SA56004ED,112 NXP Semiconductors, SA56004ED,112 Datasheet
SA56004ED,112
Specifications of SA56004ED,112
935274549112
SA56004ED
Related parts for SA56004ED,112
SA56004ED,112 Summary of contents
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... Rev. 05 — 22 May 2008 1. General description The NXP Semiconductors SA56004X is an SMBus compatible, 11-bit remote/local digital temperature sensor with overtemperature alarms. The remote channel of the SA56004X monitors a diode junction, such as a substrate PNP of a microprocessor or a diode connected transistor such as the 2N3904 (NPN) or 2N3906 (PNP) ...
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... NXP Semiconductors 3. Applications I System thermal management in laptops, desktops, servers and workstations I Computers and office electronic equipment I Electronic test equipment and instrumentation I HVAC I Industrial controllers and embedded systems 4. Ordering information Table 1. Ordering information [1] Type number Package Name Description SA56004AD SO8 plastic small outline package; 8 leads; body width 3.9 mm ...
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... NXP Semiconductors Table 2. Type number SA56004CD SA56004CDP SA56004DD SA56004DDP SA56004ED SA56004EDP SA56004ETK SA56004FD SA56004FDP SA56004FTK SA56004GD SA56004GDP SA56004HD SA56004HDP [1] The device slave address is factory programmed in OTP device address register. [2] The SA56004ED/EDP/ETK has the bus address of the National LM86, MAX6657/8 and the ADM1032. ...
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... NXP Semiconductors 6. Pinning information 6.1 Pinning T_CRIT Fig 2. Fig 4. 6.2 Pin description Table 3. Symbol T_CRIT GND ALERT SDATA SCLK SA56004X_5 Product data sheet Digital temperature sensor with overtemperature alarms SCLK SDATA SA56004XD ALERT 4 5 GND 002aad198 Pin configuration for SO8 ...
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... NXP Semiconductors 7. Functional description Refer to 7.1 Serial bus interface The SA56004X should be connected to a compatible two-wire serial interface System Management Bus (SMBus slave device using the two device terminals SCLK and SDATA. The ALERT pin can optionally be used with the SMBus protocol to implement the ARA response ...
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... NXP Semiconductors Table 4. Register assignments Register Command byte name Read Write address address LTHB 00h n/a RTHB 01h n/a SR 02h n/a CON 03h 09h CR 04h 0Ah LHS 05h 0Bh LLS 06h 0Ch RHSHB 07h 0Dh RLSHB 08h 0Eh One Shot n/a ...
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... NXP Semiconductors 8. Local LOW setpoint (LLS) and Remote LOW temperature setpoints (RLSHB Conversion Rate register (CR) is set to 8h; the default value of about 16 conversions/s. 7.5 Starting conversion Upon POR, the RUN/STOP bit 6 of the configuration register is zero (default condition), then, the device will enter into its free-running operation mode in which the device A/D converter is enabled and the measurement function is activated ...
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... NXP Semiconductors Table 5. Temperature +125 C + +0.125 0.125 7.8 SA56004X SMBus registers 7.8.1 Command register The command register selects which register will be read or written to. Data for this register should be transmitted during the Command Byte of the SMBus write communication. 7.8.2 Local and remote temperature registers (LTHB, LTLB, RTHB, RTLB) Table 6 ...
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... NXP Semiconductors Table 7. Bit 7.8.4 Status register (SR) The contents of the status register reflect condition status resulting from all activities: comparison between temperature measurements and temperature limits, the status of A/D conversion, and the hardware condition of external diode to the device. Bit assignments are listed in POR, all bits are set to zero ...
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... NXP Semiconductors 7.8.5 Conversion rate register (CR) The conversion rate register is used to store programmable conversion data, which defines the time interval between conversions in the standard free-running auto convert mode. Table 9 4 LSBs of the register are used and the other bits are reserved for future use. The register is R/W using the read address 04h and write address 0Ah ...
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... NXP Semiconductors Table 13. Byte Bit Value [1] POR default TH = 0Ah (10 C). 7.8.7 Programmable offset register (remote only) Table 14. RTOHB, RTOLB - Remote temperature offset registers Byte High byte (read/write address 11h) Bit Value sign 64 32 [1] POR default RTOHB = RTOLB = 00h. [2] POR default RTOLB = 00h. ...
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... NXP Semiconductors 7.9 Interruption logic and functional description 7.9.1 ALERT output The ALERT output is used to signal Alert interruptions from the device to the SMBus or other system interrupt handler and it is active LOW. Because this is an open-drain output, a pull-up resistor (typically common interrupt line on the same SMBus. ...
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... NXP Semiconductors remote temperature high limit Fig 5. The following events summarize the ALERT output interrupt mode of operation: Event A: Master senses ALERT output being active-LOW. Event B: Master reads the SA56004X Status register to determine what cause the ALERT interrupt. Event C: SA56004X clears the Status register, resets the ALERT output HIGH, and sets the ALERT mask bit 7 in the Confi ...
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... NXP Semiconductors Status register, at address 02h, during the interrupt service routine and then reset the ALERT mask bit 7 in the Configuration register to logic 0 at the end of the interrupt service routine (see In order for the SA56004X to respond to the ARA command, the bit D0 in the ALERT mode register must be set LOW ...
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... NXP Semiconductors Table 16. ALERT response bit 7 (MSB 7.9.2 T_CRIT output The T_CRIT output is LOW when any temperature reading is greater than the preset limit in the corresponding critical temperature setpoint register. When one of the T_CRIT setpoint temperatures is exceeded, the appropriate status register bit, 1 (RCRIT (LCRIT), is set. After every local and remote temperature conversion the status register fl ...
