FAN7390M1X Fairchild Semiconductor, FAN7390M1X Datasheet - Page 5

• Manufacturer Part Number: FAN7390M1X
• Description: IC DRIVER GATE HI/LO SIDE 14-SOP
• Manufacturer: Fairchild Semiconductor
• Type: High Side/Low Sider

Specifications of FAN7390M1X

• Configuration: High and Low Side, Synchronous
• Input Type: Non-Inverting
• Delay Time: 140ns
• Current - Peak: 4.5A
• Number Of Configurations: 1
• Number Of Outputs: 2
• High Side Voltage - Max (bootstrap): 600V
• Voltage - Supply: 10 V ~ 22 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• Product: Driver ICs - Various
• Rise Time: 50 ns
• Fall Time: 50 ns
• Supply Voltage (min): 10 V
• Maximum Power Dissipation: 1000 mW
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Bridge Type: Half Bridge
• Minimum Operating Temperature: - 40 C
• Number Of Drivers: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: FAN7390M1XTR

© 2008 Fairchild Semiconductor Corporation
FAN7390 Rev. 1.0.3
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. T
Notes:
1. Mounted on 76.2 x 114.3 x 1.6mm PCB (FR-4 glass epoxy material).
2. Refer to the following standards:
3. Do not exceed P
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
JESD51-2: Integral circuits thermal test method environmental conditions - natural convection
JESD51-3: Low effective thermal conductivity test board for leaded surface mount packages
Symbol
Symbol
P
dV
D
T
V
V
V
V
V
V
V
V
V
(1, 2, 3)
θ
V
V
V
V
T
T
STG
HO
DD
HO
DD
LO
LO
SS
S
JA
IN
IN
A
B
S
S
B
J
/dt
High-Side Floating Supply Voltage
High-Side Floating Supply Offset Voltage
High-Side Output Voltage
Low-Side and Logic Supply Voltage
Low-Side Output Voltage
Logic Input Voltage (HIN and LIN)
High-Side Floating Supply Offset Voltage
High-Side Floating Supply Voltage
High-Side Floating Output Voltage HO
Low-Side and Logic Fixed Supply Voltage
Low-Side Output Voltage LO
Logic Input Voltage (HIN and LIN)
Logic Ground (FAN7390M1 only)
Allowable Offset Voltage Slew Rate
Power Dissipation
Thermal Resistance, Junction-to-Ambient
Junction Temperature
Storage Temperature
Operating Ambient Temperature
D
under any circumstances.
Characteristics
Parameter
A
=25°C, unless otherwise specified.
5
14-SOIC
14-SOIC
V
V
V
8-SOP
8-SOP
V
8-DIP
8-DIP
Min.
B
SS
DD
-0.3
-0.3
-0.3
S
-25.0
-0.3
-0.3
-25
V
6-V
COM
Min.
V
S
-40
V
10
+10
SS
S
DD
V
V
V
V
V
Max.
625.0
DD
DD
DD
0.625
+150
+150
25.0
1.25
B
B
100
200
110
1.0
50
+0.3
+0.3
+0.3
+0.3
+0.3
V
Max.
+125
V
V
600
S
V
22
+22
DD
DD
B
www.fairchildsemi.com
°C/W
Unit
V/ns
°C
°C
Unit
W
V
V
V
V
V
V
V
°C
V
V
V
V
V
V