IC CNTRLR PWM BUCK 10-UMAX

 

MAX1954AEUB+

Manufacturer Part NumberMAX1954AEUB+
DescriptionIC CNTRLR PWM BUCK 10-UMAX
ManufacturerMaxim Integrated Products
TypeStep-Down (Buck)
MAX1954AEUB+ datasheets

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Specifications of MAX1954AEUB+

Internal Switch(s)NoSynchronous RectifierYes
Number Of Outputs1Voltage - Output0.8 ~ 11.35 V
Current - Output25AFrequency - Switching300kHz
Voltage - Input3 ~ 13.2 VOperating Temperature-40°C ~ 85°C
Mounting TypeSurface MountPackage / Case10-MSOP, Micro10™, 10-uMAX, 10-uSOP
Power - Output444mWDuty Cycle (max)93 %
Output Voltage0.8 V to 4.95 VOutput Current25000 mA
Mounting StyleSMD/SMTSwitching Frequency360 KHz
Maximum Operating Temperature+ 85 CMinimum Operating Temperature- 40 C
Synchronous PinNoTopologyBoost, Buck
Lead Free Status / RoHS StatusLead free / RoHS Compliant  
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Low-Cost, Current-Mode PWM Buck
Controller with Foldback Current Limit
The error-amplifier gain at f
is:
C
G
g
R
EA fC
( )
mEA
C
R
is then calculated as:
C
V
OUT
R
C
V
g
f
FB
mEA
zMOD
C
and C
can then be calculated as:
C
f
R
f
L
LOAD
S
C
C
R
f
L
LOAD
S
1
C
f
2
R
f
C
zMOD
Applications Information
See Table 2 for suggested manufacturers of the com-
ponents used with the MAX1954A.
PC Board Layout Guidelines
Careful PC board layout is critical to achieve low
switching losses and clean, stable operation. The
switching power stage requires particular attention.
Follow these guidelines for good PC board layout:
1) Place IC decoupling capacitors as close as possible
to IC pins. Keep separate the power-ground plane
(connected to pin 7) and the signal-ground plane
(connected to pin 4). The IN pin has two decoupling
capacitors. One connects to pin 7 and one connects
to pin 4.
Table 2. Suggested Manufacturers
MANUFACTURER
Central Semiconductor
Coilcraft
Fairchild
Kemet
Panasonic
Taiyo Yuden
TOKO
16
______________________________________________________________________________________
2) Place the MOSFETs’ decoupling capacitors as
close as possible and place them directly across
from the high-side MOSFET drain and the low-side
f
zMOD
MOSFET source.
f
C
3) Input and output capacitors are connected to the
power-ground plane; all other capacitors are con-
nected to the signal-ground plane.
f
4) Keep the high-current paths as short as possible.
C
G
5) Connect the drain leads of the power MOSFET to a
MOD fC
( )
large copper area to help cool the device. Refer to
the power MOSFET data sheet for recommended
copper area.
C
OUT
6) Connect HSD directly to the drain leads of the high-
R
side MOSFET.
C
7) Connect LX directly to the drain of the low-side
MOSFET.
8) Place the low-side MOSFET so that its source is as
close as possible to pin 7.
9) Ensure all feedback connections are short and
direct. Place the feedback resistors as close as
possible to the IC.
10) Route high-speed switching nodes away from sen-
sitive analog areas (FB, COMP).
11)The trace length from the gates of the low-side and
high-side MOSFETs to DH and DL should be no
longer than 700 mils.
To aid design, a sample layout is available in the
MAX1954A evaluation kit.
COMPONENT
PHONE
Diodes
631-435-1110
Inductors
800-322-2645
MOSFETs
800-341-0392
Capacitors
864-963-6300
Capacitors
714-373-7366
Capacitors
408-573-4150
Inductors
800-745-8656
WEBSITE
www.centralsemi.com
www.coilcraft.com
www.fairchildsemi.com
www.kemet.com
www.panasonic.com
www.t-yuden.com
www.toko.com

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