VND810SP STMicroelectronics, VND810SP Datasheet

IC DRIVER 2CH HI-SIDE POWERSO-10

VND810SP

Manufacturer Part Number
VND810SP
Description
IC DRIVER 2CH HI-SIDE POWERSO-10
Manufacturer
STMicroelectronics
Type
High Sider
Datasheet

Specifications of VND810SP

Input Type
Non-Inverting
Number Of Outputs
2
On-state Resistance
160 mOhm
Current - Peak Output
5A
Voltage - Supply
5.5 V ~ 36 V
Mounting Type
Surface Mount
Package / Case
PowerSO-10 Exposed Bottom Pad
Supply Voltage (min)
5.5 V
Supply Current
40 mA
Maximum Power Dissipation
52000 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Operating Temperature
-
Current - Output / Channel
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-3305-5

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
VND810SP
Manufacturer:
VIA
Quantity:
1 831
Part Number:
VND810SP
Manufacturer:
ST
0
Part Number:
VND810SP
Manufacturer:
ST
Quantity:
20 000
Part Number:
VND810SP13TR
Manufacturer:
TECHWELL
Quantity:
1 200
Part Number:
VND810SP13TR
Manufacturer:
ST
0
Part Number:
VND810SPTR-E
Manufacturer:
ST
0
Features
1. Per each channel.
Table 1.
October 2010
VND810SP
Very low standby current
CMOS compatible input
On-state open-load detection
Off-state open-load detection
Thermal shutdown protection and diagnosis
Undervoltage shutdown
Overvoltage clamp
Output stuck to V
Load current limitation
Reverse battery protection
Electrostatic discharge protection
Type
PowerSO-10
Device summary
Package
160 m
R
DS(on)
CC
(1)
detection
3.5 A
I
OUT
(1)
36 V
V
CC
Doc ID 7377 Rev 4
VND810SP
Tube
Description
The VND810SP is a monolithic device designed
using|
Technology. The VND810SP is intended for
driving any type of multiple load with one side
connected to ground.
The Active V
device against low energy spikes (see ISO7637
transient compatibility table). Active current
limitation combined with thermal shutdown and
automatic restart protects the device against
overload.
The device detects the open-load condition in
both the on-state and off-state. In the off-state the
device detects if the output is shorted to V
device automatically turns off in the case where
the ground pin becomes disconnected.
Double channel high-side driver
STMicroelectronics™ VIPower™ M0-3
Order codes
CC
10
pin voltage clamp protects the
PowerSO-10
VND810SP13TR
Tape and reel
VND810SP
1
www.st.com
CC
. The
1/27
1

Related parts for VND810SP

VND810SP Summary of contents

Page 1

... Double channel high-side driver I V OUT CC ( Description The VND810SP is a monolithic device designed using| Technology. The VND810SP is intended for driving any type of multiple load with one side connected to ground. The Active V device against low energy spikes (see ISO7637 transient compatibility table). Active current ...

Page 2

... PowerSO-10 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 5.1 ECOPACK 5.2 PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 5.3 PowerSO-10 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 2/27 Solution 1: a resistor in the ground line (RGND only Solution 2: a diode ( the ground line . . . . . . . . . . . . . . . . . . . . 17 GND ® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Doc ID 7377 Rev VND810SP ...

Page 3

... VND810SP List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5 Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 4. Thermal data (per island Table 5. Power output Table 6. Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table output diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 CC Table 8. Switching ( ° Table 9. Logic inputs Table 10. ...

Page 4

... Thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Figure 30. Thermal fitting model of a double channel HSD in PowerSO- Figure 31. PowerSO-10 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Figure 32. PowerSO-10 suggested pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Figure 33. PowerSO-10 tube shipment (no suffix Figure 34. PowerSO-10 tape and reel shipment (suffix “TR” 4/27 ( case ( ( Doc ID 7377 Rev 4 VND810SP ...

Page 5

... VND810SP 1 Block diagram and pin description Figure 1. Block diagram GND INPUT1 STATUS1 OVERTEMP. 1 INPUT2 STATUS2 OVERTEMP. 2 Figure 2. Configuration diagram (top view) GROUND INPUT 1 STATUS 1 STATUS 2 INPUT 2 Table 2. Suggested connections for unused and not connected pins Connection / pin Floating To ground V cc OVERVOLTAGE ...

