IC OFFLINE SWIT PROG OVP 8DIP

TOP258PN

Manufacturer Part NumberTOP258PN
DescriptionIC OFFLINE SWIT PROG OVP 8DIP
ManufacturerPower Integrations
SeriesTOPSwitch®-HX
TypeOff Line Switcher
TOP258PN datasheet
 


Specifications of TOP258PN

Output IsolationIsolatedFrequency Range119 ~ 145kHz
Voltage - Output700VPower (watts)77W
Operating Temperature-40°C ~ 150°CPackage / Case8-DIP (0.300", 7.62mm), 7 Leads
Output Voltage700 VInput / Supply Voltage (max)9 V
Input / Supply Voltage (min)- 0.3 VDuty Cycle (max)78 %
Switching Frequency132 KHzOperating Temperature Range- 40 C to + 150 C
Mounting StyleSMD/SMTMaximum Operating Temperature+ 150 C
Minimum Operating Temperature- 40 COutput Current6.88 A
Output Power48 WFor Use With596-1193 - KIT REF DESIGN TOP HX FOR TOP258
Lead Free Status / RoHS StatusLead free / RoHS CompliantOther names596-1189-5
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TOP252-262
D S .004 (.10)
-E-
.240 (6.10)
.260 (6.60)
Pin 1
.367 (9.32)
-D-
.387 (9.83)
.125 (3.18)
.145 (3.68)
-T-
SEATING
PLANE
.100 (2.54) BSC
.048 (1.22)
.053 (1.35)
.014 (.36)
T E D S .010 (.25) M
.022 (.56)
10
1
.367 (9.32)
.387 (9.83)
.200 (5.08) Max
SEATING
PLANE
.020 (.51) Min
.070 (1.78) BSC
.030 (.76)
.040 (1.02)
44
Rev. F 01/09
DIP-8C
Notes:
1. Package dimensions conform to JEDEC specification
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)
package with .300 inch row spacing.
2. Controlling dimensions are inches. Millimeter sizes are
shown in parentheses.
3. Dimensions shown do not include mold flash or other
protrusions. Mold flash or protrusions shall not exceed
.006 (.15) on any side.
4. Pin locations start with Pin 1, and continue counter-clock-
wise to Pin 8 when viewed from the top. The notch and/or
dimple are aids in locating Pin 1. Pin 3 is omitted.
5. Minimum metal to metal spacing at the package body for
the omitted lead location is .137 inch (3.48 mm).
6. Lead width measured at package body.
7. Lead spacing measured with the leads constrained to be
.057 (1.45)
perpendicular to plane T.
.068 (1.73)
(NOTE 6)
.015 (.38)
MINIMUM
.008 (.20)
.120 (3.05)
.015 (.38)
.140 (3.56)
.300 (7.62) BSC
.137 (3.48)
MINIMUM
SDIP-10C
Notes:
6
-E-
1. Package dimensions conform to JEDEC specification
MS-019.
2. Controlling dimensions are inches. Millimeter sizes are
shown in parentheses.
3. Dimensions shown do not include mold flash or other
.240 (6.10)
protrusions. Mold flash or protrusions shall not exceed
.260 (6.60)
.006 (.15) on any side.
4. D, E and F are reference datums.
5. Dimensioning and tolerancing conform to ASME Y14.5M-1994.
5
-D-
.125 (3.18)
.145 (3.68)
-F-
.120 (3.05)
.140 (3.56)
.014 (.36)
.010 (.25) M
F D E
.022 (.56)
(NOTE 7)
.300 (7.62)
.390 (9.91)
PI-3933-100504
.300 (7.62)
.340 (8.64
.008 (.20)
.015 (.38)
.300 BSC
.300 (7.62)
.390 (9.91)
PI-4648-041107
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