HIP6602BCBZ Intersil, HIP6602BCBZ Datasheet

IC DRIVER MOSFET QUAD 14-SOIC

HIP6602BCBZ

Manufacturer Part Number
HIP6602BCBZ
Description
IC DRIVER MOSFET QUAD 14-SOIC
Manufacturer
Intersil
Datasheet

Specifications of HIP6602BCBZ

Configuration
High and Low Side, Synchronous
Input Type
PWM
Current - Peak
400mA
Number Of Configurations
2
Number Of Outputs
4
High Side Voltage - Max (bootstrap)
15V
Voltage - Supply
10.8 V ~ 13.2 V
Operating Temperature
0°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Delay Time
-

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Dual Channel Synchronous Rectified
Buck MOSFET Driver
The HIP6602B is a high frequency, two power channel
MOSFET driver specifically designed to drive four power
N-Channel MOSFETs in a synchronous rectified buck
converter topology. This device is available in either a
14-lead SOIC or a 16-lead QFN package with a PAD to
thermally enhance the package. These drivers combined
with a HIP63xx or ISL65xx series of Multi-Phase Buck PWM
controllers and MOSFETs form a complete core voltage
regulator solution for advanced microprocessors.
The HIP6602B drives both upper and lower gates over a
range of 5V to 12V. This drive-voltage flexibility provides the
advantage of optimizing applications involving trade-offs
between switching losses and conduction losses.
The output drivers in the HIP6602B have the capacity to
efficiently switch power MOSFETs at high frequencies. Each
driver is capable of driving a 3000pF load with a 30ns
propagation delay and 50ns transition time. This device
implements bootstrapping on the upper gates with a single
external capacitor and resistor required for each power
channel. This reduces implementation complexity and allows
the use of higher performance, cost effective, N-Channel
MOSFETs. Adaptive shoot-through protection is integrated
to prevent both MOSFETs from conducting simultaneously.
Ordering Information
NOTE:
HIP6602BCB
HIP6602BCB-T
HIP6602BCBZ (Note 1)
HIP6602BCBZ-T (Note 1)
HIP6602BCR
HIP6602BCR-T
HIP6602BCRZ (Note 1)
HIP6602BCRZ-T (Note 1)
HIP6602BCRZA (Note 1)
HIP6602BCRZA-T (Note 1) 16 Ld 5x5 QFN Tape and Reel (Pb-Free)
1. Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
PART NUMBER
14 Ld SOIC Tape and Reel
14 Ld SOIC Tape and Reel (Pb-Free)
16 Ld 5x5 QFN Tape and Reel
16 Ld 5x5 QFN Tape and Reel (Pb-Free)
RANGE (°C)
®
0 to 85
0 to 85
0 to 85
0 to 85
0 to 85
TEMP.
1
Data Sheet
14 Ld SOIC
14 Ld SOIC
(Pb-Free)
16 Ld 5x5 QFN
16 Ld 5x5 QFN
(Pb-Free)
16 Ld 5x5 QFN
(Pb-Free)
PACKAGE
M14.15
M14.15
L16.5x5
L16.5x5
L16.5x5
1-888-INTERSIL or 1-888-468-3774
DWG. #
PKG.
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
Features
• Drives Four N-Channel MOSFETs
• Adaptive Shoot-Through Protection
• Internal Bootstrap Devices
• Supports High Switching Frequency
• Small 14-Lead SOIC Package
• Smaller 16-Lead QFN Thermally Enhanced Package
• 5V to 12V Gate-Drive Voltages for Optimal Efficiency
• Three-State Input for Bridge Shutdown
• Supply Undervoltage Protection
• Pb-Free Plus Anneal Available (RoHS Compliant)
• QFN Package:
Applications
• Core Voltage Supplies for Intel Pentium® III and AMD®
• High-Frequency, Low-Profile DC/DC Converters
• High-Current, Low-Voltage DC/DC Converters
- Fast Output Rise Time
- Propagation Delay 30ns
- Compliant to JEDEC PUB95 MO-220
- Near Chip Scale Package footprint, which improves
Athlon
QFN - Quad Flat No Leads - Package Outline
PCB efficiency and has a thinner profile
All other trademarks mentioned are the property of their respective owners.
TM
July 22, 2005
|
Microprocessors.
Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2002-2005. All Rights Reserved
HIP6602B
FN9076.5

Related parts for HIP6602BCBZ

HIP6602BCBZ Summary of contents

Page 1

... Ordering Information TEMP. PART NUMBER RANGE (°C) HIP6602BCB HIP6602BCB SOIC Tape and Reel HIP6602BCBZ (Note HIP6602BCBZ-T (Note SOIC Tape and Reel (Pb-Free) HIP6602BCR HIP6602BCR 5x5 QFN Tape and Reel HIP6602BCRZ (Note HIP6602BCRZ-T (Note 5x5 QFN Tape and Reel (Pb-Free) HIP6602BCRZA (Note 1) ...

Page 2

Pinouts HIP6602B (SOIC) TOP VIEW 14 PWM1 1 1 PWM2 GND LGATE1 4 PVCC 5 10 PGND 6 LGATE2 7 Block Diagram PVCC VCC +5V PWM1 +5V PWM2 GND HIP6602B 2 HIP6602B VCC 13 PHASE1 12 UGATE1 ...

Page 3

Typical Application - 2 Channel Converter Using a HIP6302 and a HIP6602B Gate Driver FB COMP V VSEN CC ISEN1 PGOOD PWM1 MAIN CONTROL HIP6302 VID PWM2 ISEN2 FS/DIS GND 3 HIP6602B +5V BOOT1 +12V UGATE1 VCC PHASE1 LGATE1 PWM1 ...

Page 4

Typical Application - 4 Channel Converter Using a HIP6303 and HIP6602B Gate Driver COMP FB V VSEN CC ISEN1 PWM1 PGOOD EN PWM2 ISEN2 MAIN CONTROL HIP6303 VID ISEN3 FS/DIS PWM3 PWM4 GND ISEN4 4 HIP6602B +12V BOOT1 UGATE1 VCC ...

Page 5

Absolute Maximum Ratings Supply Voltage (VCC .15V Supply ...

Page 6

Functional Pin Descriptions PWM1 (Pin 1) and PWM2 (Pin 2), (Pins 15 and 16 QFN) The PWM signal is the control input for the driver. The PWM signal can enter three distinct states during operation, see the three-state PWM Input ...

Page 7

A falling transition on PWM indicates the turn-off of the upper MOSFET and the turn-on of the lower MOSFET. A short propagation delay [TPDL UGATE before the upper gate begins to fall [TF adaptive shoot-through circuitry determines the lower gate ...

Page 8

MOSFETs. The total chip power dissipation is approximated as 1. PVCC ...

Page 9

Typical Performance Curves 1200 5nF 1000 4nF = 3nF 800 600 2nF U L 400 1nF ...

Page 10

Typical Performance Curves FIGURE 8. POWER DISSIPATION vs LOADING, PVCC = 5V 10 HIP6602B (Continued) 600 PVCC = 5V, VCC = 12V 500 1.5MHz 2MHz 1MHz 400 300 500kHz 200 200kHz 100 GATE CAPACITANCE (C U ...

Page 11

... Dimensions D2 and E2 are for the exposed pads which provide improved electrical and thermal performance. 8. Nominal dimensions are provided to assist with PCB Land Pattern Design efforts, see Intersil Technical Brief TB389. 9. Features and dimensions A2, A3, D1, E1, P & θ are present when Anvil singulation method is used and not present for saw singulation ...

Page 12

... Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use ...

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