W25X32VSSIG Winbond Electronics, W25X32VSSIG Datasheet - Page 3

• Manufacturer Part Number: W25X32VSSIG
• Description: IC FLASH 32MBIT 75MHZ 8SOIC
• Manufacturer: Winbond Electronics

Specifications of W25X32VSSIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 32M (4M x 8)
• Speed: 75MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

12.
13.
14.
15.
ELECTRICAL CHARACTERISTICS (PRELIMINARY)............................................................. 33
12.1
12.2
12.3
12.4
12.5
12.6
12.7
12.8
12.9
12.10
12.11
PACKAGE SPECIFICATION .................................................................................................... 40
13.1
13.2
13.3
13.4
13.5
ORDERING INFORMATION .................................................................................................... 45
REVISION HISTORY ................................................................................................................ 47
11.2.4
11.2.5
11.2.6
11.2.7
11.2.8
11.2.9
11.2.10
11.2.11
11.2.12
11.2.13
11.2.14
11.2.15
11.2.16
11.2.17
Absolute Maximum Ratings .......................................................................................... 33
Operating Ranges......................................................................................................... 33
Endurance and Data Retention .................................................................................... 34
Power-up Timing and Write Inhibit Threshold .............................................................. 34
DC Electrical Characteristics ........................................................................................ 35
AC Measurement Conditions........................................................................................ 36
AC Electrical Characteristics ........................................................................................ 37
AC Electrical Characteristics (Cont’d) .......................................................................... 38
Serial Output Timing ..................................................................................................... 39
8-Pin SOIC 208-mil (Package Code SS)...................................................................... 40
8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 41
8-contact 6x5 WSON .................................................................................................... 42
8-contact 6x5 WSON (Cont’d) ...................................................................................... 43
16-Pin SOIC 300-mil (Winbond Package Code SF)..................................................... 44
Input Timing................................................................................................................. 39
Hold Timing ................................................................................................................. 39
Write Disable (04h).......................................................................................................18
Read Status Register (05h) ..........................................................................................19
Write Status Register (01h) ..........................................................................................20
Read Data (03h) ...........................................................................................................21
Fast Read (0Bh) ...........................................................................................................22
Fast Read Dual Output (3Bh) .......................................................................................23
Page Program (02h) ...................................................................................................24
Sector Erase (20h) .....................................................................................................25
Block Erase (D8h) ......................................................................................................26
Chip Erase (C7h)........................................................................................................27
Power-down (B9h) ......................................................................................................28
Release Power-down / Device ID (ABh) .....................................................................29
Read Manufacturer / Device ID (90h) .........................................................................31
JEDEC ID (9Fh)..........................................................................................................32
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W25X16, W25X32, W25X64
March 21, 2007, Revision F
Publication Release Date: