TOP242PN Power Integrations, TOP242PN Datasheet - Page 48

IC OFFLINE SWIT OVP UVLO HV 8DIP

TOP242PN

Manufacturer Part Number
TOP242PN
Description
IC OFFLINE SWIT OVP UVLO HV 8DIP
Manufacturer
Power Integrations
Series
TOPSwitch®-GXr
Type
Off Line Switcherr
Datasheet

Specifications of TOP242PN

Output Isolation
Isolated
Frequency Range
66 ~ 132kHz
Voltage - Output
700V
Power (watts)
15W
Operating Temperature
-40°C ~ 150°C
Package / Case
8-DIP (0.300", 7.62mm), 7 Leads
Output Voltage
12 V
Input / Supply Voltage (max)
265 VAC
Input / Supply Voltage (min)
85 VAC
Duty Cycle (max)
83 %
Switching Frequency
132 KHz
Supply Current
1.6 mA
Operating Temperature Range
- 40 C to + 150 C
Mounting Style
Through Hole
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
596-1066-5

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48
.260 (6.60)
.240 (6.10)
.100 (2.54) BSC
.125 (3.18)
.145 (3.68)
TOP242-250
-T-
.032 (.81)
.037 (.94)
Pin 1
.125 (3.18)
.145 (3.68)
-E-
.240 (6.10)
.260 (6.60)
-D-
SEATING
PLANE
O
11/05
-E-
Pin 1
-D-
.014 (.36)
.022 (.56)
.367 (9.32)
.387 (9.83)
D S .004 (.10)
D S .004 (.10)
.100 (2.54) (BSC)
.367 (9.32)
.387 (9.83)
.048 (1.22)
.053 (1.35)
T E D S .010 (.25) M
.048 (1.22)
.053 (1.35)
.137 (3.48)
.009 (.23)
MINIMUM
.137 (3.48)
MINIMUM
.372 (9.45)
.388 (9.86)
E S
.057 (1.45)
.068 (1.73)
.120 (3.05)
.140 (3.56)
.057 (1.45)
.068 (1.73)
MINIMUM
(NOTE 6)
.015 (.38)
(NOTE 5)
.010 (.25)
SMD-8B
DIP-8B
.004 (.10)
.012 (.30)
Notes:
1. Package dimensions conform to JEDEC specification
2. Controlling dimensions are inches. Millimeter sizes are
3. Dimensions shown do not include mold flash or other
4. Pin locations start with Pin 1, and continue counter-clock-
5. Minimum metal to metal spacing at the package body for
6. Lead width measured at package body.
7. Lead spacing measured with the leads constrained to be
Pin 1
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)
package with .300 inch row spacing.
shown in parentheses.
protrusions. Mold flash or protrusions shall not exceed
.006 (.15) on any side.
wise to Pin 8 when viewed from the top. The notch and/or
dimple are aids in locating Pin 1. Pin 6 is omitted.
the omitted lead location is .137 inch (3.48 mm).
perpendicular to plane T.
Solder Pad Dimensions
.004 (.10)
.046 .060
.008 (.20)
.015 (.38)
.086
.300 (7.62) BSC
.186
.036 (0.91)
.044 (1.12)
.300 (7.62)
.390 (9.91)
(NOTE 7)
.286
.060 .046
.080
.420
0 -
°
8
Notes:
1. Controlling dimensions are
2. Dimensions shown do not
3. Pin locations start with Pin 1,
4. Minimum metal to metal
5. Lead width measured at
6. D and E are referenced
°
inches. Millimeter sizes are
shown in parentheses.
include mold flash or other
protrusions. Mold flash or
protrusions shall not exceed
.006 (.15) on any side.
and continue counter-clock-
wise to Pin 8 when viewed
from the top. Pin 6 is omitted.
spacing at the package body
for the omitted lead location
is .137 inch (3.48 mm).
package body.
datums on the package
body.
PI-2551-121504
PI-2546-121504
G08B
P08B

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