HCPL-316J-000E Avago Technologies US Inc., HCPL-316J-000E Datasheet - Page 32

• Manufacturer Part Number: HCPL-316J-000E
• Description: OPTOCOUPLER GATE DRV 2A 16-SOIC
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-316J-000E

• Configuration: High-Side
• Package / Case: 16-SOIC (0.300", 7.5mm Width)
• Input Type: Differential
• Delay Time: 300ns
• Current - Peak: 2.5A
• Number Of Configurations: 1
• Number Of Outputs: 1
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 100°C
• Mounting Type: Surface Mount
• Fall Time: 0.1 us
• Rise Time: 0.1 us
• Isolation Voltage: 6000 Vrms
• Maximum Power Dissipation: 1200 mW
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• No. Of Channels: 1
• Optocoupler Output Type: Gate Drive
• Input Current: 22mA
• Output Voltage: 30V
• Opto Case Style: SOIC
• No. Of Pins: 16
• Common Mode Ratio: 15 KV/uS
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• High Side Voltage - Max (bootstrap): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 516-1478-5

Printed Circuit Board Layout Considerations
Adequate spacing should always be maintained be-
tween the high voltage isolated circuitry and any input
referenced circuitry. Care must be taken to provide the
same minimum spacing between two adjacent high-side
isolated regions of the printed circuit board. Insufficient
spacing will reduce the effective isolation and increase
parasitic coupling that will degrade CMR performance.
The placement and routing of supply bypass capacitors
requires special attention. During switch ing transients,
the majority of the gate charge is supplied by the bypass
capacitors. Maintaining short bypass capacitor trace
lengths will ensure low supply ripple and clean switch-
ing waveforms.
Figure 79. Recommended layout(s).
32
Ground Plane connections are necessary for pin 4 (GND1)
and pins 9 and 10 (V
power dissipation as the HCPL-316J is designed to dissi-
pate the majority of heat generated through these pins.
Actual power dissipation will depend on the application
environment (PCB layout, air flow, part placement, etc.)
See the Thermal Model section for details on how to es-
timate junction temperature.
The layout examples below have good supply bypassing
and thermal properties, exhibit small PCB footprints, and
have easily connected signal and supply lines. The four
examples cover single sided and double sided compo-
nent placement, as well as minimal and improved per-
formance circuits.
EE
) in order to achieve maximum