MD5811-D256-V3Q18-X SanDisk, MD5811-D256-V3Q18-X Datasheet - Page 10

• Manufacturer Part Number: MD5811-D256-V3Q18-X
• Description: IC MDOC P3 256MB 48-TSOP
• Manufacturer: SanDisk

Specifications of MD5811-D256-V3Q18-X

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 256M (32M x 8)
• Speed: 55ns
• Interface: Parallel
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-TSOP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

2.2
2.2.1 Pin/Ball Diagrams
See Figure 1 and Figure 2 for the Mobile DiskOnChip P3 256Mb pinout/ballout for the standard
interface. To ensure proper device functionality, pins/balls marked RSRVD are reserved for future
use and should not be connected.
Note: Mobile DiskOnChip P3 is designed as a drop-in replacement for second-generation (G2)
TSOP-I Package
7
DMARQ#
RSTIN#
A0/DPD
RSRVD
IF_CFG
LOCK#
DiskOnChip Plus products, assuming that the latter were integrated according to migration
guide guidelines. Refer to application note AP-DOC-067, Preparing your PCB Footprint for
the DiskOnChip BGA Migration Path, for further information.
WE#
VCC
OE#
VSS
CE#
A12
A11
A10
ID0
Standard Interface
A9
A8
A7
A6
A5
A4
A3
A2
A1
Figure 1: TSOP-I Pinout for Standard Interface (Mobile DiskOnChip P3 256Mb)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Mobile DiskOnChip P3 256Mb (32MB)
Data Sheet, Rev. 0.3
48-Pin TSOP-I
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
Mobile DiskOnChip P3
93-SR-009-8L
VSS
IRQ#
D15
D14
D13
D12
D11
D10
D9
D8
CLK
VCCQ
VSS
D7
D6
D5
D4
D3
D2
D1
D0
BUSY#
ID1
VSS