VND830LSP STMicroelectronics, VND830LSP Datasheet

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VND830LSP

Manufacturer Part Number
VND830LSP
Description
IC DRIVR DUAL 36V 18A POWERSO-10
Manufacturer
STMicroelectronics
Type
High Sider
Datasheet

Specifications of VND830LSP

Input Type
Non-Inverting
Number Of Outputs
2
On-state Resistance
60 mOhm
Current - Peak Output
23A
Voltage - Supply
5.5 V ~ 36 V
Operating Temperature
-40°C ~ 150°C
Mounting Type
Surface Mount
Package / Case
PowerSO-10 Exposed Bottom Pad
Current - Output / Channel
-
Other names
Q3465613

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
VND830LSP
Manufacturer:
ST
0
Part Number:
VND830LSP
Manufacturer:
ST
Quantity:
20 000
Part Number:
VND830LSP-E
Manufacturer:
ST
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Part Number:
VND830LSP/
Manufacturer:
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Part Number:
VND830LSP13TR
Manufacturer:
ST
0
Part Number:
VND830LSP13TR
Manufacturer:
ST
Quantity:
20 000
Part Number:
VND830LSPTR-E
Manufacturer:
ST
0
Features
1. Per each channel.
Table 1.
October 2010
VND830LSP
CMOS compatible inputs
Open drain status outputs
On-state open-load detection
Off-state open-load detection
Shorted load protection
Undervoltage and overvoltage shutdown
Loss of ground protection
Very low standby current
Reverse battery protection
Type
PowerSO-10
Device summary
Package
60 m
R
DS(on)
(1)
18 A
I
OUT
(1)
36 V
V
CC
Doc ID 9431 Rev 4
VND830LSP
Tube
Description
The VND830LSP is a monolithic device designed
using|STMicroelectronics™ VIPower™ M0-3
Technology. The VND830LSP is intended for
driving any type of multiple load with one side
connected to ground.
The Active V
device against low energy spikes (see ISO7637
transient compatibility table). Active current
limitation combined with thermal shutdown and
automatic restart protects the device against
overload.
The open-load threshold is aimed at detecting the
5 W / 12 V standard bulb as an open-load fault in
the on-state.
The device detects the open-load condition in
both the on and off-state. In the off-state the
device detects if the output is shorted to V
device automatically turns off in the case where
the ground pin becomes disconnected.
Double channel high-side driver
Order codes
CC
10
pin voltage clamp protects the
PowerSO-10
VND830LSP13TR
VND830LSP
Tape and reel
1
www.st.com
CC
. The
1/27
1

Related parts for VND830LSP

VND830LSP Summary of contents

Page 1

... I V OUT CC ( Description The VND830LSP is a monolithic device designed using|STMicroelectronics™ VIPower™ M0-3 Technology. The VND830LSP is intended for driving any type of multiple load with one side connected to ground. The Active V device against low energy spikes (see ISO7637 transient compatibility table). Active current ...

Page 2

... PowerSO-10 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 5.1 ECOPACK 5.2 PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 5.3 PowerSO-10 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 2/27 Solution 1: a resistor in the ground line (RGND only Solution 2: a diode ( the ground line . . . . . . . . . . . . . . . . . . . . 17 GND ® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Doc ID 9431 Rev 4 VND830LSP = 13 ...

Page 3

... VND830LSP List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5 Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 4. Thermal data (per island Table 5. Power output Table 6. Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table output diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 CC Table 8. Switching ( Table 9. Logic inputs Table 10. Status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 11 ...

Page 4

... Thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Figure 30. Thermal fitting model of a double channel HSD in PowerSO- Figure 31. PowerSO-10 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Figure 32. PowerSO-10 suggested pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Figure 33. PowerSO-10 tube shipment (no suffix Figure 34. PowerSO-10 tape and reel shipment (suffix “TR” 4/ case Doc ID 9431 Rev 4 VND830LSP ...

Page 5

... VND830LSP 1 Block diagram and pin description Figure 1. Block diagram GND INPUT1 STATUS1 OVERTEMP. 1 INPUT2 STATUS2 OVERTEMP. 2 Figure 2. Configuration diagram (top view) GROUND INPUT 1 STATUS 1 STATUS 2 INPUT 2 Table 2. Suggested connections for unused and not connected pins Connection / pin Floating To ground V cc OVERVOLTAGE ...

