CY7C1426AV18-167BZXC Cypress Semiconductor Corp, CY7C1426AV18-167BZXC Datasheet

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CY7C1426AV18-167BZXC

Manufacturer Part Number
CY7C1426AV18-167BZXC
Description
IC SRAM 36MBIT 167MHZ 165TFBGA
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C1426AV18-167BZXC

Format - Memory
RAM
Memory Type
SRAM - Synchronous, QDR II
Memory Size
36M (4M x 9)
Speed
167MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
0°C ~ 70°C
Package / Case
165-TFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1426AV18-167BZXC
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Cypress Semiconductor Corporation
Document Number: 38-05614 Rev. *C
Features
Configurations
CY7C1411AV18 – 4M x 8
CY7C1426AV18 – 4M x 9
CY7C1413AV18 – 2M x 18
CY7C1415AV18 – 1M x 36
Selection Guide
Maximum Operating Frequency
Maximum Operating Current
• Separate Independent Read and Write data ports
• 300-MHz clock for high bandwidth
• 4-Word Burst for reducing address bus frequency
• Double Data Rate (DDR) interfaces on both Read and
• Two input clocks (K and K) for precise DDR timing
• Two input clocks for output data (C and C) to minimize
• Echo clocks (CQ and CQ) simplify data capture in
• Single multiplexed address input bus latches address
• Separate Port Selects for depth expansion
• Synchronous internally self-timed writes
• Available in x8, x9, x18, and x36 configurations
• Full data coherency providing most current data
• Core V
• Available in 165-ball FBGA package (15 x 17 x 1.4 mm)
• Offered in both lead-free and non lead-free packages
• Variable drive HSTL output buffers
• JTAG 1149.1 compatible test access port
• Delay Lock Loop (DLL) for accurate data placement
— Supports concurrent transactions
Write ports (data transferred at 600 MHz) at 300 MHz
— SRAM uses rising edges only
clock-skew and flight-time mismatches
high-speed systems
inputs for both Read and Write ports
DD
= 1.8 (±0.1V); I/O V
DDQ
= 1.4V to V
300 MHz
925
300
198 Champion Court
DD
36-Mbit QDR™-II SRAM 4-Word Burst
278 MHz
278
875
Functional Description
The CY7C1411AV18, CY7C1426AV18, CY7C1413AV18, and
CY7C1415AV18 are 1.8V Synchronous Pipelined SRAMs,
equipped with QDR™-II architecture. QDR-II architecture
consists of two separate ports to access the memory array.
The Read port has dedicated Data Outputs to support Read
operations and the Write port has dedicated Data Inputs to
support Write operations. QDR-II architecture has separate
data inputs and data outputs to completely eliminate the need
to “turn-around” the data bus required with common I/O
devices. Access to each port is accomplished through a
common address bus. Addresses for Read and Write
addresses are latched on alternate rising edges of the input
(K) clock. Accesses to the QDR-II Read and Write ports are
completely independent of one another. In order to maximize
data throughput, both Read and Write ports are equipped with
Double Data Rate (DDR) interfaces. Each address location is
associated with four 8-bit words (CY7C1411AV18) or 9-bit
words (CY7C1426AV18) or 18-bit words (CY7C1413AV18) or
36-bit words (CY7C1415AV18) that burst sequentially into or
out of the device. Since data can be transferred into and out
of the device on every rising edge of both input clocks (K and
K and C and C), memory bandwidth is maximized while simpli-
fying system design by eliminating bus “turn-arounds”.
Depth expansion is accomplished with Port Selects for each
port. Port selects allow each port to operate independently.
All synchronous inputs pass through input registers controlled
by the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
250 MHz
250
800
San Jose
,
200 MHz
CA 95134-1709
700
200
Revised June 26, 2006
CY7C1426AV18
CY7C1413AV18
CY7C1415AV18
CY7C1411AV18
167 MHz
Architecture
167
600
408-943-2600
Unit
MHz
mA
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Related parts for CY7C1426AV18-167BZXC

CY7C1426AV18-167BZXC Summary of contents

Page 1

... Read and Write ports are equipped with Double Data Rate (DDR) interfaces. Each address location is associated with four 8-bit words (CY7C1411AV18) or 9-bit words (CY7C1426AV18) or 18-bit words (CY7C1413AV18) or 36-bit words (CY7C1415AV18) that burst sequentially into or out of the device. Since data can be transferred into and out ...

