MCP1407-E/SN

Manufacturer Part NumberMCP1407-E/SN
DescriptionIC MOSFET DVR 6A 8SOIC
ManufacturerMicrochip Technology
TypeHigh-Speed Power MOSFET Driver
MCP1407-E/SN datasheet
 


Specifications of MCP1407-E/SN

Number Of Outputs1Package / Case8-SOIC (3.9mm Width)
ConfigurationLow-SideInput TypeNon-Inverting
Delay Time40nsCurrent - Peak6A
Number Of Configurations1Voltage - Supply4.5 V ~ 18 V
Operating Temperature-40°C ~ 125°CMounting TypeSurface Mount
Rise Time30 nsFall Time30 ns
Supply Voltage (min)4.5 VSupply Current0.25 mA
Maximum Operating Temperature+ 125 CMounting StyleSMD/SMT
Minimum Operating Temperature- 40 CNumber Of Drivers1
Output Current6 AOutput Voltage+/- 0.025 V
Lead Free Status / RoHS StatusLead free / RoHS CompliantHigh Side Voltage - Max (bootstrap)-
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6A High-Speed Power MOSFET Drivers
Features
• High Peak Output Current: 6.0A (typ.)
• Low Shoot-Through/Cross-Conduction Current in
Output Stage
• Wide Input Supply Voltage Operating Range:
- 4.5V to 18V
• High Capacitive Load Drive Capability:
- 2500 pF in 20 ns
- 6800 pF in 40 ns
• Short Delay Times: 40 ns (typ.)
• Matched Rise/Fall Times
• Low Supply Current:
- With Logic ‘1’ Input – 130 µA (typ.)
- With Logic ‘0’ Input – 35 µA (typ.)
• Latch-Up Protected: Will Withstand 1.5A Reverse
Current
• Logic Input Will Withstand Negative Swing Up To
5V
• Pin compatible with the TC4420/TC4429 devices
• Space-saving 8-Pin SOIC, PDIP and 8-Pin 6x5
DFN Packages
Applications
• Switch Mode Power Supplies
• Pulse Transformer Drive
• Line Drivers
• Motor and Solenoid Drive
Package Types
8-Pin PDIP/SOIC
V
1
V
8
V
DD
DD
INPUT
2
OUT
7
OUT
NC
3
6
OUT
OUT
4
5
GND
GND
GND
Note 1: Duplicate pins must both be connected for proper operation.
2: Exposed pad of the DFN package is electrically isolated.
© 2006 Microchip Technology Inc.
MCP1406/07
General Description
The
MCP1406/07
buffers/MOSFET drivers that feature a single-output
with 6A peak drive current capability, low shoot-through
current, matched rise/fall times and propagation delay
times. These devices are pin-compatible and are
improved versions of the TC4420/TC4429 MOSFET
drivers.
The MCP1406/07 MOSFET drivers can easily charge
and discharge 2500 pF gate capacitance in under
20 ns, provide low enough impedances in both the on
and off states to ensure the MOSFETs intended state
will not be affected, even by large transients. The input
to the MCP1406/07 may be driven directly from either
TTL or CMOS (3V to 18V).
These devices are highly latch-up resistant under any
conditions within their power and voltage ratings. They
are not subject to damage when up to 5V of noise
spiking (of either polarity) occurs on the ground pin. All
terminals are fully protect against Electrostatic
Discharge (ESD) up to 4 kV.
The MCP1406/07 single-output 6A MOSFET driver
family is offered in both surface-mount and pin-
through-hole packages with a -40°C to +125°C
temperature rating, making it useful in any wide
temperature range application.
8-Pin 6x5 DFN
V
V
DD
DD
INPUT
OUT
NC
OUT
GND
GND
devices
are
a
family
5-Pin TO-220
Tab is
Common
to V
DD
V
DD
DD
OUT
1 2 3 4 5
OUT
GND
DS22019A-page 1
of

MCP1407-E/SN Summary of contents

  • Page 1

    ... GND GND GND Note 1: Duplicate pins must both be connected for proper operation. 2: Exposed pad of the DFN package is electrically isolated. © 2006 Microchip Technology Inc. MCP1406/07 General Description The MCP1406/07 buffers/MOSFET drivers that feature a single-output with 6A peak drive current capability, low shoot-through current, matched rise/fall times and propagation delay times ...

  • Page 2

    ... MCP1406/07 (1) Functional Block Diagram Input Effective Input GND Note 1: Unused inputs should be grounded. DS22019A-page 2 Inverting 130 µA 300 mV Non-inverting 4.7V MCP1406 Inverting MCP1407 Non-inverting V DD Output Output © 2006 Microchip Technology Inc. ...

  • Page 3

    ... Tested during characterization, not production tested. 3: Valid for AT and MF packages only. T © 2006 Microchip Technology Inc. † Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended ...

  • Page 4

    ... OUT DD Figure 4-1, Figure 4 2500 pF L Figure 4-1, Figure 4 2500 pF L Figure 4-1, Figure 4-2 Figure 4-1, Figure 4 ≤ 18V. DD Units Conditions °C °C °C °C/W Typical four-layer board with vias to ground plane °C/W °C/W °C/W © 2006 Microchip Technology Inc. ...

