16BAFB-856 WT TR Datasheet - Page 58

IC PSRAM 16MBIT 85NS 54FBGA

MT45W1MW16BAFB-856 WT TR

Manufacturer Part Number
MT45W1MW16BAFB-856 WT TR
Description
IC PSRAM 16MBIT 85NS 54FBGA
Manufacturer
Micron Technology Inc

Specifications of MT45W1MW16BAFB-856 WT TR

Format - Memory
RAM
Memory Type
PSRAM (Page)
Memory Size
16M (1M x 16)
Speed
85ns
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.95 V
Operating Temperature
-30°C ~ 85°C
Package / Case
54-VFBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Figure 49:
PDF: 09005aef80ec6f63/Source: 09005aef80ec6f46
Burst CellularRAM_32__2.fm - Rev. E 10/05 EN
This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-REFLOW
DIAMETER IS Ø0.35.
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. CellularRAM is a trademark of Micron
SEATING PLANE
for production devices. Although considered final, these specifications are subject to change, as further product
54X Ø0.37
6.00
54-Ball VFBGA
0.10 C
Technologies, Inc., inside the U.S. and a trademark of Infineon Technologies outside the U.S.
BALL A6
3.00
prodmktg@micron.com www.micron.com Customer Comment Line: 800-932-4992
Notes: 1. All dimensions in millimeters; MAX/MIN, or typical, as noted.
C
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
All other trademarks are the property of their respective owners.
2 Meg x 16, 1 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory
2. Package width and length do not include mold protrusion; allowable mold protrusion is
1.875
0.25mm per side.
development and data characterization sometimes occur.
6.00 ±0.10
0.75
TYP
3.75
3.00 ±0.05
0.75 TYP
BALL A1
BALL A1 ID
0.70 ±0.05
4.00 ±0.05
58
8.00 ±0.10
®
Maximum and Typical Standby Currents
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
SOLDER BALL MATERIAL: 62% Sn, 36% Pb, 2% Ag or
96.5% Sn, 3% Ag, 0.5% Cu
SOLDER BALL PAD: Ø0.30 SOLDER MASK DEFINED
SUBSTRATE MATERIAL: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
©2003 Micron Technology, Inc. All rights reserved.
BALL A1 ID

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