Page 2

... Logic Block Diagram (CY7C1411AV18) D [7:0] 8 Address Register A (19: CLK K Gen. DOFF V REF WPS Control Logic NWS [1:0] Logic Block Diagram (CY7C1426AV18) D [8:0] 9 Address Register A (19: CLK K Gen. DOFF V REF WPS Control Logic BWS [0] Document Number: 38-05614 Rev. *C Write Write Write Write ...

Page 3

... Reg Reg Register Control Logic Read Data Reg Reg. Reg. 36 Reg. Write Write Write Write Address Reg Reg Reg Reg Register Control Logic Read Data Reg. 144 72 Reg. Reg. 72 Reg. CY7C1411AV18 CY7C1426AV18 CY7C1413AV18 CY7C1415AV18 A (18:0) 19 RPS [17: (17:0) 18 RPS [35:0] 36 Page [+] Feedback ...

Page 4

... DDQ TDO TCK A Document Number: 38-05614 Rev. *C CY7C1411AV18 ( NC/144M NC/144M WPS NWS NC/288M K NWS DDQ DDQ DDQ DDQ DDQ DDQ DDQ CY7C1426AV18 ( WPS NC K NC/144M A NC/288M K BWS DDQ DDQ DDQ DDQ DDQ DDQ DDQ CY7C1411AV18 CY7C1426AV18 CY7C1413AV18 CY7C1415AV18 RPS DDQ V NC ...

Page 5

... K WPS BWS BWS BWS BWS DDQ DDQ DDQ DDQ DDQ DDQ DDQ CY7C1411AV18 CY7C1426AV18 CY7C1413AV18 CY7C1415AV18 NC/72M CQ RPS DDQ DDQ DDQ DDQ DDQ REF DDQ DDQ DDQ TMS TDI NC/144M CQ RPS A D17 Q17 Q8 V D16 D15 D7 Q16 SS V Q15 D6 Q6 DDQ ...

Page 6

... These address inputs are multiplexed for both Read and Write operations. Internally, the device is organized arrays each for CY7C1411AV18 arrays each for CY7C1426AV18, arrays each of 512K x 18) for CY7C1413AV18 and arrays each of 256K x 36) for CY7C1415AV18. Therefore, only 20 address inputs are needed to access the entire memory array of CY7C1411AV18 and CY7C1426AV18, 19 address inputs for CY7C1413AV18 and 18 address inputs for CY7C1415AV18 ...

Page 7

... Each access consists of four 8-bit data transfers in the case of CY7C1411AV18, four 9-bit data transfers in the case of CY7C1426AV18, four 18-bit data transfers in the case of CY7C1413AV18, and four 36-bit data in the case of CY7C1415AV18 transfers in two clock cycles. Accesses for both ports are initiated on the Positive Input Clock (K) ...

Page 8

... QDR-II. In the single clock mode generated with respect to K and CQ is generated with respect to K. The timings for the echo clocks are shown in the AC Timing table. CY7C1411AV18 CY7C1426AV18 CY7C1413AV18 CY7C1415AV18 to allow the SRAM to adjust its SS ...

Page 9

... 50ohms Vt = Vddq D( ↑ D K(t +1) ↑ ↑ ↑ Q( ↑ ↑ ↑ ↑ High High-Z Previous State Previous State ↑ represents rising edge. CY7C1411AV18 CY7C1426AV18 CY7C1413AV18 CY7C1415AV18 SRAM # 250ohms CQ/CQ High High-Z Previous State ...

Page 10

... CY7C1413AV18 − only the upper byte (D [17:9] unaltered. No data is written into the devices during this portion of a write operation. , NWS , BWS 0 1 CY7C1411AV18 CY7C1426AV18 CY7C1413AV18 CY7C1415AV18 ) is written into the device. D will remain [3:0] [7: written into the device. D will remain [17: written into the device ...

