W25X32VZEIG Winbond Electronics, W25X32VZEIG Datasheet - Page 35

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W25X32VZEIG

Manufacturer Part Number
W25X32VZEIG
Description
IC FLASH 32MBIT 75MHZ 8WSON
Manufacturer
Winbond Electronics
Datasheet

Specifications of W25X32VZEIG

Format - Memory
FLASH
Memory Type
FLASH
Memory Size
32M (4M x 8)
Speed
75MHz
Interface
SPI Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-WSON
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
12.5 DC Electrical Characteristics
Notes:
1. Tested on sample basis and specified through design and characterization data. TA=25° C, VCC 3V.
2. Checker Board Pattern.
PARAMETER
Input Capacitance
Output Capacitance
Input Leakage
I/O Leakage
Standby Current
Power-down Current
Current Read Data /
Dual Output Read
1MHz
Current Read Data /
Dual Output Read
33MHz
Current Read Data /
Dual Output Read
50MHz
Current Read Data /
Dual Output Read
75MHz
Current Page
Program
Current Write Status
Register
Current Sector/Block
Erase
Current Chip Erase
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
(2)
(2)
(2)
(2)
SYMBOL
C
Cout
I
I
I
I
I
I
I
I
I
I
I
I
V
V
V
V
LI
LO
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
IL
IH
OL
OH
IN
1
2
3
3
3
3
4
5
6
7
(1)
(1)
CONDITIONS
V
V
/CS = VCC,
VIN = GND or VCC
/CS = VCC,
VIN = GND or VCC
C = 0.1 VCC / 0.9 VCC
DO = Open
C = 0.1 VCC / 0.9 VCC
DO = Open
C = 0.1 VCC / 0.9 VCC
DO = Open
C = 0.1 VCC / 0.9 VCC
DO = Open
/CS = VCC
/CS = VCC
/CS = VCC
/CS = VCC
I
I
OL
OH
IN
OUT
= 1.6 mA
= 0V
= –100 µA
= 0V
(2)
(2)
- 35 -
W25X16, W25X32, W25X64
VCC x0.7
VCC –0.2
–0.5
MIN
SPEC
11/12
9/10
TYP
5/6
7/8
March 21, 2007, Revision F
25
<1
20
10
20
20
Publication Release Date:
VCC x 0.3
VCC +0.4
11/12
13/15
16/18
MAX
7/8
0.4
±2
±2
50
10
25
18
25
25
6
8
UNIT
mA
mA
mA
mA
mA
mA
mA
mA
µA
µA
µA
µA
pf
pf
V
V
V
V

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