Page 6

... R MAX Power dissipation (per island tot T Junction operating temperature j T Case operating temperature c T Storage temperature stg 6/27 Parameter = 13 150 °C; L bat jstart = 25 °C lead Doc ID 9431 Rev 4 VND830LSP Value Unit 0 200 mA Internally limited +/- 10 mA +/- 10 mA 4000 V 4000 V 5000 V 5000 ...

Page 7

... VND830LSP 2.2 Thermal data Table 4. Thermal data (per island) Symbol R Thermal resistance junction-lead thj-lead R Thermal resistance junction-ambient thj-amb 1. When mounted on a standard single-sided FR-4 board with 0 all V pins. Horizontal mounting and no artificial air flow When mounted on a standard single-sided FR-4 board with 6 cm all V pins ...

Page 8

... OUT Off-state OUT °C j On-state OUT = OUT = 0V 3 OUT OUT T = 125 ° OUT °C j Parameter Test conditions T > TSD 5.5 V < OUT Doc ID 9431 Rev 4 VND830LSP Min. Typ. Max. Unit 5 - Min. Typ. Max. 150 175 200 135 < 5 120 m 40 µA 25 µ ...

Page 9

... VND830LSP Table Symbol V Forward on voltage F Table 8. Switching (V Symbol t Turn-on delay time d(on) t Turn-off delay time d(off) dV /dt Turn-on voltage slope OUT (on) dV /dt Turn-off voltage slope OUT (off) Table 9. Logic inputs Symbol V Input low level IL I Low level input current IL V Input high level ...

Page 10

... Figure 5. Switching time waveforms 10/27 Parameter Test conditions OUT < > V OUT OL OUT OL t DOL(on) Doc ID 9431 Rev 4 VND830LSP Min. Typ. Max. 0.6 0.9 1.2 200 1.5 2.5 3.5 1000 OVER TEMP STATUS TIMING T > TSD V INn V STATn t t SDL SDL Unit A µ ...

Page 11

... VND830LSP Table 12. Truth table Conditions Normal operation Current limitation Overtemperature Undervoltage Overvoltage Output voltage > V Output current < I Table 13. Electrical transient requirements ISO T/R 7637/1 Test pulse 26.5V 1. All functions of the device are performed as designed after exposure to disturbance. 2. One or more functions of the device is not performed as designed after exposure and cannot be returned to proper operation without replacing the device ...

Page 12

... STATUS n INPUT n LOAD VOLTAGE STATUS n INPUT n LOAD VOLTAGE STATUS INPUT n LOAD CURRENT STATUS n 12/27 NORMAL OPERATION n UNDERVOLTAGE V USDhyst V USD n undefined OVERVOLTAGE V <V V > OPEN LOAD with external pull- OPEN LOAD without external pull-up n OVERTEMPERATURE T TSD Doc ID 9431 Rev 4 VND830LSP OV > V OUT OL ...

Page 13

... VND830LSP 2.4 Electrical characteristics curves Figure 7. Off-state output current IL(off1) 1.35 1.2 Off State 1.05 Vcc=13V Vin=Vout=0V 0.9 0.75 0.6 0.45 0.3 0.15 0 -50 - (ºC) Figure 9. Input clamp voltage Vicl (V) 8 7.8 Iin=1mA 7.6 7.4 7.2 7 6.8 6.6 6.4 6.2 6 -50 ...

Page 14

... Figure 18. Input low level case Vil (V) 2.25 2.125 2 1.875 1.75 1.625 1.5 1.375 1.25 100 125 150 175 Doc ID 9431 Rev 4 VND830LSP CC Iout=2A Tc=150ºC Tc=25ºC Tc= -40º Vcc (V) - 100 125 150 Tc (°C) -50 -25 ...

