TLE8264-2E Infineon Technologies, TLE8264-2E Datasheet - Page 5

• Manufacturer Part Number: TLE8264-2E
• Description: IC SYSTEM BASIS CHIP DSO-36
• Manufacturer: Infineon Technologies
• Type: Transceiverr

Specifications of TLE8264-2E

• Applications: Automotive
• Mounting Type: Surface Mount
• Package / Case: DSO-36
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: SP000379938

robust Package: for a safer lead-free processing
the reliability of both, the component and the application. This new package concept enables Infineon to address the lead-free
requirements with improved quality, going beyond the today’s AEC Q101 specifications.
Green and Robust package
Robust package
A N E L E M E N T O F T h E A u T O M O T I V E E x C E L L E N C E P r O G r A M , the robust package, significantly improves
Stress test: Temperature Cycling (– 55 °C, + 150 °C)
Preconditioning:
3 times solder reflow profile, 260 °C peak temp.
Competition
Solder Die Attach (PbSnAg)
Robust Passivation
allowing increased solder
reflow (260 °C) due to
green requirement
reducing passivation
cracks and shifted
metallisation
Scanning acoustic microscope, ultrasonic images of the front, delamination in red (major) / yellow (minor)
Infineon Green & robust,
SPT Technology
Stress test: Autoclave (Temp. 121 °C, 100 % humidity)
Preconditioning:
3 times solder reflow profile, 260 °C peak temp.
Competition
Low Stress / Molding Compound MC
halogen free
reducing thermomechanical
stress in package
Plating
Adhesion promoter
Infineon Green & robust,
SPT Technology
lead free
providing good adhesion
to all interfaces
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