EL7530IYZ-T13 Intersil, EL7530IYZ-T13 Datasheet
EL7530IYZ-T13
Specifications of EL7530IYZ-T13
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EL7530IYZ-T13 Summary of contents
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... EL7530IYZ-T7 BAADA 7” MSOP (Note) (Pb-free) EL7530IYZ-T13 BAADA 13” MSOP (Note) (Pb-free) NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations ...
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Absolute Maximum Ratings ( SGND . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6. ...
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Pin Descriptions PIN NUMBER PIN NAME 1 SGND Negative supply for the controller stage 2 PGND Negative supply for the power stage 3 LX Inductor drive pin; high current digital output with average voltage equal to the regulator output voltage ...
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Performance Curves and Waveforms All waveforms are taken 3.3V otherwise noted. 100 V =3. =2. =1. =0. ...
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Performance Curves and Waveforms All waveforms are taken 3.3V otherwise noted. 0.1% 0.0% V =3. -0.1% -0.2% V =3.3V I =600mA IN O -0.3% -0.4% -0.5% -0.6% V =5V I ...
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Performance Curves and Waveforms All waveforms are taken 3.3V otherwise noted. 2µs/DIV FIGURE 12. PFM STEADY-STATE OPERATION WAVEFORM (I = 100mA) O 0.2µs/DIV FIGURE 14. EXTERNAL SYNCHRONIZATION TO 2MHz 100µs/DIV FIGURE 16. LOAD TRANSIENT ...
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Performance Curves and Waveforms All waveforms are taken 3.3V otherwise noted. 50µs/DIV FIGURE 18. PWM LOAD TRANSIENT RESPONSE (100mA TO 500mA) 1 0.6 0.2 0 -0.2 -0.6 0 200 400 600 I (mA) O ...
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Performance Curves and Waveforms All waveforms are taken 3.3V otherwise noted. JEDEC JESD51-3 LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 0.6 486mW 0.5 0.4 0.3 0.2 0 AMBIENT TEMPERATURE (°C) ...
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Applications Information Product Description The EL7530 is a synchronous, integrated FET 600mA step- down regulator which operates from an input of 2.5V to 5.5V. The output voltage is user-adjustable with a pair of external resistors. When the load is very ...
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Thermal Performance The EL7530 is available in a fused-lead MSOP10. Compared with regular MSOP10 package, the fused- lead package provides lower thermal resistance. The θ 100°C 4-layer board and 125°C/W on 2-layer board. Maximizing the copper area around ...
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... Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use ...