W25X32VSSIG T&R Winbond Electronics, W25X32VSSIG T&R Datasheet - Page 29

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W25X32VSSIG T&R

Manufacturer Part Number
W25X32VSSIG T&R
Description
IC FLASH 32MBIT 75MHZ 8SOIC
Manufacturer
Winbond Electronics
Datasheet

Specifications of W25X32VSSIG T&R

Format - Memory
FLASH
Memory Type
FLASH
Memory Size
32M (4M x 8)
Speed
75MHz
Interface
SPI Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
W25X16, W25X32, W25X64
11.2.15 Release Power-down / Device ID (ABh)
The Release from Power-down / Device ID instruction is a multi-purpose instruction. It can be used to
release the device from the power-down state, obtain the devices electronic identification (ID) number
or do both.
When used only to release the device from the power-down state, the instruction is issued by driving
the /CS pin low, shifting the instruction code “ABh” and driving /CS high as shown in figure 16. After
the time duration of t
(See AC Characteristics) the device will resume normal operation and other
RES1
instructions will be accepted. The /CS pin must remain high during the t
time duration.
RES1
When used only to obtain the Device ID while not in the power-down state, the instruction is initiated
by driving the /CS pin low and shifting the instruction code “ABh” followed by 3-dummy bytes. The
Device ID bits are then shifted out on the falling edge of CLK with most significant bit (MSB) first as
shown in figure 17. The Device ID values for the W25X16, W25X32, and W25X64 are listed in
Manufacturer and Device Identification table. The Device ID can be read continuously. The instruction
is completed by driving /CS high.
When used to release the device from the power-down state and obtain the Device ID, the instruction
is the same as previously described, and shown in figure 17, except that after /CS is driven high it
must remain high for a time duration of t
(See AC Characteristics). After this time duration the
RES2
device will resume normal operation and other instructions will be accepted.
If the Release from Power-down / Device ID instruction is issued while an Erase, Program or Write
cycle is in process (when BUSY equals 1) the instruction is ignored and will not have any effects on
the current cycle
Figure 16. Release Power-down Instruction Sequence
Publication Release Date:
- 29 -
March 21, 2007, Revision F

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