VND830SP-E STMicroelectronics, VND830SP-E Datasheet
VND830SP-E
Specifications of VND830SP-E
Available stocks
Related parts for VND830SP-E
VND830SP-E Summary of contents
Page 1
... February 2011 Double channel high-side driver Description The VND830SP monolithic device made by using STMicroelectronics™ VIPower™ M0-3 technology, intended for driving any kind of load with one side connected to ground. Active V against low energy spikes (see ISO7637 transient compatibility table). ...
Page 2
... VND830SP-E Contents 1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.5 Maximum demagnetization energy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3 Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.1 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 18 3.1.1 3.1.2 3.2 Load dump protection ...
Page 3
... VND830SP-E List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5 Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 4. Thermal data (per island Table 5. Power output Table 6. Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table output diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 CC Table 8. Status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 9. Switching ( Table 10. Open-load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 11 ...
Page 4
... VND830SP-E List of figures Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 2. Configuration diagram (top view Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Figure 4. Status timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 5. Switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 6. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 7. Off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 8. High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 9. Input clamp voltage Figure 10. Status leakage current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 11 ...
Page 5
... VND830SP-E 1 Block diagram and pin description Figure 1. Block diagram GND INPUT1 STATUS1 OVERTEMP. 1 INPUT2 STATUS2 OVERTEMP. 2 Figure 2. Configuration diagram (top view) GROUND INPUT 1 STATUS 1 STATUS 2 INPUT 2 Table 2. Suggested connections for unused and not connected pins Connection / pin Floating To ground V cc OVERVOLTAGE ...
Page 6
... VND830SP-E 2 Electrical specifications 2.1 Absolute maximum ratings Stressing the device above the rating listed in device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability ...
Page 7
... VND830SP-E 2.2 Thermal data Table 4. Thermal data (per island) Symbol R Thermal resistance junction-case thj-case R Thermal resistance junction-ambient thj-amb 1. When mounted on a standard single-sided FR-4 board with 0 artificial air flow. 2. When mounted on a standard single-sided FR-4 board with 6 cm artificial air flow. ...
Page 8
... VND830SP-E Table 5. Power output (continued) Symbol (1) I Supply current S I Off-state output current L(off1) I Off-state output current L(off2) I Off-state output current L(off3) I Off-state output current L(off4) 1. Per device. Table 6. Protections Symbol Parameter T Shutdown temperature TSD T Reset temperature R T Thermal hysteresis hyst ...
Page 9
... VND830SP-E Table 8. Status pin (continued) Symbol V Status clamp voltage SCL Table 9. Switching (V Symbol t Turn-on delay time d(on) t Turn-off delay time d(off) dV /dt Turn-on voltage slope OUT (on) dV /dt Turn-off voltage slope OUT (off) Table 10. Open-load detection Symbol Open-load on-state detection I OL threshold ...
Page 10
... VND830SP-E Figure 4. Status timings OPEN LOAD STATUS TIMING (with external pull-up) V INn V STATn t DOL(off) Table 12. Truth table Conditions Normal operation Current limitation Overtemperature Undervoltage Overvoltage Output voltage > V Output current < < > V OUT OL OUT OL t DOL(on) Input Doc ID 10879 Rev 2 Electrical specifications ...
Page 11
... VND830SP-E Figure 5. Switching time waveforms Doc ID 10879 Rev 2 Electrical specifications 11/28 ...
Page 12
... VND830SP-E Table 13. Electrical transient requirements on V ISO T/R 7637/1 test pulse Table 14. Electrical transient requirements on V ISO T/R 7637/1 test pulse Table 15. Electrical transient requirements on V Class C All functions of the device are performed as designed after exposure to disturbance. One or more functions of the device is not performed as designed after exposure to E disturbance and cannot be returned to proper operation without replacing the device ...
Page 13
... VND830SP-E Figure 6. Waveforms INPUT n OUTPUT VOLTAGE STATUS INPUT n OUTPUT VOLTAGE STATUS INPUT n OUTPUT VOLTAGE STATUS n INPUT n OUTPUT VOLTAGE STATUS n INPUT n OUTPUT VOLTAGE STATUS INPUT n OUTPUT CURRENT STATUS n NORMAL OPERATION n UNDERVOLTAGE V USDhyst V USD n undefined OVERVOLTAGE V <V V > OPEN-LOAD with external pull-up V OUT ...
Page 14
... VND830SP-E 2.4 Electrical characteristics curves Figure 7. Off-state output current IL(off1) (uA) 2.5 2.25 Off state 2 Vcc=36V Vin=Vout=0V 1.75 1.5 1.25 1 0.75 0.5 0.25 0 -50 - 100 Tc (°C) Figure 9. Input clamp voltage Vicl (V) 8 7.8 Iin=1mA 7.6 7.4 7.2 7 6.8 6.6 6.4 6.2 6 -50 ...
