VND600SP13TR STMicroelectronics, VND600SP13TR Datasheet

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... Built-in thermal shutdown and outputs current limitation protect the chip from over-temperature and short circuit. Device turns-off in case of ground pin disconnection. Tube VND600SP Rev 4 VND600SP 10 1 PowerSO-10 pin voltage clamp protects the device CC Order codes Tape and reel VND600SP13TR 1/26 www.st.com 26 ...

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Contents Contents 1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Electrical ...

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VND600SP List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

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List of figures List of figures Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

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VND600SP 1 Block diagram and pin description Figure 1. Block diagram INPUT 1 INPUT 2 GND Figure 2. Configuration diagram (top view) GROUND INPUT 2 INPUT 1 C.SENSE1 C.SENSE2 Table 2. Suggested connections for unused and not connected pins Connection ...

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... These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality document. Table 3. ...

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VND600SP Table 3. Absolute maximum ratings (continued) Symbol Maximum switching energy E MAX (L = 0.13mH Power dissipation at T tot T Junction operating temperature j T Case operating temperature c T Storage temperature STG 2.2 Thermal data ...

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Electrical specifications Table 5. Power (continued) Symbol Parameter I Off-state output current L(off2) I Off-state output current L(off3) I Off-state output current L(off4) 1. Per device and V are correlated. Typical difference is 5V. clamp OV Table 6. ...

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VND600SP Table 8. Current sense (9V V Symbol Parameter OUT Current sense ratio drift OUT Current sense ratio drift OUT ...

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Electrical specifications Table 9. Logic inputs Symbol V Input low level voltage IL I Low level input current IL V Input high level voltage IH I High level input current IH V Input hysteresis voltage I(hyst) V Input clamp voltage ...

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VND600SP Table 12. Electrical transient requirements ISO T/R 7637/1 Test pulse 26.5V 1. All functions of the device are performed as designed after exposure to disturbance. 2. One or more functions of the ...

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Electrical specifications Figure 5. I OUT I /I OUT SENSE 6500 6000 5500 5000 4500 4000 3500 3000 0 12/26 /I versus I SENSE OUT max.Tj=25...150°C min.Tj=25...150° (A) OUT max.Tj=-40°C typical value min.Tj=-40° ...

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VND600SP Figure 6. Waveforms INPUT n LOAD CURRENT SENSE INPUT n LOAD CURRENT SENSE INPUT n LOAD CURRENT SENSE n INPUT n LOAD CURRENT LOAD VOLTAGE SENSE n INPUT n LOAD VOLTAGE LOAD CURRENT ...

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Electrical specifications 2.4 Electrical characteristics curves Figure 7. Off-state output current IL(off1) (uA) 2.5 2.25 Off state 2 Vcc= 36V Vin= Vout= 0V 1.75 1.5 1.25 1 0.75 0.5 0.25 0 -50 - (°C ) ...

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VND600SP Figure 13 LIM case Ilim ( Vcc= 13V -50 - (°C ) Figure 15. Input high level Vih (V) 3.6 3.4 3.2 ...

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Application information 3 Application information Figure 19. Application schematic +5V R prot R prot C R prot R prot R SENSE1 3.1 GND protection network against reverse battery This section provides two solutions for implementing a ground protection network against ...

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VND600SP Please note that, if the microprocessor ground is not shared by the device ground, then the R will produce a shift (I GND values. This shift will vary depending on how many devices are ON in the case of ...

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Application information 3.4 Maximum demagnetization energy (V Figure 20. Maximum turn-off current versus load inductance 100 single pulse repetitive pulse repetitive pulse at ...

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VND600SP 4 Package and PCB thermal data 4.1 PowerSO-10 thermal data Figure 21. PowerSO-10 PC board Note: Layout condition of R thickness = 2mm, Cu thickness = 35µm, Copper areas: from minimum pad-lay-out to 8cm Figure 22. R thj-amb RTHj_amb ...

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Package and PCB thermal data Figure 23. Thermal impedance junction ambient single pulse ZTH (°C/ W) 1000 100 10 1 0.1 0.01 0.0001 0.001 Equation 1 pulse calculation formula : where p Figure ...

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VND600SP Table 13. Thermal parameters Area / island ( (°C/W) R2 (°C/W) R3 (°C/W) R4 (°C/W) R5 (°C/W) R6 (°C/W) C1 (W.s/°C) C2 (W.s/°C) C3 (W.s/°C) C4 (W.s/°C) C5 (W.s/°C) C6 (W.s/°C) Package and PCB thermal data ...

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Package and packing information 5 Package and packing information ® 5.1 ECOPACK In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions ...

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VND600SP Table 14. PowerSO-10 mechanical data Dim (1) L (1) 1. Muar ...

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Package and packing information 5.3 PowerSO-10 packing information Figure 26. PowerSO-10 suggested pad layout 14.6 - 14 Figure 28. PowerSO-10 tape and reel shipment (suffix “TR”) Tape dimensions According to ...

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VND600SP 6 Revision history Table 15. Document revision history Date 07-Jul-2004 09-Sep-2004 03-May-2006 15-Dec-2008 Revision 1 Initial release. Current and voltage convention update (page 2). Configuration diagram (top view) & suggested connections for unused and n.c. pins insertion (page 2). ...

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... Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...