W25X32VSFIG Winbond Electronics, W25X32VSFIG Datasheet - Page 40

• Manufacturer Part Number: W25X32VSFIG
• Description: IC FLASH 32MBIT 75MHZ 16SOIC
• Manufacturer: Winbond Electronics

Specifications of W25X32VSFIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 32M (4M x 8)
• Speed: 75MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-SOIC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

13.
13.1 8-Pin SOIC 208-mil (Package Code SS)
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane.
PACKAGE SPECIFICATION
SYMBOL
A1
A2
E1
A
C
D
E
b
e
L
θ
y
1.75
0.05
1.70
0.35
0.19
5.18
7.70
5.18
0.50
MIN
MILLIMETERS
---
0
o
1.27 BSC
- 40 -
MAX
2.16
0.25
1.91
0.48
0.25
5.38
8.10
5.38
0.80
0.10
8
o
W25X16, W25X32, W25X64
0.069
0.002
0.067
0.014
0.007
0.204
0.303
0.204
0.020
MIN
---
0
0.050 BSC
o
INCHES
0.085
0.010
0.075
0.019
0.010
0.212
0.319
0.212
0.031
0.004
MAX
8
o