Page 11

... D will remain unaltered. [26:0] – No data is written into the device during this portion of a write operation. L–H No data is written into the device during this portion of a write operation. Comments CY7C1411AV18 CY7C1426AV18 CY7C1413AV18 CY7C1415AV18 ) are written [35:0] ) are written [35: written [8:0] ...

Page 12

... TDI and TDO pins and allows the IDCODE to be shifted out of the device when the TAP controller enters the Shift-DR state. The IDCODE instruction is loaded into the instruction register upon power-up or whenever the TAP controller is given a test logic reset state. CY7C1411AV18 CY7C1426AV18 CY7C1413AV18 CY7C1415AV18 Page [+] Feedback ...

Page 13

... The shifting of data for the SAMPLE and PRELOAD phases can occur concurrently when required—that is, while data captured is shifted out, the preloaded data can be shifted in. Document Number: 38-05614 Rev. *C CY7C1411AV18 CY7C1426AV18 CY7C1413AV18 CY7C1415AV18 BYPASS When the BYPASS instruction is loaded in the instruction register and the TAP is placed in a Shift-DR state, the bypass register is placed between the TDI and TDO pins ...

Page 14

... Note: 11. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document Number: 38-05614 Rev SELECT DR-SCAN 0 1 CAPTURE-DR 0 SHIFT- EXIT1- PAUSE- EXIT2-DR 1 UPDATE- CY7C1411AV18 CY7C1426AV18 CY7C1413AV18 CY7C1415AV18 1 SELECT IR-SCAN 0 1 CAPTURE-IR 0 SHIFT- EXIT1- PAUSE- EXIT2-IR 1 UPDATE- Page ...

Page 15

... Over the Operating Range Test Conditions = −2 −100 µ 2 100 µ GND ≤ V ≤ [13, 14] Over the Operating Range Description / ns CY7C1411AV18 CY7C1426AV18 CY7C1413AV18 CY7C1415AV18 Selection TDO Circuitry Min. Max. Unit 1.4 V 1.6 V 0.4 V 0.2 V 0.65V –0.3 0.35V V DD µ ...

Page 16

... TCYC t TMSS t TMSH t TDIS t TDIH t TDOV Value CY7C1426AV18 CY7C1413AV18 000 000 00000110100 00000110100 1 1 CY7C1411AV18 CY7C1426AV18 CY7C1413AV18 CY7C1415AV18 Min. Max. Unit ALL INPUT PULSES 0.9V t TDOX CY7C1415AV18 Description 000 Version number. type of SRAM. 00000110100 Allows unique identification of SRAM vendor. 1 Indicates the presence register ...

Page 17

... Do Not Use: This instruction is reserved for future use. 110 Do Not Use: This instruction is reserved for future use. 111 Places the bypass register between TDI and TDO. This operation does not affect SRAM operation. CY7C1411AV18 CY7C1426AV18 CY7C1413AV18 CY7C1415AV18 Description Page [+] Feedback ...

Page 18

... Bump ID 10G 11F 58 5A 11G 10F 61 4B 11E 62 3A 10E 63 2A 10D 10C 66 3B 11D 11B 70 3C 11C 10B 73 3E 11A 74 2D 10A CY7C1411AV18 CY7C1426AV18 CY7C1413AV18 CY7C1415AV18 Bit # Bump 100 2P 101 1P 102 3R 103 4R 104 4P 105 5P 106 5N 107 5R 108 Internal Page [+] Feedback ...

Page 19

... If the input clock is unstable and the DLL is enabled, then the DLL may lock to an incorrect frequency, causing unstable SRAM behavior REF > 1024 Stable clock Stable DDQ Stable (< +/- 0.1V DC per 50ns ) / DDQ Fix High (or tied to V DDQ ) CY7C1411AV18 CY7C1426AV18 CY7C1413AV18 CY7C1415AV18 . Start Normal Operation Page [+] Feedback ...

Page 20

... RQ <= 350Ωs. − /2), Undershoot: V (AC) > 1.5V (Pulse width less than t CYC IL (min.) within 200 ms. During this time V < V and (Max.) = 0.95V or 0.54V , whichever is smaller. REF DDQ CY7C1411AV18 CY7C1426AV18 CY7C1413AV18 CY7C1415AV18 Ambient [21] [21 DDQ 1.8 ± 0.1V 1. Min. Typ. Max. Unit 1 ...

