MC33886DH Freescale Semiconductor, MC33886DH Datasheet
MC33886DH
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MC33886DH Summary of contents
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... Pb-Free Packaging Designated by Suffix Code VW OUT MCU OUT OUT OUT Freescale Semiconductor, Inc. reserves the right to change the detail specifications, as may be required, to permit improvements in the design of its products. © Freescale Semiconductor, Inc., 2007. All rights reserved. MC33886DH/R2 MC33886VW/R2 33886 5 OUT1 IN FS IN1 ...
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... INTERNAL BLOCK DIAGRAM CCP C CP Charge Charge Pump Pump Current Limit, Current Limit, Short Circuit Sense Circuit Gate Drive Gate Drive Over- Over- temperature temperature Undervoltage Undervoltage V PWR V+ Overcurrent Sense Circuit OUT1 OUT2 PGND Analog Integrated Circuit Device Data Freescale Semiconductor ...
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... PGND Power Ground 13 D2 Disable 2 14, 15 OUT2 H-Bridge Output 2 Charge Pump Capacitor External reservoir capacitor connection for internal charge pump capacitor. 17 CCP 18 D1 Disable 1 19 IN2 Logic Input Control 2 Analog Integrated Circuit Device Data Freescale Semiconductor PIN CONNECTIONS AGND IN1 OUT1 ...
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... R ZAP Value Unit 40 V -0.1 to 7.0 V 7 (6) ±2000 ±200 V ±2000 ±200 °C -65 to 150 °C -40 to 125 °C -40 to 150 °C Note 8. °C/W ~5.0 = 1500 Ω). ZAP = 0 Ω). ZAP (junction-to-PC board) θ JB Analog Integrated Circuit Device Data Freescale Semiconductor ...
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... Refer to typical operating curves to extrapolate values for operation > but ≤ 12. Inputs IN1, IN2, and D1 have independent internal pull-up current sources. 13. The D2 input incorporates an active internal pull-down current sink. Analog Integrated Circuit Device Data Freescale Semiconductor ≤ ≤ ≤ ≤ and -40° ...
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... A 5.2 6.5 7 – – A 8.0 – – µA – 100 200 – – – 2.0 °C 175 – – – 15 – µA – – – – 1.0 Analog Integrated Circuit Device Data Freescale Semiconductor ...
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... Active current limiting will cause junction temperatures to rise. A junction temperature ° above 160 C will cause the active current limiting to progressively “fold-back” (or decrease) to 2.5 A typical at 175 latch-OFF will occur. See Figure 7, page 8. Analog Integrated Circuit Device Data Freescale Semiconductor ≤ ≤ ≤ ≤ and -40°C T 125° ...
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... Figure 7. Active Current Limiting Versus Temperature (Typical) 33886 8 TIMING DIAGRAMS 50% 50 d(OFF) d(ON) 90% TIME Figure 4. Output Delay Time Figure 5. Disable Delay Time t f 90% 10% 10% Figure 6. Output Switching Time 160 175 JUNCTION TEMPERATURE ( C) 10 90% Thermal Shutdown Analog Integrated Circuit Device Data Freescale Semiconductor ...
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... Outputs Outputs Tristated Tri-stated [0] Figure 8. Active Current Limiting Versus Time 8.0 6.5 Analog Integrated Circuit Device Data Freescale Semiconductor Diode Reverse Recovery Spikes Load Capacitance and/or Diode Reverse Recovery Spikes PWM Active Current Current Hard Short Detect and Latch-OFF Limiting ...
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... OUT Input Voltage (IN1) Figure 13. Output Voltage and Current vs. Input Voltage PMW Frequency of 1.0 kHz, Duty Cycle=50% V+= =1.0 kHz Duty Cycle=90% PWM Current Limiting Mode V+= =1.0 kHz Duty Cycle=90% PWM and Duty Cycle of 90% Analog Integrated Circuit Device Data Freescale Semiconductor ...
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... V+= =10 kHz PWM Figure 15. Output Voltage and Current vs. Input Voltage PMW Frequency of 10 kHz, and Duty Cycle of 90% Analog Integrated Circuit Device Data Freescale Semiconductor Output Voltage (OUT1) I OUT Input Voltage (IN1) Duty Cycle=50% Figure 16. Output Voltage and Current vs. Input Voltage ...
