HYB39S256160FE-7 Qimonda, HYB39S256160FE-7 Datasheet

IC SDRAM 256MBIT 143MHZ 54TSOP

HYB39S256160FE-7

Manufacturer Part Number
HYB39S256160FE-7
Description
IC SDRAM 256MBIT 143MHZ 54TSOP
Manufacturer
Qimonda
Datasheet

Specifications of HYB39S256160FE-7

Format - Memory
RAM
Memory Type
SDRAM
Memory Size
256M (16Mx16)
Speed
143MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
54-TSOP II
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
675-1004-2
September 2007
H Y [ B / I ] 3 9 S 2 5 6 [ 4 0 / 8 0 / 1 6 ] 0 F T ( L )
H Y [ B / I ] 3 9 S 2 5 6 [ 4 0 / 8 0 / 1 6 ] 0 F E ( L )
H Y B 3 9 S 2 5 6 [ 4 0 / 8 0 / 1 6 ] 0 F F ( L )
H Y B3 9 S 25 64 07 F E
2 5 6 - M B i t S y n c h r o n o u s D R A M
S D R A M
I n t e r n e t D a t a S h e e t
Rev. 1.42

Related parts for HYB39S256160FE-7

HYB39S256160FE-7 Summary of contents

Page 1

...

Page 2

... We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: techdoc@qimonda.com qag_techdoc_rev400 / 3.2 QAG / 2006-08-07 03292006-TMTK-JFEU HY[B/I]39S256[40/80/16][0/7]F[E/T/F](L) ...

Page 3

Overview This chapter lists all main features of the product family HYB39S256[400/800/160]F[E/T/F](L) and the ordering information. 1.1 Features • Fully Synchronous to Positive Clock Edge • °C Standard Operating Temperature • - °C Industrial ...

Page 4

... Standard Operating Temperature HYB39S256407FE-7 PC133-222 HYB39S256400FF-7 HYB39S256400FE-7 HYB39S256400FFL-7 HYB39S256400FEL-7 HYB39S256800FF-7 HYB39S256800FE-7 HYB39S256800FFL-7 HYB39S256800FEL-7 HYB39S256160FF-7 HYB39S256160FE-7 HYB39S256160FFL-7 HYB39S256160FEL-7 HYB39S256160FF-6 HYB39S256160FE-6 HYB39S256160FFL-6 HYB39S256160FEL-6 Industrial Operating Temperature HYI39S256800FE-7 PC166-333 HYI39S256160FE-7 1) RoHS Compliant Product: Restriction of the use of certain hazardous substances (RoHS) in electrical and electronic equipment as defined in the directive 2002/95/EC issued by the European Parliament and of the Council of 27 January 2003 ...

Page 5

Product Type Speed Grade Standard Operating Temperature HYB39S256400FT-7 PC133-222 HYB39S256400FTL-7 HYB39S256800FT-7 HYB39S256800FTL-7 HYB39S256160FT-7 HYB39S256160FTL-7 HYB39S256160FT-6 Industrial Operating Temperature HYI39S256800FT-7 PC133-222 HYI39S256160FT-7 Note: For product nomenclature see Chapter 6 Rev. 1.42, 2007-09 03292006-TMTK-JFEU HY[B/I]39S256[40/80/16][0/7]F[E/T/F](L) Ordering Information for Lead-Containing Products Description 143MHz ...

Page 6

Configuration This chapter contains the pin configuration table, the TSOP and FBGA package drawing, and the block diagrams for the ×4, ×8, ×16 organization of the SDRAM. 2.1 Pin Description Listed below are the pin configurations sections for the ...

Page 7

Ball No. Name Pin Buffer Type Type Data Signals ×4 Organization 5, 8B DQ0 I/O LVTTL 11, 8D DQ1 I/O LVTTL 44, 2D DQ2 I/O LVTTL 50, 2B DQ3 I/O LVTTL Data Signals ×8 Organization 2, 8A DQ0 I/O LVTTL ...

Page 8

Ball No. Name Pin Buffer Type Type V 7E, 9A, PWR – 3A, 3C, PWR – SSQ 7B 1J, 1A, PWR – Not connected ×4 Organization – ...

Page 9

Package P(G)–TSOPII–54 Listed below are the pin outs of the TSOP package. Rev. 1.42, 2007-09 03292006-TMTK-JFEU HY[B/I]39S256[40/80/16][0/7]F[E/T/F](L) 256-MBit Synchronous DRAM Pinouts P(G)–TSOPII–54 9 Internet Data Sheet FIGURE 1 ...

Page 10

Package PG–TFBGA–54 Listed below are the ball outs of the TFBGA package. Figure 2 “Ballout for ×16 components, TFBGA-54 (top view)” on Page 10 • Figure 3 “Ballout for ×8 components, TFBGA-54 (top view)” on Page 11 • Figure ...

