W25X32VSSIG Winbond Electronics, W25X32VSSIG Datasheet - Page 31

• Manufacturer Part Number: W25X32VSSIG
• Description: IC FLASH 32MBIT 75MHZ 8SOIC
• Manufacturer: Winbond Electronics

Specifications of W25X32VSSIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 32M (4M x 8)
• Speed: 75MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

W25X16, W25X32, W25X64
11.2.16 Read Manufacturer / Device ID (90h)
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down /
Device ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device
ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device
ID instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code
“90h” followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond
(EFh) and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first
as shown in figure 18. The Device ID values for the W25X16, W25X32, AND W25X64 are listed in
Manufacturer and Device Identification table. If the 24-bit address is initially set to 000001h the Device
ID will be read first and then followed by the Manufacturer ID. The Manufacturer and Device IDs can
be read continuously, alternating from one to the other. The instruction is completed by driving /CS
high.
Figure 18. Read Manufacturer / Device ID Diagram
Publication Release Date:
- 31 -
March 21, 2007, Revision F