IC MOSFET DRIVR DUAL HS 4A 8MSOP

 

UCC27423DGNR

Manufacturer Part NumberUCC27423DGNR
DescriptionIC MOSFET DRIVR DUAL HS 4A 8MSOP
ManufacturerTexas Instruments
TypeLow Side
UCC27423DGNR datasheets

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Specifications of UCC27423DGNR

ConfigurationLow-SideInput TypeInverting
Delay Time20nsCurrent - Peak4.5A
Number Of Configurations2Number Of Outputs2
Voltage - Supply4 V ~ 15 VOperating Temperature-40°C ~ 105°C
Mounting TypeSurface MountPackage / Case8-MSOP Exposed Pad, 8-HMSOP, 8-eMSOP
Current - Output / Channel4AOn-state Resistance30 Ohm
Current - Peak Output4.5AProductDriver ICs - Various
Rise Time40 nsFall Time40 ns
Supply Voltage (min)4 VSupply Current1.35 mA
Maximum Power Dissipation3000 mWMaximum Operating Temperature+ 105 C
Mounting StyleSMD/SMTMinimum Operating Temperature- 40 C
Number Of Drivers2Driver ConfigurationInverting
Driver TypeLow SideInput Logic LevelCMOS/TTL
Propagation Delay Time150nsOperating Supply Voltage (max)15V
Peak Output Current4APower Dissipation3W
Output Resistance2.2/30OhmOperating Supply Voltage (min)4V
Operating Temp Range-40C to 105COperating Temperature ClassificationIndustrial
MountingSurface MountPin Count8
Package TypeHTSSOP EPLead Free Status / RoHS StatusLead free / RoHS Compliant
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FEATURES
D
Industry-Standard Pin-Out
D
Enable Functions for Each Driver
D
High Current Drive Capability of ±4 A
D
Unique BiPolar and CMOS True Drive Output
Stage Provides High Current at MOSFET
Miller Thresholds
D
TTL/CMOS Compatible Inputs Independent of
Supply Voltage
D
20-ns Typical Rise and 15-ns Typical Fall
Times with 1.8-nF Load
D
Typical Propagation Delay Times of 25 ns with
Input Falling and 35 ns with Input Rising
D
4-V to 15-V Supply Voltage
D
Dual Outputs Can Be Paralleled for Higher
Drive Current
D
Available in Thermally Enhanced MSOP
Package with 4.7°C/W θjc
TM
PowerPAD
D
Rated From –40°C to 105°C
APPLICATIONS
D
Switch Mode Power Supplies
D
DC/DC Converters
D
Motor Controllers
D
Line Drivers
D
Class D Switching Amplifiers
PowerPADt is a trademark of Texas Instruments Incorporated.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
SLUS545B − NOVEMBER 2002 − REVISED NOVEMBER 2004
DESCRIPTION
The UCC27423/4/5 family of high-speed dual MOSFET
drivers can deliver large peak currents into capacitive
loads.Three standard logic options are offered –
dual-inverting, dual-noninverting and one-inverting and
one-noninverting driver. The thermally enhanced 8-pin
TM
PowerPAD
MSOP package (DGN) drastically lowers
the thermal resistance to improve long-term reliability.
It is also offered in the standard SOIC-8 (D) or PDIP-8
(P) packages.
Using a design that inherently minimizes shoot-through
current, these drivers deliver 4-A of current where it is
needed most at the Miller plateau region during the
MOSFET switching transition. A unique BiPolar and
MOSFET hybrid output stage in parallel also allows
efficient current sourcing and sinking at low supply
voltages.
The UCC27423/4/5 provides enable (ENBL) functions
to have better control of the operation of the driver
applications. ENBA and ENBB are implemented on pins
1 and 8 which were previously left unused in the industry
standard pin-out. They are internally pulled up to Vdd for
active high logic and can be left open for standard
operation.
BLOCK DIAGRAM
ENBA
1
INVERTING
INA
2
NON−INVERTING
INVERTING
GND
3
INB
4
NON−INVERTING
Copyright  2003, Texas Instruments Incorporated
www.ti.com
8
ENBB
7
OUTA
VDD
6 VDD
5
OUTB
UDG−01063
1

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UCC27423DGNR Summary of contents

  • Page 1

    ... Class D Switching Amplifiers PowerPADt is a trademark of Texas Instruments Incorporated. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. SLUS545B − NOVEMBER 2002 − REVISED NOVEMBER 2004 ...

