MD5811-D256-V3Q18-X SanDisk, MD5811-D256-V3Q18-X Datasheet - Page 6

• Manufacturer Part Number: MD5811-D256-V3Q18-X
• Description: IC MDOC P3 256MB 48-TSOP
• Manufacturer: SanDisk

Specifications of MD5811-D256-V3Q18-X

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 256M (32M x 8)
• Speed: 55ns
• Interface: Parallel
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-TSOP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

9. Booting from Mobile DiskOnChip P3..................................................................................... 55
10. Design Considerations ........................................................................................................... 58
11. Product Specifications ........................................................................................................... 68
3
8.15 DMA Control Register [1:0]............................................................................................... 52
8.16 MultiBurst Mode Control Register..................................................................................... 54
9.1
9.2
9.3
10.1 General Guidelines........................................................................................................... 58
10.2 Standard NOR-Like Interface ........................................................................................... 59
10.3 Multiplexed Interface ........................................................................................................ 60
10.4 Connecting Control Signals .............................................................................................. 60
10.5 Implementing the Interrupt Mechanism ............................................................................ 62
10.6 Device Cascading............................................................................................................. 63
10.7 Boot Replacement ............................................................................................................ 64
10.8 Platform-Specific Issues ................................................................................................... 65
10.9 Design Environment ......................................................................................................... 67
11.1 Environmental Specifications ........................................................................................... 68
11.2 Electrical Specifications.................................................................................................... 68
Introduction....................................................................................................................... 55
Boot Procedure in PC-Compatible Platforms ................................................................... 55
Boot Replacement ............................................................................................................ 56
9.3.1
9.3.2
9.3.3
10.4.1 Standard Interface.............................................................................................................. 60
10.4.2 Multiplexed Interface .......................................................................................................... 61
10.5.1 Hardware Configuration ..................................................................................................... 62
10.5.2 Software Configuration....................................................................................................... 62
10.8.1 Wait State ........................................................................................................................... 65
10.8.2 Big and Little Endian Systems............................................................................................ 65
10.8.3 Busy Signal......................................................................................................................... 65
10.8.4 Working with 8/16/32-Bit Systems...................................................................................... 65
11.1.1 Operating Temperature ...................................................................................................... 68
11.1.2 Thermal Characteristics ..................................................................................................... 68
11.1.3 Humidity.............................................................................................................................. 68
11.1.4 Endurance .......................................................................................................................... 68
11.2.1 Absolute Maximum Ratings................................................................................................ 68
11.2.2 Capacitance........................................................................................................................ 69
PC Architectures ................................................................................................................ 56
Non-PC Architectures......................................................................................................... 57
Asynchronous Boot Mode .................................................................................................. 57
Data Sheet, Rev. 0.3
Mobile DiskOnChip P3
93-SR-009-8L