W25X32VSSIG Winbond Electronics, W25X32VSSIG Datasheet - Page 17

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W25X32VSSIG

Manufacturer Part Number
W25X32VSSIG
Description
IC FLASH 32MBIT 75MHZ 8SOIC
Manufacturer
Winbond Electronics
Datasheet

Specifications of W25X32VSSIG

Format - Memory
FLASH
Memory Type
FLASH
Memory Size
32M (4M x 8)
Speed
75MHz
Interface
SPI Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Quantity:
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11.2.2 Instruction Set
Notes:
1. Data bytes are shifted with Most Significant Bit first. Byte fields with data in parenthesis “( )” indicate data being
2. The Status Register contents will repeat continuously until /CS terminates the instruction.
3. See Manufacturer and Device Identification table for Device ID information.
4. The Device ID will repeat continuously until /CS terminates the instruction.
INSTRUCTION
NAME
Write Enable
Write Disable
Read Status
Register
Write Status
Register
Read Data
Fast Read
Fast Read Dual
Output
Page Program
Block Erase
(64KB)
Sector Erase
(4KB)
Chip Erase
Power-down
Release Power-
down / Device ID
Manufacturer/
Device ID
JEDEC ID
read from the device on the DO pin.
(3)
BYTE 1
CODE
06h
04h
05h
01h
0Bh
3Bh
02h
D8h
20h
C7h
B9h
ABh
90h
9Fh
03h
(1)
BYTE 2
(S7–S0)
S7–S0
A23–A16
A23–A16
A23–A16
A23–A16
A23–A16
A23–A16
dummy
dummy
(M7-M0)
Manufacturer
(1)
BYTE 3
A15–A8
A15–A8
A15–A8
A15–A8
A15–A8
A15–A8
dummy
dummy
(ID15-ID8)
Memory
Type
- 17 -
W25X16, W25X32, W25X64
BYTE 4
A7–A0
A7–A0
A7–A0
A7–A0
A7–A0
A7–A0
dummy
00h
(ID7-ID0)
Capacity
BYTE 5
(D7–D0)
dummy
dummy
(D7–D0)
(ID7-ID0)
(M7-M0)
(4)
March 21, 2007, Revision F
(D7–D0)
I/O =
(D6,D4,D2,D0)
O =
(D7,D5,D3,D1)
BYTE 6
(Next byte)
(Next byte)
(ID7-ID0)
Publication Release Date:
N-BYTES
(2)
continuous
(Next Byte)
continuous
(one byte
per 4 clocks,
continuous)
Up to 256
bytes

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