ADM1032AR

Manufacturer Part NumberADM1032AR
DescriptionIC TEMP MONITOR 85DEG C 8SOIC
ManufacturerON Semiconductor
ADM1032AR datasheet
 


Specifications of ADM1032AR

Rohs StatusRoHS non-compliantFunctionTemp Monitoring System (Sensor)
TopologyADC, Comparator, Multiplexer, Register BankSensor TypeExternal & Internal
Sensing Temperature0°C ~ 100°C, External SensorOutput TypeSMBus™
Output AlarmYesOutput FanYes
Voltage - Supply3 V ~ 5.5 VOperating Temperature0°C ~ 100°C
Mounting TypeSurface MountPackage / Case8-SOIC (3.9mm Width)
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−X−
A
8
5
S
B
0.25 (0.010)
1
4
−Y−
G
C
SEATING
PLANE
−Z−
H
D
0.25 (0.010)
M
Z
Y
S
X
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AJ
Y
M
M
K
N
_
X 45
0.10 (0.004)
M
J
S
SOLDERING FOOTPRINT*
1.52
0.060
7.0
4.0
0.275
0.155
0.6
1.270
0.024
0.050
SCALE 6:1
http://onsemi.com
17
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
MILLIMETERS
INCHES
DIM
MIN
MAX
MIN
MAX
A
4.80
5.00
0.189
0.197
B
3.80
4.00
0.150
0.157
C
1.35
1.75
0.053
0.069
D
0.33
0.51
0.013
0.020
G
1.27 BSC
0.050 BSC
H
0.10
0.25
0.004
0.010
J
0.19
0.25
0.007
0.010
K
0.40
1.27
0.016
0.050
_
_
_
_
M
0
8
0
8
N
0.25
0.50
0.010
0.020
S
5.80
6.20
0.228
0.244
mm
inches