W25X32VSSIG Winbond Electronics, W25X32VSSIG Datasheet - Page 47

• Manufacturer Part Number: W25X32VSSIG
• Description: IC FLASH 32MBIT 75MHZ 8SOIC
• Manufacturer: Winbond Electronics

Specifications of W25X32VSSIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 32M (4M x 8)
• Speed: 75MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

15.
VERSION
A
B
C
D
E
F
REVISION HISTORY
02/13/06
06/28/06
10/19/06
2/26/07
3/21/07
2/1/07
DATE
18, 35, 37 & 45
6-9, 29, 33, 35,
34, 35, 41 & 46
1-4, 6, 32-36,
4 - 8 & 45
41 & 42
38 & 45
PAGE
- 47 -
W25X16, W25X32, W25X64
New Create
Added W25X64 in the product family. Added
300mil PDIP package. Added 6x5 mm
WSON package. Updated Endurance and
Data Retention table (11.3), ICC’s in DC
Parameter table (11.5 & 11.6). Reduced tPP
(max) from 5mS to 3mS. Changed tSHCH
from 5nS to 0nS. Added byte programming
parameters (tBP1 & tBPn. Added additional
byte programming parameter, tBP2 and
moved multiple byte programming tBPn with
formula to foot note.
Changed tCHSH and tSHCH respectively
from 10nS and 0nS to 5nS and 5nS. Modified
the ordering information table to eliminate the
hyphen in the part number. Corrected Write
Enable/Disable text. Change ICC2 from 5uA
to 10uA.. Added footnotes in the ordering
information table. Updated ICC3 specs.
Updated package and ordering information.
Updated Figure 2.
Updated ICC3 specs.
Added Valid Combinations for ordering info.
Added transient voltage specification.
Removed preliminary designation for 25X16.
Updated typical ratings on erase operations.
Updated table 12.3.
Updated ICC3 and ICC5 specs.
Added 300mil DIP package.
added valid part number and marking table.
DESCRIPTION
March 21, 2007, Revision F
Publication Release Date: