L6226N STMicroelectronics, L6226N Datasheet - Page 23

• Manufacturer Part Number: L6226N
• Description: IC DRVR DUAL FULL BRDG 24-PWRDIP
• Manufacturer: STMicroelectronics
• Type: H Bridger

Specifications of L6226N

• Input Type: Non-Inverting
• Number Of Outputs: 4
• On-state Resistance: 730 mOhm
• Current - Output / Channel: 1.4A
• Current - Peak Output: 2.8A
• Voltage - Supply: 8 V ~ 52 V
• Operating Temperature: -25°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 24-DIP (0.300", 7.62mm)
• Operating Supply Voltage: 8 V to 52 V
• Supply Current: 10 mA
• Mounting Style: Through Hole
• For Use With: 497-6816 - EVAL BOARD FOR L6226Q
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-5346-5; L6226N

L6226
7
Thermal management
In most applications the power dissipation in the IC is the main factor that sets the maximum
current that can be deliver by the device in a safe operating condition. Therefore, it has to be
taken into account very carefully. Besides the available space on the PCB, the right package
should be chosen considering the power dissipation. Heat sinking can be achieved using
copper on the PCB with proper area and thickness.
to-ambient thermal resistance values for the PowerSO36, PowerDIP24 and SO24 packages.
For instance, using a PowerSO package with copper slug soldered on a 1.5 mm copper
thickness FR4 board with 6cm2 dissipating footprint (copper thickness of 35µm), the R
about 35°C/W.
board with vias to a ground plane, thermal impedance can be reduced down to 15°C/W.
Figure 20. Mounting the PowerSO package
Figure 21. PowerSO36 junction-amb. thermal resistance vs on-board copper area
Figure 20
shows mounting methods for this package. Using a multi-layer
Doc ID 9452 Rev 4
Figure
21,
22
and
Thermal management
23
show the junction-
thJA
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is