L6225D STMicroelectronics, L6225D Datasheet - Page 13

• Manufacturer Part Number: L6225D
• Description: IC DRVR FULL BRIDGE DUAL 20-SOIC
• Manufacturer: STMicroelectronics
• Type: H Bridger

Specifications of L6225D

• Input Type: Non-Inverting
• Number Of Outputs: 4
• On-state Resistance: 730 mOhm
• Current - Output / Channel: 1.4A
• Current - Peak Output: 2.8A
• Voltage - Supply: 8 V ~ 52 V
• Operating Temperature: -25°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (7.5mm Width)
• Operating Supply Voltage: 8 V to 52 V
• Supply Current: 10 mA
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-1430-5

PARALLELED OPERATION
The outputs of the L6225 can be paralleled to increase the output current capability or reduce the power dissi-
pation in the device at a given current level. It must be noted, however, that the internal wire bond connections
from the die to the power or sense pins of the package must carry current in both of the associated half bridges.
When the two halves of one full bridge (for example OUT1
current rating is not increased since the total current must still flow through one bond wire on the power supply
or sense pin. In addition, the over current detection senses the sum of the current in the upper devices of each
bridge (A or B) so connecting the two halves of one bridge in parallel does not increase the over current detec-
tion threshold.
For most applications the recommended configuration is Half Bridge 1 of Bridge A paralleled with the Half Bridge
1 of the Bridge B, and the same for the Half Bridges 2 as shown in Figure 12. The current in the two devices
connected in parallel will share very well since the R
In this configuration the resulting Bridge has the following characteristics.
- Equivalent Device: FULL BRIDGE
- R
- 2.8A max RMS Load Current
- 5.6A OCD Threshold
Figure 12. Parallel connection for higher current
To operate the device in parallel and maintain a lower over current threshold, Half Bridge 1 and the Half Bridge
2 of the Bridge A can be connected in parallel and the same done for the Bridge B as shown in Figure 13. In
this configuration, the peak current for each half bridge is still limited by the bond wires for the supply and sense
pins so the dissipation in the device will be reduced, but the peak current rating is not increased. This configu-
ration, the resulting bridge has the following characteristics.
- Equivalent Device: FULL BRIDGE
- R
- 1.4A max RMS Load Current
- 2.8A OCD Threshold
DS(ON)
DS(ON)
8-52V
VS
+
GROUND
-
POWER
DC
GROUND
SIGNAL
0.37
0.37
C
1
Typ. Value @ T
Typ. Value @ T
LOAD
C
2
C
BOOT
J
J
D
= 25°C
= 25°C
1
D
2
R
P
SENSE
SENSE
C
VBOOT
OUT1
OUT2
OUT1
OUT2
P
VCP
VS
VS
A
B
A
B
A
A
B
B
DS(ON)
17
14
19
12
3
8
4
18
7
13
of the devices on the same die is well matched.
A
and OUT2
A
) are connected in parallel, the peak
11
20
10
16
15
1
2
9
6
5
EN
EN
IN1
IN2
IN1
IN2
GND
GND
GND
GND
B
A
A
A
B
B
R
C
EN
EN
D02IN1359
EN
L6225
IN1
IN2
13/20