  • Page 5

    ... Capacitive Load (pF) FIGURE 2-2: Rise Time vs. Capacitive Load 18V FALL -40 -25 - 110 125 o Temperature ( C) FIGURE 2-3: Rise and Fall Times vs. Temperature. © 2006 Microchip Technology Inc. <= 18V 6,800 100 FIGURE 2-4: Voltage 15V 10000 100 FIGURE 2-5: Load ...

  • Page 6

    ... DD INPUT = 1 1.8 1.7 1.6 1.5 1.4 1.3 1.2 INPUT = 0 1 -40 -25 -10 5 FIGURE 2-12: Temperature. = 18V Input = High Input = Low 110 125 o Temperature ( C) Quiescent Current vs Supply Voltage (V) Input Threshold vs. Supply 110 125 o Temperature ( C) Input Threshold vs. © 2006 Microchip Technology Inc. ...

  • Page 7

    ... FIGURE 2-14: Supply Current vs. Capacitive Load. 100 100 kHz kHz 50 40 200 kHz 30 500 kHz 100 1000 Capacitive Load (pF) FIGURE 2-15: Supply Current vs. Capacitive Load. © 2006 Microchip Technology Inc. <= 18V. DD 120 MHz 100 10000 FIGURE 2-16: Frequency MHz 60 50 kHz ...

  • Page 8

    ... Typical Performance Curves (Continued) Note: Unless otherwise indicated +25°C with 4.5V < 2.5V (MCP1407 +125 + Supply Voltage (V) FIGURE 2-19: Output Resistance (Output High) vs. Supply Voltage (MCP1407 2.5V (MCP1406 +125 + Supply Voltage (V) FIGURE 2-20: Output Resistance (Output Low) vs. Supply Voltage. DS22019A-page 8 <= 18V 1.E- (MCP1406) ...

  • Page 9

    ... The output is a CMOS push-pull output that is capable of sourcing peak currents output impedance ensures the gate of the external MOSFET will stay in the intended state even during large transients. These output also has a reverse current latch-up rating of 1.5A. © 2006 Microchip Technology Inc. (1) Symbol V Supply Input DD INPUT ...

  • Page 10

    ... PCB trace loop area and inductance should be minimized by the use of a ground plane or ground trace located under the MOSFET gate drive signals, separate analog and power grounds, and local driver decoupling 18V DD 0.1 µF 1 µF Ceramic Output C = 2500 pF L MCP1407 90% 90% 90 10% 10% Non-Inverting Driver Timing and GND. A 1.0 µ ...

  • Page 11

    ... Where Switching frequency C = Total load capacitance MOSFET driver supply voltage DD © 2006 Microchip Technology Inc. , 4.5.2 QUIESCENT POWER DISSIPATION DD The power dissipation associated with the quiescent current draw depends upon the state of the input pin. The MCP1406/07 devices have a quiescent current draw when the input is high of 0 ...

  • Page 12

    ... DS22019A-page 12 Example MCP1406 EAT 0644256 : Example MCP1406 E/MF 0644 256 Example: MCP1407 E/P^^256 e 3 0644 Example: MCP1406E SN^^0644 e 3 256 ) e 3 © 2006 Microchip Technology Inc. ...

  • Page 13

    ... Lead Thickness Lead Width Mold Draft Angle * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254 mm) per side. JEDEC equivalent: TO-220 Drawing No. C04-036 © 2006 Microchip Technology Inc ØP α (5° ...

  • Page 14

    ... A1 0.00 0.20 REF A3 D 5.00 BSC E 6.00 BSC D2 4.00 3.90 E2 2.30 2.20 0.40 b 0.35 0.60 L 0.50 — K 0.20 Microchip Technology Drawing No. C04–122, Sept. 8, 2006 NOTE MAX 1.00 0.05 4.10 2.40 0.48 0.75 — © 2006 Microchip Technology Inc. ...

  • Page 15

    ... Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 © 2006 Microchip Technology Inc INCHES* ...

  • Page 16

    ... A2 NOM MAX 8 1.27 1.55 1.75 1.42 1.55 0.18 0.25 6.02 6.20 3.91 3.99 4.90 5.00 0.38 0.51 0.62 0. 0.23 0.25 0.42 0. © 2006 Microchip Technology Inc. ...

  • Page 17

    ... APPENDIX A: REVISION HISTORY Revision A (December 2006) • Original Release of this Document. © 2006 Microchip Technology Inc. MCP1406/07 DS22019A-page 17 ...

  • Page 18

    ... MCP1406/07 NOTES: DS22019A-page 18 © 2006 Microchip Technology Inc. ...

  • Page 19

    ... SOIC pkg . MCP1407-E/MF: 6A High-Speed MOSFET Driver, Non-Inverting 8LD DFN package. MCP1407-E/AT: 6A High-Speed MOSFET Driver, Non-Inverting 5LD TO-220 package . MCP1407-E/SN: 6A High-Speed MOSFET Driver, Non-Inverting 8LD SOIC package . MCP1407-E/P: 6A High-Speed MOSFET Driver, Non-Inverting 8LD PDIP package . MCP1407T-E/MF: Tape and Reel, 6A High-Speed MOSFET Driver, Non-Inverting, 8LD DFN pkg ...

  • Page 20

    ... MCP1406/07 NOTES: DS22019A-page 20 © 2006 Microchip Technology Inc. ...

  • Page 21

    ... Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. ...

  • Page 22

    ... Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 © 2006 Microchip Technology Inc. EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 ...