GNM314R72A102KD01D Murata Electronics North America, GNM314R72A102KD01D Datasheet - Page 88

CAP 4-ARRAY 1000PF 100V X7R 1206

GNM314R72A102KD01D

Manufacturer Part Number
GNM314R72A102KD01D
Description
CAP 4-ARRAY 1000PF 100V X7R 1206
Manufacturer
Murata Electronics North America
Series
GNMr
Datasheet

Specifications of GNM314R72A102KD01D

Capacitance
1000pF
Voltage - Rated
100V
Dielectric Material
Ceramic
Number Of Capacitors
4
Circuit Type
Isolated
Temperature Coefficient
X7R
Tolerance
±10%
Mounting Type
Surface Mount
Package / Case
1206 (3216 Metric)
Height
0.031" (0.80mm)
Size / Dimension
0.126" L x 0.063" W (3.20mm x 1.60mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
490-3421-2
13
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
6. Correction with a Soldering Iron
(1) For Chip Type Capacitors
7. Washing
FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY
RESULT, WORST CASE, IN A SHORT CIRCUIT AND
FUMING WHEN THE PRODUCT IS USED.
86
!Caution
Optimum Solder Amount when Corrections Are Made
When sudden heat is applied to the components by
soldering iron, the mechanical strength of the
components should go down because remarkable
temperature change causes deformity inside components.
In order to prevent mechanical damage in the
components, preheating should be required for both of
the components and the PCB board. Preheating
conditions are shown in table 3. It is required to keep
temperature differential between the soldering and the
components surface ( T) as small as possible. After
soldering, it is not allowed to cool it down rapidly.
Using a Soldering lron
The top of the solder fillet should be lower than the
thickness of components. If the solder amount is
excessively big, the risk of cracking is higher during
board bending or under any other stressful conditions.
Soldering iron ø3mm or smaller should be required. And
it is necessary to keep a distance between the soldering
iron and the components without direct touch. Thread
solder with ø0.5mm or smaller is required for soldering.
Excessive output of ultrasonic oscillation during cleaning
causes PCBs to resonate, resulting in cracked chips or
broken solder. Take note not to vibrate PCBs.
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Table 3
GRM15/18/21/31
GJM15
LLL15/18/21/31
GQM18/21
ERB18/21
GRM32/43/55
GNM
LLA18/21/31
LLM21/31
ERB32
*Applicable for both Pb-Sn and Lead Free Solder.
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Part Number
Temperature
Differential
TV190D
TV130D
3 seconds max.
3 seconds max.
Temperature
/ termination
/ termination
300 C max.
270 C max.
Peak
Up to Chip Thickness
Atmosphere
Air
Air
C02E.pdf
07.2.6

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