TOP258PN Power Integrations, TOP258PN Datasheet - Page 44

IC OFFLINE SWIT PROG OVP 8DIP

TOP258PN

Manufacturer Part Number
TOP258PN
Description
IC OFFLINE SWIT PROG OVP 8DIP
Manufacturer
Power Integrations
Series
TOPSwitch®-HXr
Type
Off Line Switcherr
Datasheet

Specifications of TOP258PN

Output Isolation
Isolated
Frequency Range
119 ~ 145kHz
Voltage - Output
700V
Power (watts)
77W
Operating Temperature
-40°C ~ 150°C
Package / Case
8-DIP (0.300", 7.62mm), 7 Leads
Output Voltage
700 V
Input / Supply Voltage (max)
9 V
Input / Supply Voltage (min)
- 0.3 V
Duty Cycle (max)
78 %
Switching Frequency
132 KHz
Operating Temperature Range
- 40 C to + 150 C
Mounting Style
SMD/SMT
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 40 C
Output Current
6.88 A
Output Power
48 W
For Use With
596-1193 - KIT REF DESIGN TOP HX FOR TOP258
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
596-1189-5
Rev. F 01/09
SEATING
PLANE
44
.200 (5.08) Max
-T-
.100 (2.54) BSC
.070 (1.78) BSC
.125 (3.18)
.145 (3.68)
.240 (6.10)
.260 (6.60)
.020 (.51) Min
SEATING
PLANE
-E-
Pin 1
-D-
TOP252-262
.040 (1.02)
.030 (.76)
10
1
.014 (.36)
.022 (.56)
D S .004 (.10)
.367 (9.32)
.387 (9.83)
.367 (9.32)
.387 (9.83)
.048 (1.22)
.053 (1.35)
T E D S .010 (.25) M
6
5
.014 (.36)
.022 (.56)
.125 (3.18)
.145 (3.68)
.057 (1.45)
.068 (1.73)
.240 (6.10)
.260 (6.60)
.120 (3.05)
.140 (3.56)
.137 (3.48)
.120 (3.05)
.140 (3.56)
MINIMUM
MINIMUM
(NOTE 6)
.015 (.38)
-D-
-E-
.010 (.25) M
-F-
SDIP-10C
DIP-8C
F D E
Notes:
1. Package dimensions conform to JEDEC specification
2. Controlling dimensions are inches. Millimeter sizes are
3. Dimensions shown do not include mold flash or other
4. Pin locations start with Pin 1, and continue counter-clock-
5. Minimum metal to metal spacing at the package body for
6. Lead width measured at package body.
7. Lead spacing measured with the leads constrained to be
Notes:
1. Package dimensions conform to JEDEC specification
2. Controlling dimensions are inches. Millimeter sizes are
3. Dimensions shown do not include mold flash or other
4. D, E and F are reference datums.
5. Dimensioning and tolerancing conform to ASME Y14.5M-1994.
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)
package with .300 inch row spacing.
shown in parentheses.
protrusions. Mold flash or protrusions shall not exceed
.006 (.15) on any side.
wise to Pin 8 when viewed from the top. The notch and/or
dimple are aids in locating Pin 1. Pin 3 is omitted.
the omitted lead location is .137 inch (3.48 mm).
perpendicular to plane T.
MS-019.
shown in parentheses.
protrusions. Mold flash or protrusions shall not exceed
.006 (.15) on any side.
.008 (.20)
.015 (.38)
.300 (7.62) BSC
.300 (7.62)
.390 (9.91)
(NOTE 7)
.008 (.20)
.015 (.38)
.300 (7.62)
.340 (8.64
.300 (7.62)
.390 (9.91)
.300 BSC
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PI-3933-100504
PI-4648-041107
P08C
P10C

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