MC33151PG ON Semiconductor, MC33151PG Datasheet

IC MOSFET DRIVER DUAL HS 8-DIP

MC33151PG

Manufacturer Part Number
MC33151PG
Description
IC MOSFET DRIVER DUAL HS 8-DIP
Manufacturer
ON Semiconductor
Type
High Speedr
Datasheet

Specifications of MC33151PG

Configuration
Low-Side
Input Type
Inverting
Delay Time
35ns
Current - Peak
1.5A
Number Of Configurations
2
Number Of Outputs
2
Voltage - Supply
6.5 V ~ 18 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Through Hole
Package / Case
8-DIP (0.300", 7.62mm)
Rise Time
31 ns
Fall Time
32 ns
Supply Voltage (min)
6.5 V
Supply Current
10.5 mA
Maximum Power Dissipation
1000 mW
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 40 C
Number Of Drivers
2
Driver Configuration
Inverting
Driver Type
High Speed
Input Logic Level
CMOS/LSTTL
Propagation Delay Time
100ns
Operating Supply Voltage (max)
18V
Peak Output Current
1.5A
Power Dissipation
1W
Operating Supply Voltage (min)
6.5V
Operating Supply Voltage (typ)
12V
Turn Off Delay Time
100fs
Turn On Delay Time (max)
100ps
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Through Hole
Pin Count
8
Package Type
PDIP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
High Side Voltage - Max (bootstrap)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
MC33151PG
MC33151PGOS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC33151PG
Manufacturer:
TOSHIBA
Quantity:
32 000
Part Number:
MC33151PG
Manufacturer:
ON/安森美
Quantity:
20 000
MC34151, MC33151
High Speed Dual
MOSFET Drivers
specifically designed for applications that require low current digital
circuitry to drive large capacitive loads with high slew rates. These
devices feature low input current making them CMOS and LSTTL
logic compatible, input hysteresis for fast output switching that is
independent of input transition time, and two high current totem pole
outputs ideally suited for driving power MOSFETs. Also included is
an undervoltage lockout with hysteresis to prevent erratic system
operation at low supply voltages.
converters, capacitor charge pump voltage doublers/inverters, and
motor controllers.
packages.
Features
© Semiconductor Components Industries, LLC, 2011
March, 2011 − Rev. 7
The MC34151/MC33151 are dual inverting high speed drivers
Typical applications include switching power supplies, dc to dc
These devices are available in dual−in−line and surface mount
Control ICs
Two Independent Channels with 1.5 A Totem Pole Output
Output Rise and Fall Times of 15 ns with 1000 pF Load
CMOS/LSTTL Compatible Inputs with Hysteresis
Undervoltage Lockout with Hysteresis
Low Standby Current
Efficient High Frequency Operation
Enhanced System Performance with Common Switching Regulator
Pin Out Equivalent to DS0026 and MMH0026
These are Pb−Free and Halide−Free Devices
Logic Input A
Logic Input B
2
4
Figure 1. Representative Block Diagram
+
+
V
CC
+
+
6
5.7V
+
-
GND
3
+
+
Drive Output A
7
Drive Output B
5
1
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
8
8
(Note: Microdot may be in either location)
1
Logic Input A
Logic Input B
1
ORDERING INFORMATION
CASE 751
x
A
WL, L
YY, Y
WW, W = Work Week
G or G
D SUFFIX
GND
SOIC−8
N.C.
PIN CONNECTIONS
http://onsemi.com
1
2
3
4
CASE 626
(Top View)
P SUFFIX
= 3 or 4
= Assembly Location
= Wafer Lot
= Year
= Pb−Free Package
PDIP−8
8
1
Publication Order Number:
MC3x151
ALYWG
3x151
8 N.C.
7 Drive Output A
6 V
5 Drive Output B
G
8
1
CC
DIAGRAMS
MARKING
MC3x151P
8
1
MC34151/D
MC33151V
YYWWG
ALYWG
3151V
AWL
G

Related parts for MC33151PG

MC33151PG Summary of contents

Page 1

MC34151, MC33151 High Speed Dual MOSFET Drivers The MC34151/MC33151 are dual inverting high speed drivers specifically designed for applications that require low current digital circuitry to drive large capacitive loads with high slew rates. These devices feature low input current ...

Page 2

MAXIMUM RATINGS Rating Power Supply Voltage Logic Inputs (Note 1) Drive Outputs (Note 2) Totem Pole Sink or Source Current Diode Clamp Current (Drive Output to V Power Dissipation and Thermal Characteristics D Suffix SOIC−8 Package Case 751 Maximum Power ...

Page 3

ELECTRICAL CHARACTERISTICS ambient temperature range that applies [Note 3], unless otherwise noted.) Characteristics LOGIC INPUTS Input Threshold Voltage − Input Current − High State ( Input Current − Low State ( DRIVE ...

Page 4

V 4 Logic Input Figure 2. Switching Characteristics Test Circuit 2 2 25°C A 1.6 1.2 0.8 0.4 0 ...

Page 5

Logic Input Drive Output 10% 50 ns/DIV Figure 8. Propagation Delay 0 Source Saturation V CC (Load to Ground) -1.0 -2.0 -3.0 3.0 2.0 1.0 Sink Saturation (Load 0.2 0.4 0.6 0.8 I ...

Page 6

5 25° 0.1 1 OUTPUT LOAD CAPACITANCE (nF) L Figure 14. Drive Output Rise ...

Page 7

NPN pullup during the negative output transient, power dissipation at high frequencies can become excessive. Figures 20, 21, and 22 show a method of using external Schottky diode clamps to reduce driver power dissipation. Undervoltage Lockout An undervoltage lockout ...

Page 8

High frequency printed circuit layout techniques are imperative to prevent excessive output ringing and overshoot. Do not attempt to construct the driver circuit on wire−wrap or plug−in prototype boards. When driving large capacitive loads, the printed circuit board must contain ...

Page 9

g(on) R g(off) In noise sensitive applications, both conducted and radiated EMI can be reduced significantly by controlling the MOSFET's turn-on and turn-off times. Figure 23. Controlled MOSFET Drive 4.7 0.1 + ...

Page 10

... ORDERING INFORMATION Device MC34151DG MC34151DR2G MC34151PG MC33151DG MC33151DR2G MC33151PG MC33151VDR2G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Package SOIC−8 (Pb−Free) SOIC−8 (Pb−Free) PDIP−8 (Pb− ...

Page 11

NOTE 5 F TOP VIEW e 0.010 SIDE VIEW PACKAGE DIMENSIONS PDIP−8 P SUFFIX CASE 626−05 ISSUE M NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME ...

Page 12

... *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “ ...

Related keywords