  • Page 2

    ... In general, the system designer should attempt to use larger traces on the pc−board where possible in order to spread the heat away form the device more effectively. For information on the PowerPADt package, refer to Technical Brief, PowerPad Thermally Enhanced Package, Texas Instrument s Literature No. SLMA002 and Application Brief, PowerPad Made Easy, Texas Instruments Literature No. SLMA004.  3. The PowerPAD is not directly connected to any leads of the package ...

  • Page 3

    Supply voltage ...

  • Page 4

    SLUS545B − NOVEMBER 2002 − REVISED NOVEMBER 2004 ELECTRICAL CHARACTERISTICS −40°C to 105°C,T DD PARAMETER Switching Time t , rise time (OUTA, OUTB fall time (OUTA, OUTB) F ...

  • Page 5

    INPUT 10 16V 90% OUTPUT 10% 0V Figure 1. Switching Waveforms for (a) Inverting Driver and (b) Noninverting Driver 5V ENBx OUTx 0V Figure 2. Switching Waveform ...

  • Page 6

    SLUS545B − NOVEMBER 2002 − REVISED NOVEMBER 2004 TERMINAL NO. NAME I/O 1 ENBA I Enable input for the driver A with logic compatible threshold and hysteresis. The driver output can be enabled and disabled with this pin ...

  • Page 7

    Input Stage The input thresholds have a 3.3-V logic sensitivity over the full range of V with signals. The inputs of UCC27423/4/5 family of drivers are designed to withstand 500-mA reverse DD current without either damage to ...

  • Page 8

    SLUS545B − NOVEMBER 2002 − REVISED NOVEMBER 2004 Source/Sink Capabilities During Miller Plateau Large power MOSFETs present a large load to the control circuitry. Proper drive is required for efficient, reliable operation. The UCC27423/4/5 drivers have been optimized to provide ...

  • Page 9

    The circuit shown in Figure 3 is used to test the current source capability with the output clamped to around 5 V with a string of Zener diodes. The UCC27423 is found to source 4 ENBA 1 ...

  • Page 10

    SLUS545B − NOVEMBER 2002 − REVISED NOVEMBER 2004 Operational Waveforms and Circuit Layout Figure 5 shows the circuit performance achievable with a single driver (1/2 of the 8-pin IC) driving a 10-nF load. The input pulsewidth (not shown) is set ...

  • Page 11

    Drive Current and Power Requirements The UCC27423/4/5 family of drivers are capable of delivering 4-A of current to a MOSFET gate for a period of several hundred nanoseconds. High peak current is required to turn the device ON quickly. Then, ...

  • Page 12

    SLUS545B − NOVEMBER 2002 − REVISED NOVEMBER 2004 The switching load presented by a power MOSFET can be converted to an equivalent capacitance by examining the gate charge required to switch the device. This gate charge includes the effects of ...

  • Page 13

    ... Gate Drive Circuits, by Laszlo Balogh, Texas Instruments Literature No. SLUP133. 2. Application Note, Practical Considerations in High Performance MOSFET, IGBT and MCT Gate Drive Circuits, by Bill Andreycak, Texas Instruments Literature No. SLUA105 3. Technical Brief, PowerPad Thermally Enhanced Package, Texas Instruments Literature No. SLMA002 4. Application Brief, PowerPAD Made Easy, Texas Instruments Literature No. SLMA004 Related Products ...

  • Page 14

    SLUS545B − NOVEMBER 2002 − REVISED NOVEMBER 2004 SUPPLY CURRENT vs FREQUENCY (VDD = 4.5 V) 100 500 Frequency f - Figure 7 SUPPLY CURRENT vs FREQUENCY (VDD = 12 V) ...

