MDC3105LT1G ON Semiconductor, MDC3105LT1G Datasheet

IC RELAY/DRVR INDUCT LOAD SOT23

MDC3105LT1G

Manufacturer Part Number
MDC3105LT1G
Description
IC RELAY/DRVR INDUCT LOAD SOT23
Manufacturer
ON Semiconductor
Type
Relay/Load Driverr
Datasheets

Specifications of MDC3105LT1G

Input Type
Non-Inverting
Number Of Outputs
1
Current - Output / Channel
400mA
Current - Peak Output
500mA
Voltage - Supply
6V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Supply Voltage Max
6V
No. Of Outputs
1
Output Current
400mA
Driver Case Style
SOT-23
Device Type
Relay
Filter Terminals
SMD
No. Of Pins
3
Rohs Compliant
Yes
Leaded Process Compatible
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
On-state Resistance
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
MDC3105LT1GOS
MDC3105LT1GOS
MDC3105LT1GOSTR

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MDC3105LT1G
Manufacturer:
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Quantity:
127 439
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MDC3105LT1G
Manufacturer:
ON Semiconductor
Quantity:
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MDC3105
Integrated Relay,
Inductive Load Driver
components with an integrated SMT part. It is available in a SOT−23
package. It can be used to switch 3 to 6 Vdc inductive loads such as
relays, solenoids, incandescent lamps, and small DC motors without
the need of a free−wheeling diode.
Features
Applications
© Semiconductor Components Industries, LLC, 2009
October, 2009 − Rev. 7
This device is intended to replace an array of three to six discrete
Sensitive Logic Circuits
Features Low Input Drive Current and Good Back−to−Front Transient
Isolation
System Operation
Higher Resistance Relay Coils
Machines, Feature Phone Electronic Hook Switch
Recorders, TV Set Top Boxes
Automated Test Equipment, Garage Door Openers
Lamp Drivers
Provides a Robust Driver Interface between DC Relay Coil and
Optimized to Switch Relays from a 3.0 V to 5.0 V Rail
Capable of Driving Relay Coils Rated up to 2.5 W at 5.0 V
Internal Zener Eliminates Need for Free−Wheeling Diode
Internal Zener Clamp Routes Induced Current to Ground for Quieter
Guaranteed Off State with No Input Connection
Supports Large Systems with Minimal Off−State Leakage
ESD Resistant in Accordance with the Class 1C Human Body Model
Low Sat Voltage Reduces System Current Drain by Allowing Use of
Pb−Free Packages are Available
Telecom: Line Cards, Modems, Answering Machines, FAX
Computer and Office: Photocopiers, Printers, Desktop Computers
Consumer: TVs and VCRs, Stereo Receivers, CD Players, Cassette
Industrial: Small Appliances, White Goods, Security Systems,
Automotive: 5.0 V Driven Relays, Motor Controls, Power Latches,
1
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
1
6
*Date Code orientation and/or overbar may
Relay, Inductive Load Driver
vary depending upon manufacturing location.
(Note: Microdot may be in either location)
1
1
JW
M
G
ORDERING INFORMATION
http://onsemi.com
CASE 463A
CASE 318F
= Specific Device Code
= Date Code*
= Pb−Free Package
CASE 318
SOT−563
STYLE 6
STYLE 8
STYLE 4
SOT−23
SC−74
Publication Order Number:
1
1
DIAGRAMS
MARKING
JW M G
JW M G
JW M G
MDC3105/D
G
G
G

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MDC3105LT1G Summary of contents

Page 1

MDC3105 Integrated Relay, Inductive Load Driver This device is intended to replace an array of three to six discrete components with an integrated SMT part available in a SOT−23 package. It can be used to switch 3 to ...

Page 2

V out GND CASE 318 MAXIMUM RATINGS (T = 25°C unless otherwise noted) J Rating Power Supply Voltage Input Voltage Reverse Input Voltage Repetitive Pulse Zener ...

Page 3

... Output Sink Current − Continuous (V = 0.25 Vdc 1.5 mA ORDERING INFORMATION Device MDC3105LT1 MDC3105LT1G MDC3105DMT1 MDC3105DMT1G MDC3105XV6T1G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/ 25°C unless otherwise noted) A ≤ ...

Page 4

TYPICAL APPLICATION−DEPENDENT SWITCHING PERFORMANCE SWITCHING CHARACTERISTICS Characteristic Propagation Delay Times: High to Low Propagation Delay; Figure 1 (5.0 V 74HC04) Low to High Propagation Delay; Figure 1 (5.0 V 74HC04) High to Low Propagation Delay; Figures 1, 13 (3.0 V ...

Page 5

TYPICAL PERFORMANCE CHARACTERISTICS 500 450 T = 85°C J 400 25°C 350 300 250 -40°C 200 150 100 50 0 1.0 10 100 I , OUTPUT SINK CURRENT (mA) O Figure 2. Transistor DC Current Gain ...

Page 6

TYPICAL PERFORMANCE CHARACTERISTICS 10,000 5.5 Vdc CC 1000 k 100 1.0 k 100 10 1.0 -55 -35 -15 5 JUNCTION TEMPERATURE (°C) J Figure 8. Output Leakage Current versus Temperature 1.0 ...

Page 7

Figure 11. Zener Repetitive Pulse Energy Limit 1 0.5 0.2 0.1 0.1 0.05 0.02 0.01 0.01 SINGLE PULSE 0.001 0.01 0.1 1.0 Figure 12. Transient Thermal Response for MDC3105LT1 ...

Page 8

Using TTR Designing for Pulsed Operation For a repetitive pulse operating condition, time averaging allows one to increase a device’s peak power dissipation rating above the average rating by dividing by the duty cycle of the repetitive pulse train. Thus, ...

Page 9

Designing with this Data Sheet 1. Determine the maximum inductive load current (at max V , min coil resistance and usually minimum CC temperature) that the MDC3105 will have to drive and make sure it is less than the max ...

Page 10

Max Continuous Current Calculation for TX2−5V Relay 178 W Nominal @ R Assuming ±10% Make Tolerance 178 W * 0.9 = 160 W Min @ T = 25° for Annealed Copper Wire is 0.4%/°C ...

Page 11

TIME (ms) Figure 16 Square Wave Input TIME (ms) Figure 18 Square Wave Response TYPICAL OPERATING WAVEFORMS 225 175 ...

Page 12

... *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOT−23 (TO−236) CASE 318−08 ISSUE AN NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS ...

Page 13

... SOLDERING FOOTPRINT* 1.9 0.074 0.7 0.028 1.0 0.039 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SC−74 CASE 318F−05 ISSUE M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. ...

Page 14

... Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein ...

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