W25X32VZEIG T&R Winbond Electronics, W25X32VZEIG T&R Datasheet - Page 40

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W25X32VZEIG T&R

Manufacturer Part Number
W25X32VZEIG T&R
Description
IC FLASH 32MBIT 75MHZ 8WSON
Manufacturer
Winbond Electronics
Datasheet

Specifications of W25X32VZEIG T&R

Format - Memory
FLASH
Memory Type
FLASH
Memory Size
32M (4M x 8)
Speed
75MHz
Interface
SPI Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-WSON
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
13.
13.1 8-Pin SOIC 208-mil (Package Code SS)
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane.
PACKAGE SPECIFICATION
SYMBOL
A1
A2
E1
A
C
D
E
b
e
L
θ
y
1.75
0.05
1.70
0.35
0.19
5.18
7.70
5.18
0.50
MIN
MILLIMETERS
---
0
o
1.27 BSC
- 40 -
MAX
2.16
0.25
1.91
0.48
0.25
5.38
8.10
5.38
0.80
0.10
8
o
W25X16, W25X32, W25X64
0.069
0.002
0.067
0.014
0.007
0.204
0.303
0.204
0.020
MIN
---
0
0.050 BSC
o
INCHES
0.085
0.010
0.075
0.019
0.010
0.212
0.319
0.212
0.031
0.004
MAX
8
o

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