FAN2108MPX Fairchild Semiconductor, FAN2108MPX Datasheet - Page 4

• Manufacturer Part Number: FAN2108MPX
• Description: IC REG SYNC BUCK 8A 3-24V 25-MLP
• Manufacturer: Fairchild Semiconductor
• Series: TinyBuck™r
• Type: Step-Down (Buck)r

Specifications of FAN2108MPX

• Internal Switch(s): Yes
• Synchronous Rectifier: Yes
• Number Of Outputs: 1
• Voltage - Output: 0.8 ~ 19 V
• Current - Output: 8A
• Frequency - Switching: 200kHz ~ 600kHz
• Voltage - Input: 3 ~ 24 V
• Operating Temperature: -10°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 25-MLP
• Power - Output: 2.8W
• Output Voltage: 3.2 V
• Output Current: 8 A
• Input Voltage: 5 V
• Supply Current: 8 mA
• Switching Frequency: 600 KHz
• Mounting Style: SMD/SMT
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 10 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: FAN2108MPXTR

© 2008 Fairchild Semiconductor Corporation
FAN2108 • Rev. 1.0.1
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device
reliability. The absolute maximum ratings are stress ratings only.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Thermal Information
Note:
1.
Symbol
Symbol
BOOT to PGND
VCC to AGND
θ
Typical thermal resistance when mounted on a four-layer, two-ounce PCB, as shown in Figure 24. Actual results
are dependent on mounting method and surface related to the design.
VIN to PGND
BOOT to SW
SW to PGND
T
All other pins
V
Parameter
T
θ
J-PCB
V
P
T
T
T
STG
T
CC
f
VP
JC
IN
A
J
L
D
I
ESD
Storage Temperature
Lead Soldering Temperature, 10 Seconds
Vapor Phase, 60 Seconds
Infrared, 15 Seconds
Thermal Resistance: Junction-to-Case
Thermal Resistance: Junction-to-Mounting Surface
Power Dissipation, T
Bias Voltage
Supply Voltage
Ambient Temperature
Junction Temperature
Switching Frequency
AGND=PGND
Continuous
Transient (t < 20ns, f < 600KHz)
Human Body Model, JEDEC JESD22-A114
Charged Device Model, JEDEC JESD22-C101
Parameter
A
=25°C
Parameter
Conditions
(1)
VCC to AGND
VIN to PGND
FAN2108MPX
FAN2108EMPX
Conditions
4
P1 (Q2)
P2 (Q1)
P3
(1)
Min.
Min.
4.5
-10
-40
-65
3
Min.
-0.5
-0.3
-0.3
2.5
-5
2
Typ.
Typ.
5.0
35
4
7
4
V
Max.
CC
24.0
6.0
28
35
30
6
+0.3
Max.
+125
Max.
+150
+300
+215
+220
+85
+85
600
5.5
24
2.8
www.fairchildsemi.com
Unit
kV
Unit
V
V
V
V
V
V
V
°C/W
°C/W
°C/W
°C/W
kHz
Unit
°C
°C
°C
V
V
°C
°C
°C
°C
W