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... NXP Semiconductors Event C: The Status register bit 1 (RCRIT) is reset by a read of the Status register (in the interrupt mode). 7.9.3 Fault Queue To suppress erroneous ALERT or T_CRIT triggering, the SA56004X implements a Fault Queue for both local and remote channel. The Fault Queue insures a temperature measurement is genuinely beyond a HIGH, LOW or T_CRIT setpoint by not triggering until three consecutive out-of-limit measurements have been made ...
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... NXP Semiconductors Event F: Three consecutive measurements have been made with the remote temperature below the RCS HIGH). Event G: The remote temp falls below the Remote LOW setpoint. Event H: Three consecutive measurements are made with the temp below the Remote LOW setpoint; ALERT output is activated (goes LOW). ...
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... NXP Semiconductors LOW. Furthermore, if the Remote HIGH Setpoint High Byte (RHSHB) register is set to a value less than +127 C and the Alert Mask is disabled, then the ALERT output will be pulled LOW. Note that the OPEN bit itself will not trigger an ALERT. When the D+ pin is shorted to ground the Remote Temperature High Byte (RTHB) register is loaded with 128 C (1000 0000) and the OPEN (bit 2 in the Status register) will not be set ...
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... NXP Semiconductors 1 2 SCLK a6 a5 SDATA S START 1 2 SCLK SDATA data to be written to register a. Write Byte format (to write a data byte to the device register SCLK SDATA S START device address SCLK SDATA S RESTART device address b. Read Byte format (to read a data byte from the device register) ...
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... NXP Semiconductors 7.10.1 Serial interface reset If the SMBus master attempts to reset the SA56004X while the SA56004X is controlling the data line and transmitting on the data line, the SA56004X must be returned to a known state in the communication protocol. This may be accomplished in two ways: 1. When the SDATA is LOW, the SA56004X SMBus state machine resets to the SMBus idle state if SCLK is held LOW for more than 35 ms (maximum TIMEOUT period). According to SMBus specifi ...
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... NXP Semiconductors 9. Limiting values Table 17. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND. Symbol Parameter V supply voltage DD voltage at SDATA, SCLK, ALERT, T_CRIT V voltage at positive diode input D+ V voltage at negative diode input D I sink current ...
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... NXP Semiconductors 10. Characteristics Table 18. Electrical characteristics +125 C; unless otherwise specified. DD amb Symbol Parameter T local temperature error ERRL T remote temperature error ERRR T remote temperature RESR resolution T local temperature resolution RESL T conversion period conv V supply voltage DD I quiescent current DD shut-down current ...
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... NXP Semiconductors Table 19. SMBus interface characteristics +125 C; unless otherwise specified. DD amb These specifications are guaranteed by design and not tested in production. Symbol Parameter V HIGH-level input voltage IH V LOW-level input voltage IL I LOW-level output current OL I LOW-level output current OH I LOW-level input current ...
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... NXP Semiconductors t LOW SCLK t HD;STA SDATA t BUF P S Fig 11. Timing measurements SA56004X_5 Product data sheet Digital temperature sensor with overtemperature alarms HIGH t HD;DAT SU;STA t SU;DAT Rev. 05 — 22 May 2008 SA56004X t HD;STA t SU;STO S 002aad237 © NXP B.V. 2008. All rights reserved ...
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... NXP Semiconductors 11. Performance curves 5 3.6 V shutdown 3 3 Fig 12. Typical I shutdown versus temperature and 400 3.6 V quiescent 3 3.0 V 300 200 100 Fig 14. Typical I quiescent current versus DD temperature and V DD (conversion rate = 0.06 Hz) SA56004X_5 Product data sheet Digital temperature sensor with overtemperature alarms ...
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... NXP Semiconductors 5 3.6 V (mA) 3 Fig 16. Typical T_CRIT I versus temperature and 0 2.80 UVL (V) 2.78 2. 3.6 V 2.72 3.3 V 3 Fig 18. Typical UVL versus temperature and V SA56004X_5 Product data sheet Digital temperature sensor with overtemperature alarms 002aad232 (mA 100 125 ...
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... NXP Semiconductors 12. Package outline SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors TSSOP8: plastic thin shrink small outline package; 8 leads; body width pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 0. terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.25 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
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... NXP Semiconductors 13. Packing information The SA56004X is packed in reels, as shown in guard band barcode label Fig 23. Tape and reel packing method 14. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” ...
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... NXP Semiconductors Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. ...
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... NXP Semiconductors Table 21. Package thickness (mm) < 1.6 1.6 to 2.5 > 2.5 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Fig 24. Temperature profiles for large and small components For further information on temperature profi ...
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... NXP Semiconductors 2. Route the D+ and D lines parallel and close together with ground guards enclosing them (see 3. Leakage currents due to printed-circuit board contamination must be considered. Error can be introduced by these leakage currents. 4. Use wide traces to reduce inductance and noise pick-up. Narrow traces more readily pick up noise ...
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... Release date SA56004X_5 20080522 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Added HVSON8 package option • ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Functional description . . . . . . . . . . . . . . . . . . . 5 7.1 Serial bus interface . . . . . . . . . . . . . . . . . . . . . . 5 7.2 Slave address . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.3 Register overview . . . . . . . . . . . . . . . . . . . . . . . 5 7.4 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 6 7 ...