FAN2106EMPX Fairchild Semiconductor, FAN2106EMPX Datasheet - Page 4

• Manufacturer Part Number: FAN2106EMPX
• Description: IC BUCK SYNC ADJ 6A 25MLP
• Manufacturer: Fairchild Semiconductor
• Series: TinyBuck™r
• Type: Step-Down (Buck)r

Specifications of FAN2106EMPX

• Internal Switch(s): Yes
• Synchronous Rectifier: Yes
• Number Of Outputs: 1
• Voltage - Output: 3 ~ 21 V
• Current - Output: 6A
• Frequency - Switching: 300kHz ~ 600kHz
• Voltage - Input: 3 ~ 24 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 25-MLP
• Power - Output: 2.8W
• Output Voltage: 3.2 V
• Output Current: 6 A
• Switching Frequency: 600 KHz
• Input / Supply Voltage (max): 24 V
• Input / Supply Voltage (min): 3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Efficiency: 95 %
• Minimum Operating Temperature: - 40 C
• Operating Temperature Range: - 40 C to + 85 C
• Output Power: 2.8 W
• Supply Current: 8 mA
• For Use With: FEB167 - BOARD EVAL FOR FAN2106
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: FAN2106EMPXTR

© 2009 Fairchild Semiconductor Corporation
FAN2106 • Rev. 1.1.0
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Thermal Information
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device
reliability. The absolute maximum ratings are stress ratings only.
Note:
1.
Symbol
Symbol
BOOT to PGND
θ
VCC to AGND
T
VIN to PGND
BOOT to SW
SW to PGND
All other pins
V
f
θ
J-PCB
Parameter
V
P
Typical thermal resistance when mounted on a four-layer, two-ounce PCB, as shown in Figure 26. Actual results
are dependent on mounting method and surface related to the design.
T
T
T
SW
STG
JC
CC
IN
A
L
D
J
ESD
Storage Temperature
Lead Soldering Temperature, 10 Seconds
Thermal Resistance: Junction-to-Case
Thermal Resistance: Junction-to-Mounting Surface
Power Dissipation, T
Bias Voltage
Supply Voltage
Ambient Temperature
Junction Temperature
Switching Frequency
AGND = PGND
Continuous
Transient (t < 20ns, f < 600KHz)
Human Body Model, JEDEC JESD22-A114
Charged Device Model, JEDEC JESD22-C101
Parameter
A
= 25°C
Parameter
Conditions
VCC to AGND
VIN to PGND
FAN2106MPX
FAN2106EMPX
Conditions
4
P1 (Q2)
P2 (Q1)
P3
Min.
Min.
200
-10
-40
4.5
-65
3
Min.
-0.3
-0.5
-5.0
-0.3
2.0
2.5
Typ.
Typ.
35
5.0
4
7
4
(1)
V
Max.
CC
24.0
30.0
6.0
28
35
6
+0.3
Max.
Max.
+125
+150
+300
2.8
+85
+85
600
5.5
24
(1)
www.fairchildsemi.com
Unit
kV
°C/W
°C/W
V
V
V
V
V
V
Unit
Unit
KHz
°C
°C
°C
°C
W
V
V