W25X32VSSIG Winbond Electronics, W25X32VSSIG Datasheet - Page 44

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W25X32VSSIG

Manufacturer Part Number
W25X32VSSIG
Description
IC FLASH 32MBIT 75MHZ 8SOIC
Manufacturer
Winbond Electronics
Datasheet

Specifications of W25X32VSSIG

Format - Memory
FLASH
Memory Type
FLASH
Memory Size
32M (4M x 8)
Speed
75MHz
Interface
SPI Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
W25X32VSSIG
Manufacturer:
WINBOND
Quantity:
23 988
Part Number:
W25X32VSSIG
Manufacturer:
ST
0
Part Number:
W25X32VSSIG
Manufacturer:
WINBOND/华邦
Quantity:
20 000
Part Number:
W25X32VSSIGE
Manufacturer:
MAXIM
Quantity:
236
13.5 16-Pin SOIC 300-mil (Winbond Package Code SF)
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
SYMBOL
E1
D
e
A1
A
C
E
b
L
θ
y
(2)
(3)
(3)
10.08
10.01
2.36
0.10
0.33
0.18
7.39
0.39
MIN
MILLIMETERS
---
0
o
1.27 BSC
10.49
10.64
0.076
- 44 -
MAX
2.64
0.30
0.51
0.28
7.59
1.27
8
o
W25X16, W25X32, W25X64
0.093
0.004
0.013
0.007
0.397
0.394
0.291
0.015
MIN
---
0
0.050 BSC
o
INCHES
0.104
0.012
0.020
0.011
0.413
0.419
0.299
0.050
0.003
MAX
8
o

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