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... When a short circuit or overtemperature condition is detected, the power outputs are tri-state latched-OFF independent of the input signals and the fault status flag is set logic Low. 33886 12 . The truth table uses the following notations Low, D2 Input Conditions D1 D2 IN1 IN2 Fault Status Output States Flag FS OUT1 OUT2 Analog Integrated Circuit Device Data Freescale Semiconductor ...
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... Figure 18. Typical High-Side R 0.13 0.128 0.126 0.124 0.122 0. Figure 19. Typical Low-Side R Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL PERFORMANCE CURVES Volts Versus V+ DS(ON Volts V PWR Versus V+ DS(ON) ELECTRICAL PERFORMANCE CURVES 33886 13 ...
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... ELECTRICAL PERFORMANCE CURVES 9.0 8.0 7.0 6.0 5.0 4.0 3.0 2.0 1.0 0 Figure 20. Typical Quiescent Supply Current Versus V+ 33886 Volts V PWR Analog Integrated Circuit Device Data Freescale Semiconductor ...
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... High. Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DESCRIPTION INTRODUCTION external pull-up resistor is required for the open drain FS pin for fault status reporting. ...
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... PGND. The device C CP can operate without the external capacitor, although the capacitor helps to reduce noise and allows the device to perform at maximum speed, timing, and PWM frequency. Analog Integrated Circuit Device Data Freescale Semiconductor C CP ...
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... This feature allows the device to remain operational for a longer time but at a regressing output performance level at junction temperatures above 160°C. Analog Integrated Circuit Device Data Freescale Semiconductor OVERTEMPERATURE SHUTDOWN AND HYSTERESIS If an overtemperature condition occurs, the power outputs are tri-state (latched-OFF) independent of the input signals and the fault status flag is set logic Low ...
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... PERFORMANCE Figure 22 shows the thermal response with the device soldered on to the test PCB described in 100 10 2 Rth (°C/W) 1 0,1 0,001 0,01 Figure 22. 33886 Thermal Response Bottom Side Figure 21. 0 100 1000 10000 t, Time (s) Analog Integrated Circuit Device Data Freescale Semiconductor ...
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... A typical application schematic is shown in precision high-current applications in harsh, noisy IN2 IN1 Figure 23. 33886 Typical Application Schematic Analog Integrated Circuit Device Data Freescale Semiconductor TYPICAL APPLICATIONS Figure 23. For environments, the V+ by-pass capacitor may need to be substantially larger. DC MOTOR 33886 AGND OUT1 OUT2 ...
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... E 13.950 14.450 E1 10.900 11.100 E2 2.500 2.700 E3 6.400 7.200 E4 2.700 2.900 0.840 1.100 L1 0.350 BSC b 0.400 0.520 b1 0.400 0.482 c 0.230 0.320 c1 0.230 0.280 e 1.270 BSC h ––– 1.100 0 8 aaa 0.200 bbb 0.100 Analog Integrated Circuit Device Data Freescale Semiconductor ...
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... JEDEC JESD51-3 and JESD51-5. 5.Thermal resistance between the die junction and the exposed pad surface; cold plate attached to the package bottom side, remaining surfaces insulated. Analog Integrated Circuit Device Data Freescale Semiconductor ), and thermal J P [°C/ ...
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... R is the thermal resistance between die junction and the θ JS reference location on the board surface near a center lead of the Figure 25 package (see 2 °C/W Area A (mm ) 0.0 52 300 36 600 32 0.0 10 300 7.0 600 6.0 ). Analog Integrated Circuit Device Data Freescale Semiconductor ...
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... Figure 26. Device on Thermal Test Board R 100 10 1 0.1 1.00E-03 1.00E-02 1.00E-01 1.00E+00 1.00E+01 1.00E+02 1.00E+03 1.00E+04 Device on Thermal Test Board Area A = 600 (mm Analog Integrated Circuit Device Data Freescale Semiconductor R x θJA 0 300 Heat spreading area A [mm² θJA Time(s) Figure 27. Transient Thermal Resistance R 5 ...
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... Updated data sheet format 2/2007 8.0 • Removed Peak Package Reflow Temperature During Reflow (solder reflow) parameter from Maximum Ratings on page www.freescale.com. 33886 24 REVISION HISTORY DESCRIPTION OF CHANGES 4. Added note with instructions to obtain this information from Analog Integrated Circuit Device Data Freescale Semiconductor ...
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... Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer ...