HCPL-0201-500E Avago Technologies US Inc., HCPL-0201-500E Datasheet - Page 6
HCPL-0201-500E
Manufacturer Part Number
HCPL-0201-500E
Description
OPTOCOUPLER LOG-OUT 5MBD 8-SOIC
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-0201-500E.pdf
(18 pages)
Specifications of HCPL-0201-500E
Package / Case
8-SOIC (0.154", 3.90mm Width)
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
25mA
Data Rate
5MBd
Propagation Delay High - Low @ If
150ns @ 3mA
Current - Dc Forward (if)
5mA
Input Type
DC
Output Type
Push-Pull, Totem-Pole
Mounting Type
Surface Mount
Isolation Voltage
3750 Vrms
Maximum Continuous Output Current
25 mA
Maximum Fall Time
0.007 us
Maximum Forward Diode Current
10 mA
Output Device
Logic Gate Photo IC
Configuration
1 Channel
Maximum Baud Rate
5 MBd(Typ)
Maximum Forward Diode Voltage
1.7 V
Maximum Reverse Diode Voltage
5 V
Maximum Power Dissipation
210 mW
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
516-1483-2
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HCPL-0201-500E
Manufacturer:
AVAGO
Quantity:
30 000
Part Number:
HCPL-0201-500E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW2201/11)
Solder Reflow Temperature Profile
6
TEMPERATURE
(0.071 ± 0.006)
1.80 ± 0.15
ROOM
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
300
200
100
0
0
NOTE: NON-HALIDE FLUX SHOULD BE USED.
1
8
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
160 °C
150 °C
140 °C
(0.442 ± 0.006)
11.23 ± 0.15
7
2
(0.100)
6
3
BSC
2.54
4
5
50
(0.061)
MAX.
1.55
3 °C + 1 °C/–0.5 °C
(0.354 ± 0.006)
(0.158)
9.00 ± 0.15
4.00
150 °C, 90 + 30 SEC.
PREHEATING TIME
MAX.
(0.030 ± 0.010)
0.75 ± 0.25
2.5 C ± 0.5 °C/SEC.
100
LAND PATTERN RECOMMENDATION
TIME (SECONDS)
(0.051)
1.3
(0.039 ± 0.006)
(0.484 ± 0.012)
245 °C
TEMP.
PEAK
1.00 ± 0.15
12.30 ± 0.30
(0.433)
11.00
150
MAX.
SEC.
30
SEC.
30
(0.09)
2.29
7
o
NOM.
50 SEC.
(0.534)
SOLDERING
13.56
(0.010
0.254
200 °C
TIME
200
- 0.0051
+ 0.003)
+ 0.076
- 0.002)
PEAK
TEMP.
240 °C
TIGHT
TYPICAL
LOOSE
230 °C
TEMP.
PEAK
250