TLE8264-2E Infineon Technologies, TLE8264-2E Datasheet - Page 6

• Manufacturer Part Number: TLE8264-2E
• Description: IC SYSTEM BASIS CHIP DSO-36
• Manufacturer: Infineon Technologies
• Type: Transceiverr

Specifications of TLE8264-2E

• Applications: Automotive
• Mounting Type: Surface Mount
• Package / Case: DSO-36
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: SP000379938

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ESD robustness: holding the leadership in performance and innovation
the bus, from ESD (Electro Static Discharges) to voltage peaks resulting from the parasitic inductances of bus cables. A robust
transceiver also does not need expensive external protection components such a zener diodes or varistors.
dissipation of the energy, which is converted during an ESD event, through the chip from top to bottom. Silicon On Isolator (SOI)
type technologies where the active side of the chip is decoupled from its bottom by an insulator do not allow such concepts.
Infineons products can hold more than 10 kVolts of discharges using ISO 61000-4-2 test standard, an application oriented testing
method that applies an energy which is five times higher than the standard hBM (human Body Model) test that simulates typical
handling events.
ESD Robustness of TLE7259-2G in comparison with the competition
ESD Robustness of TLE6251DS in comparison with the competition
O N E O F T h E S P E C I F I C C h A L L E N G E S for a transceiver device is to withstand the harsh signals that occur on
O V E r T h E P A S T y E A r S Infineon developed and improved an innovative integrated protection that enables the
ISO 61000-4-2 150 pF / 330 T
ISO 61000-4-2 150 pF / 330 T
+2 kV
+1 kV
(without bus filter)
+10 kV
+15 kV
ISO 61000-4-2 150 pF / 330 T
ISO 61000-4-2 150 pF / 2 kT
+1,5 kV
(with bus filter C = 3.3 nF)
+1 kV
+15 kV
+13 kV
Competition
Infineon TLE7259-2G
Competition
Infineon TLE6251DS