Page 15
... VND830SP-E Figure 13. On-state resistance vs T Ron (mOhm) 160 140 Iout=2A Vcc=8V; 13V & 36V 120 100 -50 - (°C) Figure 15. Open-load on-state detection threshold Iol (mA) 150 140 Vcc=13V 130 Vin=5V 120 110 100 -50 - (ºC) Figure 17. Input high level Vih (V) 3.6 3.4 3.2 3 2.8 2 ...
Page 16
... VND830SP-E Figure 19. Input hysteresis voltage Vhyst (V) 1.5 1.4 1.3 1.2 1.1 1 0.9 0.8 0.7 0.6 0.5 -50 - (°C) Figure 21. Turn-on voltage slope dVout/dt(on) (V/ms) 800 700 Vcc=13V Rl=6.5Ohm 600 500 400 300 200 100 0 -50 - (ºC) Figure 23 LIM case Ilim ( Vcc=13V 16 14 ...
Page 17
... VND830SP-E 2.5 Maximum demagnetization energy Figure 24. PowerSO-10 maximum turn-off current versus load inductance (A) 100 single pulse repetitive pulse repetitive pulse at T Conditions 13 Note: Values are generated with R In case of repetitive pulses, T specified above for curves B and C. 1 L(mH) = 150 °C ...
Page 18
... VND830SP-E 3 Application schematic Figure 25. Application schematic +5V R prot R C prot R prot R prot 3.1 GND protection network against reverse battery This section provides two solutions for implementing a ground protection network against reverse battery. 3.1.1 Solution 1: a resistor in the ground line (R This can be used with any type of load. ...
Page 19
... VND830SP-E Please note that, if the microprocessor ground is not shared by the device ground, then the R will produce a shift (I GND values. This shift will vary depending on how many devices are ON in the case of several high-side drivers sharing the same R If the calculated power dissipation requires the use of a large resistor, or several devices have to share the same resistor, then ST suggests using solution 2 below ...
Page 20
... VND830SP-E 3.4 Open-load detection in off-state Off-state open load detection requires an external pull-up resistor (R OUTPUT pin and a positive supply voltage (V microprocessor. The external resistor has to be selected according to the following requirements false open load indication when load is connected: in this case we have to avoid ...
Page 21
... VND830SP-E 4 Package and PCB thermal data 4.1 PowerSO-10 thermal data Figure 27. PowerSO-10 PC board Note: Layout condition of R thickness = 2 mm, Cu thickness = 35 µm, Copper areas: from minimum pad lay-out Figure 28. R thj-amb and Z measurements (PCB FR4 area = mm, PCB PCB copper area in open box free air condition ...
Page 22
... VND830SP-E Figure 29. Thermal impedance junction ambient single pulse Equation 1 pulse calculation formula : where p Figure 30. Thermal fitting model of a double channel HSD in PowerSO-10 Tj_1 Pd1 Tj_2 Z 1 – THtp Pd2 Doc ID 10879 Rev 2 Package and PCB thermal data T_amb 22/28 ...
Page 23
... VND830SP-E Table 16. Thermal parameters Area / island ( (°C/W) R2 (°C/W) R3 (°C/W) R4 (°C/W) R5 (°C/W) R6 (°C/W) C1 (W.s/°C) C2 (W.s/°C) C3 (W.s/°C) C4 (W.s/°C) C5 (W.s/°C) C6 (W.s/°C) Doc ID 10879 Rev 2 Package and PCB thermal data Footprint 6 0.15 0.8 0.7 0 0.0006 2.1E-03 0.013 0.3 0.75 ...
Page 24
... VND830SP-E 5 Package and packing information ® 5.1 ECOPACK In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. 5.2 PowerSO-10 package information Figure 31 ...
Page 25
... VND830SP-E Table 17. PowerSO-10 mechanical data DIM (1) L (1) 1. Muar only POA P013P. Package and packing information mm. Min. Typ. 3.35 3.4 0 0.40 0.37 0.35 0.23 9.40 7.40 9.30 7.20 7.30 5.90 5.90 1.27 1.25 1.20 13.80 13.85 0.50 1.20 0.80 0° 2° ...
Page 26
... VND830SP-E 5.3 PowerSO-10 packing information Figure 32. PowerSO-10 suggested pad layout Figure 34. PowerSO-10 tape and reel shipment (suffix “TR”) Tape dimensions According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter ...
Page 27
... VND830SP-E 6 Revision history Table 18. Document revision history Date 01-Oct-2004 07-Feb-2011 Revision 1 Initial release. Document reformatted and restructured. 2 Updated Features list. Updated Table 16: Thermal parameters Doc ID 10879 Rev 2 Revision history Changes 27/28 ...
Page 28
... VND830SP-E Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...