L6712QTR STMicroelectronics, L6712QTR Datasheet

IC CTRLR DC/DC 2PH SYNC 36VFQFPN

L6712QTR

Manufacturer Part Number
L6712QTR
Description
IC CTRLR DC/DC 2PH SYNC 36VFQFPN
Manufacturer
STMicroelectronics
Type
Step-Down (Buck)r
Datasheet

Specifications of L6712QTR

Internal Switch(s)
No
Synchronous Rectifier
Yes
Number Of Outputs
2
Voltage - Output
0.9 ~ 3.3 V
Current - Output
2A
Frequency - Switching
150kHz
Voltage - Input
12V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
36-VFQFN, 36-VFQFPN
Power - Output
3.5W
Operating Temperature Range
- 40 C to + 125 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-4219-2

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
L6712QTR
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
L6712QTR
Manufacturer:
ST
Quantity:
16 705
1
1.1 Applications
2
The device implements a dual-phase step-down con-
troller with a 180 phase-shift between each phase
June 2005
2 PHASE OPERATION WITH
SYNCHRONOUS RECTIFIER CONTROL
ULTRA FAST LOAD TRANSIENT RESPONSE
INTEGRATED HIGH CURRENT GATE
DRIVERS: UP TO 2A GATE CURRENT
3 BIT PROGRAMMABLE OUTPUT FROM
0.900V TO 3.300V OR WITH EXTERNAL REF.
±0.9% OUTPUT VOLTAGE ACCURACY
3mA CAPABLE AVAILABLE REFERENCE
INTEGRATED PROGRAMMABLE REMOTE
SENSE AMPLIFIER
PROGRAMMABLE DROOP EFFECT
10% ACTIVE CURRENT SHARING
ACCURACY
DIGITAL 2048 STEP SOFT-START
CROWBAR LATCHED OVERVOLTAGE PROT.
NON-LATCHED UNDERVOLTAGE PROT.
OVERCURRENT PROTECTION REALIZED
USING THE LOWER MOSFET'S R
SENSE RESISTOR
OSCILLATOR EXTERNALLY ADJUSTABLE
AND INTERNALLY FIXED AT 150kHZ
POWER GOOD OUTPUT AND INHIBIT
FUNCTION
PACKAGES: SO-28 & VFQFPN-36
HIGH CURRENT DC/DC CONVERTERS
DISTRIBUTED POWER SUPPLY
Features
Description
TWO-PHASE INTERLEAVED DC/DC CONTROLLER
dsON
OR A
optimized for high current DC/DC applications.
Output voltage can be programmed through the in-
tegrated DAC from 0.900V to 3.300V; program-
ming the "111" code, an external reference from
0.800V to 3.300V is used for the regulation.
Programmable Remote Sense Amplifier avoids
use of external resistor divider and recovers loss-
es along distribution line.
The device assures a fast protection against load
over current and Over / Under voltage.An internal
crowbar is provided turning on the low side mosfet
if Over-voltage is detected.
Output current is limited working in Constant Cur-
rent mode: when Under Voltage is detected, the
device resets, restarting operation.
Figure 1. Packages
Table 1. Order Codes
VFQFPN
Package
SO
L6712D,
L6712AD
L6712Q,
L6712AQ
VFQFPN-36 (6x6x1.0mm)
Tube
SO28
L6712DTR,
L6712ADTR
L6712QTR,
L6712AQTR
Tape & Reel
L6712A
L6712
Rev. 3
1/29

Related parts for L6712QTR

L6712QTR Summary of contents

Page 1

... Over-voltage is detected. Output current is limited working in Constant Cur- rent mode: when Under Voltage is detected, the device resets, restarting operation. L6712 L6712A SO28 VFQFPN-36 (6x6x1.0mm) Tube Tape & Reel L6712DTR, L6712ADTR L6712QTR, L6712AQTR Rev. 3 1/29 ...

Page 2

L6712A L6712 Figure 2. Block Diagram BAND-GAP BAND-GAP REFERENCE REFERENCE PGOOD PGOOD LOGIC AND LOGIC AND VID2 VID2 PROTECTIONS PROTECTIONS VID1 VID1 DAC DAC VID0 VID0 DIGITAL DIGITAL SOFT-START SOFT-START V V REF_IN/OUT REF_IN/OUT FBG FBG FBR FBR REMOTE REMOTE ...

Page 3

Figure 3. Pin Connection (Top view) LGATE1 1 28 VCCDR 2 27 PHASE1 3 26 UGATE1 4 25 BOOT1 5 24 VCC 6 23 SGND 7 22 COMP DROOP 10 19 REF_IN/OUT 11 18 VSEN ...

Page 4

L6712A L6712 Table 4. Electrical Characteristcs (continued 12V±10 0°C to 70°C unless otherwise specified Symbol Parameter REFERENCE AND DAC Output Voltage Accuracy VIDx See Table 5, VID ≠ “11x“ (1) V OUT REF_IN/OUT Reference ...

Page 5

Table 4. Electrical Characteristcs (continued 12V±10 0°C to 70°C unless otherwise specified Symbol Parameter PROTECTIONS PGOOD Upper Threshold Lower Threshold OVP Over Voltage Threshold UVP Under Voltage Trip V PGOOD Voltage Low PGOODL I ...