Page 21

... V = 0.75V REF V 0.75V R = 50Ω REF OUTPUT Device 0.25V 5 pF Under ZQ Test RQ = 250Ω (b) /I and load capacitance shown in ( Test Loads CY7C1411AV18 CY7C1426AV18 CY7C1413AV18 CY7C1415AV18 Max. Unit 165 FBGA Package Unit 17.2 °C/W 3.2 °C/W [24] ALL INPUT PULSES 1.25V 0.75V Slew Rate = 2 V/ ...

Page 22

... This part has a voltage regulator internally; t POWER can be initiated. 27. For D2 data signal on CY7C1426AV18 device are specified with a load capacitance part ( Test Loads. Transition is measured ± 100 mV from steady-state voltage. 28 ...

Page 23

... CY7C1411AV18 CY7C1426AV18 CY7C1413AV18 CY7C1415AV18 200 MHz 167 MHz Unit 0.45 – 0.45 – 0.50 ns – –0.45 – –0.50 – ns 0.30 – 0.35 – ...

Page 24

... WRITE READ WRITE KHKH D13 D10 D11 D12 Q00 Q01 Q02 CLZ t DOH t KHKH t CCQO t CQOH t CCQO t CQOH DON’T CARE CY7C1411AV18 CY7C1426AV18 CY7C1413AV18 CY7C1415AV18 NOP D30 D31 D32 D33 Q03 Q20 Q21 Q22 Q23 t CHZ t CQDOH t CQD UNDEFINED Page [+] Feedback ...

Page 25

... Ordering Code Diagram 167 CY7C1411AV18-167BZC 51-85195 165-ball Fine Pitch Ball Grid Array ( 1.4 mm) CY7C1426AV18-167BZC CY7C1413AV18-167BZC CY7C1415AV18-167BZC CY7C1411AV18-167BZXC 51-85195 165-ball Fine Pitch Ball Grid Array ( 1.4 mm) Lead-Free CY7C1426AV18-167BZXC CY7C1413AV18-167BZXC CY7C1415AV18-167BZXC CY7C1411AV18-167BZI 51-85195 165-ball Fine Pitch Ball Grid Array ( 1.4 mm) CY7C1426AV18-167BZI CY7C1413AV18-167BZI CY7C1415AV18-167BZI CY7C1411AV18-167BZXI 51-85195 165-ball Fine Pitch Ball Grid Array ( ...

Page 26

... CY7C1413AV18-278BZXI CY7C1415AV18-278BZXI 300 CY7C1411AV18-300BZC 51-85195 165-ball Fine Pitch Ball Grid Array ( 1.4 mm) CY7C1426AV18-300BZC CY7C1413AV18-300BZC CY7C1415AV18-300BZC CY7C1411AV18-300BZXC 51-85195 165-ball Fine Pitch Ball Grid Array ( 1.4 mm) Lead-Free CY7C1426AV18-300BZXC CY7C1413AV18-300BZXC CY7C1415AV18-300BZXC CY7C1411AV18-300BZI 51-85195 165-ball Fine Pitch Ball Grid Array ( 1.4 mm) CY7C1426AV18-300BZI CY7C1413AV18-300BZI CY7C1415AV18-300BZI CY7C1411AV18-300BZXI 51-85195 165-ball Fine Pitch Ball Grid Array ( ...

Page 27

... The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. CY7C1411AV18 CY7C1426AV18 CY7C1413AV18 CY7C1415AV18 ...

Page 28

... Document History Page Document Title: CY7C1411AV18/CY7C1426AV18/CY7C1413AV18/CY7C1415AV18 36-Mbit QDR™-II SRAM 4-Word Burst Architecture Document Number: 38-05614 ISSUE ORIG. OF REV. ECN NO. DATE CHANGE DESCRIPTION OF CHANGE ** 247331 See ECN *A 326519 See ECN *B 413953 See ECN *C 468029 See ECN Document Number: 38-05614 Rev. *C SYT ...

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