FAN73901MX Fairchild Semiconductor, FAN73901MX Datasheet - Page 4

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FAN73901MX

Manufacturer Part Number
FAN73901MX
Description
IC GATE DRIVER HI/LOW SIDE 8SOIC
Manufacturer
Fairchild Semiconductor
Type
High and Low Side Driverr
Datasheet

Specifications of FAN73901MX

Configuration
High and Low Side, Synchronous
Input Type
Non-Inverting
Delay Time
140ns
Current - Peak
2.5A
Number Of Configurations
1
Number Of Outputs
2
High Side Voltage - Max (bootstrap)
600V
Voltage - Supply
10 V ~ 20 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Product
Half-Bridge Drivers
Rise Time
50 ns
Fall Time
45 ns
Supply Voltage (max)
20 V
Supply Voltage (min)
10 V
Supply Current
110 uA
Maximum Power Dissipation
0.625 W
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Bridge Type
Half Bridge
Maximum Turn-off Delay Time
200 ns
Maximum Turn-on Delay Time
200 ns
Minimum Operating Temperature
- 40 C
Number Of Drivers
1
Output Current
2.5 A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
FAN73901MX
Manufacturer:
FSC
Quantity:
2 100
Part Number:
FAN73901MX
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
Company:
Part Number:
FAN73901MX
Quantity:
5 000
© 2008 Fairchild Semiconductor Corporation
FAN73901 • Rev. 1.0.0
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. T
Notes:
1. Mounted on 76.2 x 114.3 x 1.6mm PCB (FR-4 glass epoxy material).
2. Refer to the following standards:
3. Do not exceed P
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
JESD51-2: Integral circuits thermal test method environmental conditions - natural convection
JESD51-3: Low effective thermal conductivity test board for leaded surface mount packages
Symbol
Symbol
dV
T
V
V
V
V
V
V
V
θ
V
V
V
P
V
V
T
T
STG
HO
DD
HO
DD
LO
S
JA
LO
IN
IN
A
S
B
D
J
B
S
/dt
High-Side Floating Supply Voltage
High-Side Floating Supply Offset Voltage
High-Side Output Voltage
Low-Side and Logic Supply Voltage
Low-Side Output Voltage
Logic Input Voltage (HIN and LIN)
High-Side Floating Supply Offset Voltage
High-Side Floating Supply Voltage
High-Side Floating Output Voltage HO
Low-Side and Logic Fixed Supply Voltage
Low-Side Output Voltage LO
Logic Input Voltage (HIN and LIN)
Allowable Offset Voltage Slew Rate
Power Dissipation
Thermal Resistance, Junction-to-Ambient
Junction Temperature
Storage Temperature
Operating Ambient Temperature
D
under any circumstances.
Characteristics
(1)(2)(3)
Parameter
A
=25°C, unless otherwise specified.
4
V
V
6-V
V
COM
COM
Min.
Min.
-0.3
-0.3
-0.3
-0.3
S
S
-40
B
V
10
-0.3
+10
-25
S
DD
V
V
V
V
V
625.0
0.625
Max.
DD
DD
Max.
+150
+150
+125
25.0
B
B
V
V
200
600
S
50
V
20
+0.3
+0.3
+20
DD
DD
+0.3
+0.3
B
www.fairchildsemi.com
Unit
°C/W
Unit
V/ns
°C
°C
°C
W
V
V
V
V
V
V
V
V
V
V
V
V

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