LNK306DN-TL Power Integrations, LNK306DN-TL Datasheet - Page 15

IC OFFLINE SWIT OCP 8SOIC

LNK306DN-TL

Manufacturer Part Number
LNK306DN-TL
Description
IC OFFLINE SWIT OCP 8SOIC
Manufacturer
Power Integrations
Series
LinkSwitch®-TNr
Type
Off Line Switcherr
Datasheet

Specifications of LNK306DN-TL

Output Isolation
Non-Isolated
Frequency Range
62 ~ 70kHz
Voltage - Output
700V
Power (watts)
12mW
Operating Temperature
-40°C ~ 150°C
Package / Case
8-SOIC (0.154", 3.90mm Width) 7 leads
Output Voltage
12 VDC
Input / Supply Voltage (max)
265 VAC
Input / Supply Voltage (min)
85 VAC
Duty Cycle (max)
72 %
Switching Frequency
66 kHz
Supply Current
250 uA
Operating Temperature Range
- 40 C to + 150 C
Mounting Style
SMD/SMT
For Use With
596-1127 - KIT REF DESIGN LED LINKSWITCH TN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
596-1131-2

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LNK306DN-TL
Manufacturer:
PowerInt
Quantity:
5 000
Part Number:
LNK306DN-TL
Manufacturer:
POWER
Quantity:
20 000
Part Number:
LNK306DN-TL
Manufacturer:
POWER
Quantity:
3 413
Part Number:
LNK306DN-TL
0
.240 (6.10)
.260 (6.60)
.100 (2.54) BSC
.125 (3.18)
.145 (3.68)
-T-
.032 (.81)
.037 (.94)
Pin 1
-E-
.125 (3.18)
.145 (3.68)
-D-
.240 (6.10)
.260 (6.60)
SEATING
PLANE
Pin 1
-E-
-D-
.014 (.36)
.022 (.56)
.367 (9.32)
.387 (9.83)
D S .004 (.10)
D S .004 (.10)
.100 (2.54) (BSC)
.367 (9.32)
.387 (9.83)
.048 (1.22)
.053 (1.35)
T E D S .010 (.25) M
.048 (1.22)
.053 (1.35)
.137 (3.48)
.009 (.23)
MINIMUM
.137 (3.48)
MINIMUM
.372 (9.45)
.388 (9.86)
E S
.120 (3.05)
.140 (3.56)
.057 (1.45)
.068 (1.73)
.057 (1.45)
.068 (1.73)
MINIMUM
(NOTE 6)
.015 (.38)
(NOTE 5)
.010 (.25)
SMD-8B
DIP-8B
.004 (.10)
.012 (.30)
Notes:
1. Package dimensions conform to JEDEC specification
2. Controlling dimensions are inches. Millimeter sizes are
3. Dimensions shown do not include mold flash or other
4. Pin locations start with Pin 1, and continue counter-clock-
5. Minimum metal to metal spacing at the package body for
6. Lead width measured at package body.
7. Lead spacing measured with the leads constrained to be
Pin 1
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)
package with .300 inch row spacing.
shown in parentheses.
protrusions. Mold flash or protrusions shall not exceed
.006 (.15) on any side.
wise to Pin 8 when viewed from the top. The notch and/or
dimple are aids in locating Pin 1. Pin 6 is omitted.
the omitted lead location is .137 inch (3.48 mm).
perpendicular to plane T.
Solder Pad Dimensions
.004 (.10)
.046 .060
.008 (.20)
.015 (.38)
.086
.300 (7.62) BSC
.186
.036 (0.91)
.044 (1.12)
.300 (7.62)
.390 (9.91)
.286
(NOTE 7)
.060 .046
.080
.420
LNK302/304-306
0 -
°
8
Notes:
1. Controlling dimensions are
2. Dimensions shown do not
3. Pin locations start with Pin 1,
4. Minimum metal to metal
5. Lead width measured at
6. D and E are referenced
°
inches. Millimeter sizes are
shown in parentheses.
include mold flash or other
protrusions. Mold flash or
protrusions shall not exceed
.006 (.15) on any side.
and continue counter-clock-
wise to Pin 8 when viewed
from the top. Pin 6 is omitted.
spacing at the package body
for the omitted lead location
is .137 inch (3.48 mm).
package body.
datums on the package
body.
PI-2546-121504
PI-2551-121504
G08B
P08B
Rev. I 11/08
2-15
15

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