GNM314R72A102KD01D Murata Electronics North America, GNM314R72A102KD01D Datasheet - Page 86

CAP 4-ARRAY 1000PF 100V X7R 1206

GNM314R72A102KD01D

Manufacturer Part Number
GNM314R72A102KD01D
Description
CAP 4-ARRAY 1000PF 100V X7R 1206
Manufacturer
Murata Electronics North America
Series
GNMr
Datasheet

Specifications of GNM314R72A102KD01D

Capacitance
1000pF
Voltage - Rated
100V
Dielectric Material
Ceramic
Number Of Capacitors
4
Circuit Type
Isolated
Temperature Coefficient
X7R
Tolerance
±10%
Mounting Type
Surface Mount
Package / Case
1206 (3216 Metric)
Height
0.031" (0.80mm)
Size / Dimension
0.126" L x 0.063" W (3.20mm x 1.60mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
490-3421-2
13
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
3. Reflow Soldering
Table 1
Recommended Conditions
84
Peak Temperature
!Caution
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Inverting the PCB
Optimum Solder Amount for Reflow Soldering
When sudden heat is applied to the components, the
mechanical strength of the components should go down
because remarkable temperature change causes
deformity inside components. In order to prevent
mechanical damage in the components, preheating should
be required for both of the components and the PCB board.
Preheating conditions are shown in table 1. It is required to
keep temperature differential between the soldering and
the components surface ( T) as small as possible.
Solderability of Tin plating termination chip might be
deteriorated when low temperature soldering profile where
peak solder temperature is below the Tin melting point is
used. Please confirm the solderability of Tin plating
termination chip before use.
When components are immersed in solvent after mounting,
be sure to maintain the temperature difference ( T)
between the component and solvent within the range
shown in the table 1.
Make sure not to impose an abnormal mechanical shock on
the PCB.
Atmosphere
Continued from the preceding page.
GRM02/03/15/18/21/31
GJM03/15
LLL15/18/21/31
ERB18/21
GQM18/21
GRM32/43/55
LLA18/21/31
LLM21/31
GNM
ERB32
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Overly thick application of solder paste results in
Too little solder paste results in a lack of adhesive
Make sure the solder has been applied smoothly to the
excessive fillet height solder.
This makes the chip more susceptible to mechanical
and thermal stress on the board and may cause
cracked chips.
strength on the outer electrode, which may result in
chips breaking loose from the PCB.
end surface to a height of 0.2mm min.
Part Number
Infrared Reflow
230-250 C
Air
Pb-Sn Solder
Vapor Reflow
230-240 C
Air
Temperature Differential
TV190D
TV130D
Lead Free Solder
240-260 C
Air or N
2
[Standard Conditions for Reflow Soldering]
[Allowable Soldering Temperature and Time]
[Optimum Solder Amount for Reflow Soldering]
Peak Temperature
Peak Temperature
Temperature (D)
Temperature (D)
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
280
270
260
250
240
230
220












200 C
170 C
150 C
130 C
170 C
150 C
130 C
0






Infrared Reflow
Vapor Reflow
T
T
30
60-120 seconds 30-60 seconds
60-120 seconds







Preheating
Preheating
60
Continued on the following page.
Soldering
20 seconds max.
Soldering
Soldering Time (sec.)
90
Gradual
Cooling
Gradual
Cooling
Time
Time
0.2mm min.
120
C02E.pdf
07.2.6

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