IC PFC CONTROLLER CCM 8DIP

TEA1532AP/N1,112

Manufacturer Part NumberTEA1532AP/N1,112
DescriptionIC PFC CONTROLLER CCM 8DIP
ManufacturerNXP Semiconductors
SeriesGreenChip™ II
TEA1532AP/N1,112 datasheet
 

Specifications of TEA1532AP/N1,112

ModeContinuous Conduction (CCM)Frequency - Switching63kHz
Current - Startup1.2mAVoltage - Supply11 V ~ 20 V
Operating Temperature-25°C ~ 70°CMounting TypeThrough Hole
Package / Case8-DIP (0.300", 7.62mm)Mounting StyleSMD/SMT
Lead Free Status / RoHS StatusLead free / RoHS CompliantOther names568-3314-5
935278106112
TEA1532APN
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TEA1532(A)P; TEA1532(A)T
GreenChip II SMPS control IC
Rev. 02 — 4 February 2005
1. General description
The GreenChip™II is the second generation of green Switched Mode Power Supply
(SMPS) controller ICs. Its high level of integration allows the design of a cost effective
power supply with a very low number of external components.
The TEA1532(A)P; TEA1532(A)T can also be used in fixed frequency, Continuous
Conduction Mode (CCM) converter designs for low voltage, high current applications. At
low power (standby) levels, the system operates in cycle skipping mode which minimizes
the switching losses during standby.
The special built-in green functions allow the efficiency to be optimum at all power levels.
This holds for quasi-resonant operation at high power levels, as well as fixed frequency
operation with valley switching at medium power levels. At low power (standby) levels, the
system operates in cycle skipping mode with valley detection.
The proprietary high voltage BCD800 process makes direct start-up possible from the
rectified universal mains voltage in an effective and green way. A second low voltage
BICMOS IC is used for accurate, high speed protection functions and control.
The TEA1532(A)P; TEA1532(A)T enables highly efficient and reliable supplies to be
designed easily.
2. Features
2.1 Distinctive features
Universal mains supply operation (70 V to 276 V AC)
High level of integration, resulting in a very low external component count
Fixed frequency Continuous Conduction Mode (CCM) operation capability
Quasi-Resonant (QR) Discontinuous Conduction Mode (DCM) operation capability.
2.2 Green features
Valley or zero voltage switching for minimum switching losses in QR operation
Cycle skipping mode at very low loads; input power < 300 mW at no-load operation for
a typical adapter application
On-chip start-up current source.
2.3 Protection features
Safe restart mode for system fault conditions
Zero current switch-on in QR mode
Product data sheet

TEA1532AP/N1,112 Summary of contents

  • Page 1

    TEA1532(A)P; TEA1532(A)T GreenChip II SMPS control IC Rev. 02 — 4 February 2005 1. General description The GreenChip™II is the second generation of green Switched Mode Power Supply (SMPS) controller ICs. Its high level of integration allows the design of ...

  • Page 2

    Philips Semiconductors Undervoltage protection (foldback during overload) IC OverTemperature Protection (OTP) (latched) Low and adjustable OverCurrent Protection (OCP) trip level Soft (re)start Mains voltage-dependent operation-enabling level TEA1532AP and TEA1532AT: General purpose input for latched or safe restart protection and timing, ...

  • Page 3

    Philips Semiconductors 5. Block diagram internal supply GND OSCILLATOR SLOPE COMPENSATION I slopecomp 4 CTRL 1 5.6 V control detect 0. charge 3 PROTECT 300 5 discharge (1) Switch ...

  • Page 4

    Philips Semiconductors 6. Pinning information 6.1 Pinning PROTECT Fig 2. Pin configuration: TEA1532(A)T 6.2 Pin description Table 2: Symbol V CC GND PROTECT CTRL DEM SENSE DRIVER DRAIN 7. Functional description The TEA1532(A)P; TEA1532(A)T is the controller of a compact ...

  • Page 5

    Philips Semiconductors Fig 4. Typical configuration The TEA1532(A)P; TEA1532(A)T can operate in multi modes; see Fig 5. Multi mode and FF-CCM operation In QR mode, the next converter stroke is started only after demagnetization of the transformer current (zero current ...

  • Page 6

    Philips Semiconductors In fixed frequency continuous conduction mode, which can be activated by grounding pin DEM, the internal oscillator determines the start of the next converter stroke. In both operating modes, a cycle skipping mode is activated at very low ...