Page 11

Rev. 1.42, 2007-09 03292006-TMTK-JFEU HY[B/I]39S256[40/80/16][0/7]F[E/T/F](L) 256-MBit Synchronous DRAM Ballout for ×8 components, TFBGA-54 (top view) 11 Internet Data Sheet FIGURE 3 ...

Page 12

Rev. 1.42, 2007-09 03292006-TMTK-JFEU HY[B/I]39S256[40/80/16][0/7]F[E/T/F](L) 256-MBit Synchronous DRAM Ballout for ×4 components, TFBGA-54 (top view) 12 Internet Data Sheet FIGURE 4 ...

Page 13

Functional Description This chapter contains the functional description. Operation Device State 3) Bank Active Idle Bank Precharge Any Precharge All Any 3) Write Active 3) Write with Auto pre- Active charge 3) Read Active 3) Read with Auto pre- ...

Page 14

Field Bits Type BL 2 6:4 TM 8:7 WBL 9 12:10 Rev. 1.42, 2007-09 03292006-TMTK-JFEU HY[B/I]39S256[40/80/16][0/7]F[E/T/F](L) Mode Register Definition (BA Description Burst Length Note: All other bit combinations are RESERVED 000 1 B 001 2 B ...

Page 15

Burst Length Starting Column Address FullPage n Notes 1. For a burst length of two, ...

Page 16

Electrical Characteristics This chapter lists the electrical characteristics. 4.1 Operating Conditions This chapter describes the operating conditions. Parameter V Input / Output voltage relative Voltage on supply relative Voltage on ...

Page 17

Parameter Supply Voltage I/O Supply Voltage Input high voltage Input low voltage I Output high voltage ( = – 4.0 mA) OUT I Output low voltage ( = 4.0 mA) OUT Input leakage current, any input (0 V < Output ...

Page 18

Parameter Self Refresh Current (standard components) t Self Refresh Mode, CKE=0.2V, =infinity CK Self Refresh Current (low power components) t Self Refresh Mode, CKE=0.2V, =infinity CK Symbol DD1 RC RC(min) O ...

Page 19

AC Characteristics This chapter lists the AC characteristics. Parameter Clock and Clock Enable Clock Frequency Access Time from Clock Clock High Pulse Width Clock Low Pulse Width Transition time Setup and Hold Times Input Setup Time Input Hold Time ...

Page 20

Parameter Write Cycle Last Data Input to Precharge (Write without Auto Precharge) Last Data Input to Activate(Write with Auto Precharge) DQM Write Mask Latency ° 3.3 ...

Page 21

Package Outlines This chapter contains the package outlines of the products. Notes 1. Drawing according to ISO 8015 2. Dimensions General tolerances +/- 0.15 Rev. 1.42, 2007-09 03292006-TMTK-JFEU HY[B/I]39S256[40/80/16][0/7]F[E/T/F](L) 256-MBit Synchronous DRAM Package Outline P(G)-TSOPII-54 (top ...

Page 22

Notes 1. Drawing according to ISO 8015 2. Dimensions General tolerances +/- 0.15 Rev. 1.42, 2007-09 03292006-TMTK-JFEU HY[B/I]39S256[40/80/16][0/7]F[E/T/F](L) 256-MBit Synchronous DRAM Package Outline P(G)-TFBGA-54 22 Internet Data Sheet FIGURE 7 ...

Page 23

... Product Nomenclature For reference the Qimonda SDRAM component nomenclature is enclosed in this chapter. Example for Field Number 1 2 SDRAM HYB 39 SDRAM HYI 39 Field Description 1 Qimonda Component Prefix 2 Interface Voltage [V] 3 DRAM Technology 4 Component Density [Mbit] 5+6 Number of I/Os 7 Product Variations 8 Die Revision ...

Page 24

List of Figures Figure 1 Pinouts P(G)–TSOPII– ...

Page 25

... Table 9 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Table 10 Input and Output Capacitances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Table 11 IDD Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 I Table 12 Specifications and Conditions Table 13 AC Timing - Absolute Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Table 14 Examples for Nomenclature Fields . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Table 15 Memory Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Rev. 1.42, 2007-09 03292006-TMTK-JFEU HY[B/I]39S256[40/80/16][0/7]F[E/T/F]( 1 Internet Data Sheet 256-MBit Synchronous DRAM ...

Page 26

Table of Contents 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 27

... Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Qimonda Office. Qimonda Components may only be used in life-support devices or systems with the express written approval of Qimonda failure of such components can reasonably be expected to cause the failure of that life-support device or system affect the safety or effectiveness of that device or system ...

Related keywords