LM26420YMHX/NOPB National Semiconductor, LM26420YMHX/NOPB Datasheet - Page 5

IC REG DUAL SYNC BUCK 2A 20TSSOP

LM26420YMHX/NOPB

Manufacturer Part Number
LM26420YMHX/NOPB
Description
IC REG DUAL SYNC BUCK 2A 20TSSOP
Manufacturer
National Semiconductor
Series
PowerWise®r
Type
Step-Down (Buck)r
Datasheet

Specifications of LM26420YMHX/NOPB

Internal Switch(s)
Yes
Synchronous Rectifier
Yes
Number Of Outputs
2
Voltage - Output
0.8 ~ 4.5 V
Current - Output
2A
Frequency - Switching
550kHz
Voltage - Input
3 ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
20-TSSOP Exposed Pad, 20-eTSSOP, 20-HTSSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power - Output
-
Other names
LM26420YMHX
Note 1: Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Range indicates conditions for which the device is
intended to be functional, but does not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics.
Note 2: Thermal shutdown will occur if the junction temperature exceeds the maximum junction temperature of the device.
Note 3: The human body model is a 100pF capacitor discharged through a 1.5 kΩ resistor into each pin. Test method is per JESD-22-A114.
Note 4: Applies to a 4-layer standard JEDEC thermal test board or 4LJEDEC is 4"x3" in size. The board has 2 imbedded copper layers which cover roughly the
same size as the board. The copper thickness for the four layers, starting from the top one, is 2 oz./1oz./1oz./2 oz. For LLP, thermal vias are placed between the
die attach pad in the 1st. copper layer and 2nd. copper layer.
Symbol
T
θ
θ
JC
SD
JA
Junction to Ambient
0 LFPM Air Flow
Junction to Case
Thermal Shutdown Temperature
Parameter
(Note
(Note
4)
4)
LLP-16
eTSSOP-20
LLP-16
eTSSOP-20
5
Conditions
Min
Typ
165
6.8
3.9
40
35
Max
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Units
°C/W
°C

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