  • Page 7

    Philips Semiconductors 7.4 Oscillator The fixed frequency of the oscillator is set by an internal current source and capacitor. 7.5 Cycle skipping At very low power levels, a cycle skipping mode activates. An internal control voltage (V sense(max) this voltage ...

  • Page 8

    Philips Semiconductors on-time. Slope compensation can be adjusted by changing the value of R compensation prevents modulation of the on-time (duty cycle) while operating in FF CCM. A possible drawback of sub-harmonic oscillation can be output voltage ripple. The source ...

  • Page 9

    Philips Semiconductors • When the voltage on pin CTRL is below 0.63 V, the IC is assumed to be out of regulation (e.g. the control loop is open). In this case activating pin PROTECT (V PROTECT V UVLO repeated until ...

  • Page 10

    Philips Semiconductors (1) Start of new cycle at lowest drain voltage. (2) Start of new cycle in a classical PWM system at high drain voltage. Fig 8. Signals for valley switching 7.14 Brown-out protection During the so called brown-out test, ...

  • Page 11

    Philips Semiconductors When pin DEM is grounded (CCM), the brown-out protection is disabled. In this case the duty cycle is limited to 0. low mains voltage the on-time is limited and therefore the dissipation in the FET is ...

  • Page 12

    Philips Semiconductors 7.17 Driver The driver circuit to the gate of the power MOSFET has a current sourcing capability of typically 170 mA and a current sink capability of typically 700 the current ...

  • Page 13

    Philips Semiconductors 9. Thermal characteristics Table 4: Thermal characteristics Symbol Parameter R thermal resistance from th(j-a) junction to ambient 10. Characteristics Table 5: Characteristics all voltages are measured with respect to ground ...

  • Page 14

    Philips Semiconductors Table 5: Characteristics …continued all voltages are measured with respect to ground (pin 2); currents are positive when flowing into amb CC the IC; unless otherwise specified. Symbol Parameter Oscillator ...

  • Page 15

    Philips Semiconductors Table 5: Characteristics …continued all voltages are measured with respect to ground (pin 2); currents are positive when flowing into amb CC the IC; unless otherwise specified. Symbol Parameter Temperature ...

  • Page 16

    Philips Semiconductors Fig 10. Flyback configuration using the discontinuous conduction mode 9397 750 14319 Product data sheet TEA1532(A)P; TEA1532(A)T V mains GND TEA1532T 2 TEA1532AT PROTECT TEA1532P 3 TEA1532AP CTRL 4 R CTRL Rev. 02 ...

  • Page 17

    Philips Semiconductors DRAIN start DRIVER V PROTECT (1) In CCM, the brown-out protection is implemented by the maximum duty cycle in combination Fig 11. Typical waveforms 1 9397 750 ...

  • Page 18

    Philips Semiconductors (1) When V (2) External OTP for TEA1532T, TEA1532P, TEA1532AT and TEA1532AP; OVP and output short Fig 12. Typical waveforms 2 9397 750 14319 Product data sheet TEA1532(A)P; TEA1532(A DRAIN ...

  • Page 19

    Philips Semiconductors (1) Pin PROTECT is used in this example for external OTP and open loop or output short-circuit Fig 13. Flyback configuration using the continuous conduction mode 12. Test information 12.1 Quality information The General Quality Specification for Integrated ...

  • Page 20

    Philips Semiconductors 13. Package outline SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

  • Page 21

    Philips Semiconductors DIP8: plastic dual in-line package; 8 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. mm 4.2 0.51 ...

  • Page 22

    Philips Semiconductors 14. Soldering 14.1 Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 ...

  • Page 23

    Philips Semiconductors – for packages with a thickness – for packages with a thickness < 2.5 mm and a volume thick/large packages. • below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a thickness < ...

  • Page 24

    Philips Semiconductors 14.4 Package related soldering information Table 6: Suitability of IC packages for wave, reflow and dipping soldering methods Mounting Package Through-hole mount CPGA, HCPGA DBS, DIP, HDIP, RDBS, SDIP, SIL [4] Through-hole-surface PMFP mount Surface mount BGA, HTSSON..T ...

  • Page 25

    Philips Semiconductors 15. Revision history Table 7: Revision history Document ID Release date TEA1532_2 20050204 • Modifications: Products TEA1532AT and TEA1532AP added: – Updated – Updated – Changed product numbers in • Added note to • Modified TEA1532_1 20040528 9397 ...

  • Page 26

    Philips Semiconductors 16. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...

  • Page 27

    Philips Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...