Page 6

... R MAX Power dissipation (per island tot T Junction operating temperature j T Case operating temperature c T Storage temperature stg 6/27 Parameter = 13 150 °C; L bat jstart = 25°C lead Doc ID 7377 Rev 4 VND810SP Value Unit 0 200 mA Internally limited +/- 10 mA +/- 10 mA 4000 V 4000 V 5000 V 5000 ...

Page 7

... VND810SP 2.2 Thermal data Table 4. Thermal data (per island) Symbol R Thermal resistance junction-case thj-case R Thermal resistance junction-ambient thj-amb 1. When mounted on a standard single-sided FR-4 board with 0 all V pins. Horizontal mounting and no artificial air flow When mounted on a standard single-sided FR-4 board with 6 cm all V pins ...

Page 8

... OUT Off-state OUT °C j On-state OUT = OUT = 3 OUT OUT T = 125 ° OUT °C j Parameter Test conditions T > TSD 5.5V < OUT Doc ID 7377 Rev 4 VND810SP Min. Typ. Max. Unit 5 160 320 - Min. Typ. Max. 150 175 200 135 3.5 5 7.5 & µA 25 µ ...

Page 9

... VND810SP Table Symbol V Forward on voltage F Table 8. Switching (V Symbol t Turn-on delay time d(on) t Turn-off delay time d(off) dV /dt Turn-on voltage slope OUT (on) dV /dt Turn-off voltage slope OUT (off) Table 9. Logic inputs Symbol V Input low level IL I Low level input current IL V Input high level ...

Page 10

... OUT OL OUT OL t DOL(on) 80% dV /dt OUT (on) 10% t d(on) Doc ID 7377 Rev 4 Test conditions Min. Typ. Max OUT 1.5 2.5 IN OVER TEMP STATUS TIMING T > TSD V INn V STATn t SDL 90% dV /dt OUT (off) t d(off) VND810SP Unit 80 mA 200 µs 3.5 V 1000 µs t SDL t t ...

Page 11

... VND810SP Table 12. Truth table Conditions Normal operation Current limitation Overtemperature Undervoltage Overvoltage Output voltage > V Output current < I Table 13. Electrical transient requirements ISO T/R 7637/1 Test pulse 26.5V 1. All functions of the device are performed as designed after exposure to disturbance. 2. One or more functions of the device is not performed as designed after exposure and cannot be returned to proper operation without replacing the device ...

Page 12

... STATUS n INPUT n LOAD VOLTAGE STATUS n INPUT n LOAD VOLTAGE STATUS INPUT n LOAD CURRENT STATUS n 12/27 NORMAL OPERATION n UNDERVOLTAGE V USDhyst V USD n undefined OVERVOLTAGE V <V V > OPEN LOAD with external pull- OPEN LOAD without external pull-up n OVERTEMPERATURE T TSD Doc ID 7377 Rev 4 VND810SP OV > V OUT OL ...

Page 13

... VND810SP 2.4 Electrical characteristics curves Figure 7. Off-state output current IL(off1) (uA) 2.5 2.25 Off state 2 Vcc=36V Vin=Vout=0V 1.75 1.5 1.25 1 0.75 0.5 0.25 0 -50 - (°C) Figure 9. Input clamp voltage Vicl (V) 8 7.8 Iin=1mA 7.6 7.4 7.2 7 6.8 6.6 6.4 6.2 6 -50 - (°C) Figure 11 ...

Page 14

... Figure 18. Input low level case Vil (V) 2.6 2.4 2.2 2 1.8 1.6 1.4 1.2 1 100 125 150 175 -50 Doc ID 7377 Rev 4 Iout=1A Tc= 125ºC Tc= 25ºC Tc= - 40º Vcc (V) - 100 125 150 Tc (°C) - 100 125 Tc (°C) VND810SP CC 40 175 150 175 ...