  • Page 15

    TYPICAL CHARACTERISTICS SUPPLY CURRENT vs SUPPLY VOLTAGE (C = 2.2 nF) LOAD MHz 500 kHz − Supply Voltage − V Figure 11 ...

  • Page 16

    SLUS545B − NOVEMBER 2002 − REVISED NOVEMBER 2004 SUPPLY CURRENT vs SUPPLY VOLTAGE (UCC27425) 0.75 0.70 0.65 Input = V DD 0.60 0.55 0.50 Input = 0 V 0.45 0.40 0.35 0. − Supply Voltage ...

  • Page 17

    TYPICAL CHARACTERISTICS DELAY TIME ( SUPPLY VOLTAGE (UCC27423 4 2 470 − Supply Voltage − V ...

  • Page 18

    SLUS545B − NOVEMBER 2002 − REVISED NOVEMBER 2004 OUTPUT BEHAVIOR vs SUPPLY VOLTAGE (INVERTING OUT Between Output and GND 50 µs/div Figure 23 OUTPUT BEHAVIOR vs VDD (INVERTING OUT ...

  • Page 19

    OUTPUT BEHAVIOR vs VDD (NON-INVERTING OUT Between Output and GND 50 µs/div Figure 27 OUTPUT BEHAVIOR vs VDD (NON-INVERTING GND ENBL = VDD VDD Between Output and GND ...

  • Page 20

    SLUS545B − NOVEMBER 2002 − REVISED NOVEMBER 2004 20 TYPICAL CHARACTERISTICS INPUT THRESHOLD vs TEMPERATURE 2.0 1 1.8 1 4.5 V 1.4 1.3 1.2 −50 ...

  • Page 21

    ... Package Type Package Status UCC27423D ACTIVE SOIC UCC27423DG4 ACTIVE SOIC UCC27423DGN ACTIVE MSOP- PowerPAD UCC27423DGNG4 ACTIVE MSOP- PowerPAD UCC27423DGNR ACTIVE MSOP- PowerPAD UCC27423DGNRG4 ACTIVE MSOP- PowerPAD UCC27423DR ACTIVE SOIC UCC27423DRG4 ACTIVE SOIC UCC27423P ACTIVE PDIP UCC27423PE4 ACTIVE PDIP UCC27424D ACTIVE SOIC UCC27424DG4 ...

  • Page 22

    Orderable Device (1) Package Type Package Status UCC27424P ACTIVE PDIP UCC27424PE4 ACTIVE PDIP UCC27425D ACTIVE SOIC UCC27425DG4 ACTIVE SOIC UCC27425DGN ACTIVE MSOP- PowerPAD UCC27425DGNG4 ACTIVE MSOP- PowerPAD UCC27425DGNR ACTIVE MSOP- PowerPAD UCC27425DGNRG4 ACTIVE MSOP- PowerPAD UCC27425DR ACTIVE SOIC UCC27425DRG4 ...

  • Page 23

    MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date ...

  • Page 24

    ... TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Type Drawing UCC27423DGNR MSOP- DGN Power PAD UCC27423DR SOIC UCC27424DGNR MSOP- DGN Power PAD UCC27424DR SOIC UCC27425DGNR MSOP- DGN Power PAD UCC27425DR SOIC PACKAGE MATERIALS INFORMATION Pins SPQ Reel ...

  • Page 25

    ... Device Package Type UCC27423DGNR MSOP-PowerPAD UCC27423DR SOIC UCC27424DGNR MSOP-PowerPAD UCC27424DR SOIC UCC27425DGNR MSOP-PowerPAD UCC27425DR SOIC PACKAGE MATERIALS INFORMATION Package Drawing Pins SPQ Length (mm) DGN 8 2500 D 8 2500 DGN 8 2500 D 8 2500 DGN 8 2500 D 8 2500 Pack Materials-Page 2 ...

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  • Page 32

    ... Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’ ...

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