Page 6

L6712A L6712 Table 6. Pin Function (continued) N. (*) Name SO VFQFPN 10 9 DROOP 11 11 REF_IN / OUT 12 12 VSEN 13 13 ISEN1 14 14 PGNDS1 15 15 PGNDS2 16 16 ISEN2 17 18 OSC/INH FAULT 18 ...

Page 7

Table 6. Pin Function (continued) N. (*) Name SO VFQFPN VID0 PGOOD 24 27 BOOT2 25 28 UGATE2 26 29 PHASE2 27 30 LGATE2 28 31, PGND 32 PAD THERMAL PAD (*) ...

Page 8

L6712A L6712 3 Device Description The device is an integrated circuit realized in BCD technology. It provides complete control logic and pro- tections for a high performance dual-phase step-down converter optimized for high current DC/DC appli- cations designed ...

Page 9

Figure 5. R vs. Switching Frequency OSC 14000 12000 10000 8000 6000 4000 2000 Frequency (kHz) 3.2 DIGITAL TO ANALOG CONVERTER AND REFERENCE The built-in digital to analog converter allows the adjustment of the output voltage ...

Page 10

L6712A L6712 Figure 6. Reference Management BAND-GAP REFERENCE (1.235V) VID3 VID2 VID1 REF_IN/OUT The output regulated voltage accuracy can be extracted from the following relationships (worst case con- dition OUT_TOT_ACC [ ] ...

Page 11

DRIVER SECTION The integrated high-current drivers allow using different types of power MOS (also multiple MOS to reduce the R ), maintaining fast switching transition. dsON The drivers for the high-side mosfets use BOOTx pins for supply and PHASEx ...

Page 12

L6712A L6712 circuitry reads the current during the time in which the low-side mosfet is on (OFF Time). During this time, the reaction keeps the pin ISENx and PGNDSx at the same voltage while during the time in which the ...

Page 13

I OCPx Since the device senses the output current across the low-side mosfets (or across a sense resistors in series with them) the device limits the bottom of the inductor current triangular waveform: an over current is detected when the ...

Page 14

L6712A L6712 usual way until another OCP event is detected. This means that the average current delivered can slightly increase also in Over Current condition since the current ripple increases. In fact, the ON time increases due to the OFF ...

Page 15

L6712A - Fixed Maximum Duty Cycle Limitation The maximum duty cycle is fixed and constant with the delivered current. The device works in constant ...

Page 16

L6712A L6712 3.6 INTEGRATED DROOP FUNCTION (Optional) Droop function realizes dependence between the regulated voltage and the delivered current (Load Reg- ulation). In this way, a part of the drop due to the output capacitor ESR in the load transient ...

Page 17

The reference used in this case to determine the UV thresholds is the increasing voltage driven by the 2048 soft start digital counter while the reference used for the OV threshold is the final reference programmed ...

Page 18

L6712A L6712 3.9 INPUT CAPACITOR The input capacitor is designed considering mainly the input RMS current that depends on the duty cycle as reported in Figure 15. Considering the two-phase topology, the input RMS current is highly reduced comparing with ...

Page 19

The voltage drop due to the output capacitor discharge is given by the following equation: Where D is the maximum duty cycle value. The lower is the ESR, the lower is the output drop during MAX load transient and ...

Page 20

L6712A L6712 Figure 16. Main Control Loop Diagram + + D03IN1518 3.12.1Current Sharing (CS) Control Loop Active current sharing is implemented using the information from Trans conductance differential amplifier. A current reference equal to the average of the read current ...

Page 21

Where ∆I is the difference between one phase current and the ideal current (I READ For R = 4mΩ and I = 40A the current sharing error is equal to 2.5%, neglecting errors due to Rg SENSE MAX and R ...

Page 22

L6712A L6712 Figure 18. ACM Control Loop Gain Block Diagram (left) and Bode Diagram (right). I DROOP Z F DROOP COMP FB COMP VID L/2 V OUT PWM d•V IN Cout ESR The ...

Page 23

Integrated power drivers reduce components count and interconnections between control functions and drivers, reducing the board space. Here below are listed the main points to focus on when starting a new layout and rules are suggested for a correct implementation. ...

Page 24

L6712A L6712 implemented the same way to the LS mosfets Source pin. GATEx and PHASEx connections (and also PGND when no power ground plane is implemented) must also be designed to handle current peaks in excess of 2A ...

Page 25

Current Reading: The Rg resistor has to be placed as close as possible to the ISENx and PGNDSx pins in order to limit the noise injection into the device. The PCB traces connecting these resistors to the read- ing ...

Page 26

L6712A L6712 4 Package informations Figure 22. SO-28 Mechanical Data & Package Dimensions mm DIM. MIN. TYP. MAX. A 2.65 a1 0.1 0.3 b 0.35 0.49 b1 0.23 0.32 C 0.5 c1 45° (typ.) D 17.7 18 10.65 ...

Page 27

Figure 23. VFQFPN-36 Mechanical Data & Package Dimensions mm DIM. MIN. TYP. MAX. A 0.800 0.900 1.000 A1 0.020 0.050 A2 0.650 1.000 A3 0.250 b 0.180 0.230 0.300 D 5.875 6.000 6.125 D2 1.750 3.700 4.250 E 5.875 6.000 ...

Page 28

L6712A L6712 5 Revision History Table 7. Revision History Date Revision March 2004 June 2005 28/29 2 First Issue in EDOCS. 3 Changed look and feel. Inserted “Boot Capacitor Extra Charge” paragraph to page 27. Description of Changes ...

Page 29

... No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics ...

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