MD5811-D256-V3Q18-X SanDisk, MD5811-D256-V3Q18-X Datasheet - Page 4

• Manufacturer Part Number: MD5811-D256-V3Q18-X
• Description: IC MDOC P3 256MB 48-TSOP
• Manufacturer: SanDisk

Specifications of MD5811-D256-V3Q18-X

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 256M (32M x 8)
• Speed: 55ns
• Interface: Parallel
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-TSOP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

T
1. Introduction ............................................................................................................................... 5
2. Product Overview ...................................................................................................................... 6
3. Theory of Operation ................................................................................................................ 21
4. x2 Technology ......................................................................................................................... 28
1
ABLE OF
2.1
2.2
2.3
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10 Flash Architecture............................................................................................................. 26
4.1
4.2
4.3
Product Description ............................................................................................................ 6
Standard Interface .............................................................................................................. 7
2.2.1
2.2.2
2.2.3
Multiplexed Interface ........................................................................................................ 14
2.3.1
2.3.2
2.3.3
Overview........................................................................................................................... 21
System Interface............................................................................................................... 22
3.2.1
3.2.2
Configuration Interface ..................................................................................................... 23
Protection and Security-Enabling Features ...................................................................... 23
3.4.1
3.4.2
3.4.3
3.4.4
3.4.5
Programmable Boot Block with eXecute In Place (XIP) Functionality.............................. 24
Download Engine (DE) ..................................................................................................... 25
Error Detection Code/Error Correction Code (EDC/ECC) ................................................ 25
Data Pipeline .................................................................................................................... 25
Control and Status............................................................................................................ 25
MultiBurst Operation......................................................................................................... 28
DMA Operation................................................................................................................. 30
Combined MultiBurst Mode and DMA Operation ............................................................. 31
C
ONTENTS
Pin/Ball Diagrams................................................................................................................. 7
System Interface .................................................................................................................. 9
Signal Description .............................................................................................................. 10
Pin/Ball Diagram................................................................................................................. 14
System Interface ................................................................................................................ 16
Signal Description .............................................................................................................. 17
Standard (NOR-Like) Interface........................................................................................... 22
Multiplexed Interface .......................................................................................................... 22
Read/Write Protection ........................................................................................................ 23
Unique Identification (UID) Number ................................................................................... 23
One-Time Programmable (OTP) Area ............................................................................... 24
One-Time Write (ROM-Like) Partition ................................................................................ 24
Sticky Lock (SLOCK).......................................................................................................... 24
Data Sheet, Rev. 0.3
Mobile DiskOnChip P3
93-SR-009-8L