Page 15

... VND810SP Figure 19. Status leakage current Ilstat (uA) 0.05 0.04 Vstat=5V 0.03 0.02 0.01 0 -50 - (°C) Figure 21. Status clamp voltage Vscl (V) 8 7.8 Istat=1mA 7.6 7.4 7.2 7 6.8 6.6 6.4 6.2 6 -50 - (°C) Figure 23. Open-load off-state voltage detection threshold Vol (V) 5 4.5 Vin= ...

Page 16

... STATUS1 INPUT1 STATUS2 INPUT2 V GND GND ) S(on)max ) / ( -I ) GND (when V < 0 during reverse battery situations) is: GND GND Doc ID 7377 Rev OUTPUT1 OUTPUT2 GND R GND D GND only) GND resistor: becomes the sum of the S(on)max VND810SP D ld ...

Page 17

... VND810SP Please note that, if the microprocessor ground is not shared by the device ground, then the R will produce a shift (I GND values. This shift will vary depending on how many devices are ON in the case of several high-side drivers sharing the same R If the calculated power dissipation requires the use of a large resistor, or several devices have to share the same resistor, then ST suggests using solution 2 below ...

Page 18

... Olmin + R ))R < Olmin. PU out V batt DRIVER INPUT + LOGIC + R - STATUS V OL GROUND Doc ID 7377 Rev 4 ) connected between PU ) like the +5V line used to supply the has to be higher than OUT < OLmax L(off2) is pulled high (up to several mA), the pull L(off2) OUT R L VND810SP OUT ...

Page 19

... VND810SP 3.5 Maximum demagnetization energy (V Figure 26. Maximum turn-off current versus load inductance ( 0, single pulse repetitive pulse repetitive pulse Values are generated with R In case of repetitive pulses, T the temperature specified above for curves B and C. 0,1 1 L(mH) = 150 °C Jstart = 100 °C Jstart = 125 ° ...

Page 20

... Cu thickness = 35 µm, Copper areas: from minimum pad lay-out Figure 28. R thj-amb RTHj_amb (°C/ 20/27 (1) and Z measurements (PCB FR4 area = mm, PCB thickness = 2 mm PCB copper area in open box free air condition 2 4 PCB Cu heatsink area (cm^2) Doc ID 7377 Rev 4 VND810SP 2 ). Tj-Tamb=50° ...

Page 21

... VND810SP Figure 29. Thermal impedance junction ambient single pulse ZTH (°C/W) 1000 100 10 1 0.1 0.0001 0.001 Equation 1 pulse calculation formula : where p Figure 30. Thermal fitting model of a double channel HSD in PowerSO-10 Tj_1 Pd1 Tj_2 0.01 0.1 Time ( – THtp Pd2 Doc ID 7377 Rev 4 ...

Page 22

... Package and PCB thermal data Table 14. Thermal parameters Area / island (cm 22/ (°C/W) R2 (°C/W) R3 (°C/W) R4 (°C/W) R5 (°C/W) R6 (°C/W) C1 (W.s/°C) C2 (W.s/°C) C3 (W.s/°C) C4 (W.s/°C) C5 (W.s/°C) C6 (W.s/°C) Doc ID 7377 Rev 4 VND810SP Footprint 6 0.35 1.8 1.1 0 0.0001 7E-04 0.008 0.3 0. ...

Page 23

... VND810SP 5 Package and packing information ® 5.1 ECOPACK In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. 5.2 PowerSO-10 mechanical data Figure 31 ...

Page 24

... Doc ID 7377 Rev 4 VND810SP Max. 3.65 3.6 0.10 0.60 0.53 0.55 0.32 9.60 7.60 9.50 7.60 7.50 6.10 6.30 1.35 1.40 14.40 14.35 1 ...

Page 25

... VND810SP 5.3 PowerSO-10 packing information Figure 32. PowerSO-10 suggested pad layout 14.6 - 14 Figure 34. PowerSO-10 tape and reel shipment (suffix “TR”) Tape dimensions According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing Component Spacing ...

Page 26

... Revision history table insertion (page 18). Disclaimers update (page 19). Document reformatted and restructured. 3 Added contents, list of tables and figures. Added ECOPACK® packages Updated Features list. 4 Updated Table 3: Absolute maximum ratings Updated Figure 5: Switching time waveforms Doc ID 7377 Rev 4 VND810SP Changes information. ...

Page 27

... VND810SP Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...

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