Page 15

... VND830LSP Figure 19. Status leakage current Ilstat (µA) 0.07 0.06 Vstat=5V 0.05 0.04 0.03 0.02 0.01 0 -50 - (ºC) Figure 21. Status clamp voltage Vscl (V) 8 7.8 Istat=1mA 7.6 7.4 7.2 7 6.8 6.6 6.4 6.2 6 -50 - (°C) Figure 23. Open-load off-state voltage detection threshold Vol ( ...

Page 16

... STATUS1 INPUT1 STATUS2 INPUT2 V GND GND ) S(on)max ) / ( -I ) GND (when V < 0 during reverse battery situations) is: GND GND Doc ID 9431 Rev OUTPUT1 OUTPUT2 GND R GND D GND only) GND resistor: becomes the sum of the S(on)max VND830LSP D ld ...

Page 17

... VND830LSP Please note that, if the microprocessor ground is not shared by the device ground, then the R produces a shift (I GND values. This shift varies depending on how many devices are ON in the case of several high side drivers sharing the same R If the calculated power dissipation requires the use of a large resistor, or several devices have to share the same resistor, then ST suggests using solution 2 below ...

Page 18

... R ))R < Olmin. PU out V batt DRIVER INPUT + LOGIC + R - STATUS V OL GROUND Doc ID 9431 Rev 4 ) connected between PU ) like the +5 V line used to supply the has to be higher than OUT < OLmax L(off2) is pulled high (up to several mA), the pull L(off2) OUT R L VND830LSP OUT ...

Page 19

... VND830LSP 3.5 Maximum demagnetization energy (V Figure 26. Maximum turn-off current versus load inductance (A) 100 single pulse repetitive pulse repetitive pulse Note: Values are generated with R In case of repetitive pulses, T specified above for curves B and C. 0,01 0,1 = 150 °C Jstart = 100 °C Jstart = 125 ° ...

Page 20

... Copper areas: from minimum pad lay-out Figure 28. R thj-amb RTHj_amb (°C/ 20/27 and Z measurements (PCB FR4 area = mm, PCB thickness = 2 mm, Cu thickness = PCB copper area in open box free air condition 2 4 PCB Cu heatsink area (cm^2) Doc ID 9431 Rev 4 VND830LSP Tj-Tamb=50° ...

Page 21

... VND830LSP Figure 29. Thermal impedance junction ambient single pulse ZTH (°C/W) 1000 100 10 1 0.1 0.0001 0.001 Equation 1 pulse calculation formula : where p Figure 30. Thermal fitting model of a double channel HSD in PowerSO-10 Tj_1 Pd1 Tj_2 0.01 0.1 Time ( – THtp Pd2 Doc ID 9431 Rev 4 ...

Page 22

... Package and PCB thermal data Table 14. Thermal parameters Area / island (cm 22/ (°C/W) R2 (°C/W) R3 (°C/W) R4 (°C/W) R5 (°C/W) R6 (°C/W) C1 (W.s/°C) C2 (W.s/°C) C3 (W.s/°C) C4 (W.s/°C) C5 (W.s/°C) C6 (W.s/°C) Doc ID 9431 Rev 4 VND830LSP Footprint 6 0.15 0.8 0.7 0 0.0006 2.1E-03 0.013 0.3 0. ...

Page 23

... VND830LSP 5 Package and packing information ® 5.1 ECOPACK In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. 5.2 PowerSO-10 mechanical data Figure 31 ...

Page 24

... Doc ID 9431 Rev 4 VND830LSP Max. 3.65 3.6 0.10 0.60 0.53 0.55 0.32 9.60 7.60 9.50 7.60 7.50 6.10 6.30 1.35 1.40 14.40 14.35 1 ...

Page 25

... VND830LSP 5.3 PowerSO-10 packing information Figure 32. PowerSO-10 suggested pad layout 14.6 - 14 Figure 34. PowerSO-10 tape and reel shipment (suffix “TR”) Tape dimensions According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing Component Spacing ...

Page 26

... CC Protections note insertion (page 4). Revision history table insertion (page 18). Disclaimers update (page 19). Document reformatted and restructured. 3 Added contents, list of tables and figures. Added ECOPACK® packages 4 Updated Figure 5: Switching time Doc ID 9431 Rev 4 VND830LSP Changes information. waveforms. ...

Page 27

... VND830LSP Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...

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