HCPL-2530-000E Avago Technologies US Inc., HCPL-2530-000E Datasheet - Page 6

• Manufacturer Part Number: HCPL-2530-000E
• Description: OPTOCOUPLER T-OUT 2CH 1MBD 8-DIP
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-2530-000E

• Input Type: DC
• Package / Case: 8-DIP (0.300", 7.62mm)
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 2, Unidirectional
• Current - Output / Channel: 8mA
• Data Rate: 1MBd
• Propagation Delay High - Low @ If: 200ns @ 16mA
• Current - Dc Forward (if): 25mA
• Output Type: Open Collector
• Mounting Type: Through Hole
• Isolation Voltage: 3750 Vrms
• Output Device: Transistor With Base
• Configuration: 2 Channel
• Current Transfer Ratio: 50 %
• Maximum Baud Rate: 1 MBps
• Maximum Forward Diode Voltage: 1.8 V
• Maximum Reverse Diode Voltage: 5 V
• Maximum Input Diode Current: 25 mA
• Maximum Power Dissipation: 45 mW
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 55 C
• No. Of Channels: 2
• Optocoupler Output Type: Phototransistor
• Input Current: 16mA
• Output Voltage: 20V
• Opto Case Style: DIP
• No. Of Pins: 8
• Ctr Min: 7%
• Common Mode Ratio: 1k
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-1659-5

Solder Reflow Thermal Profile
Recommended Pb-Free IR Profile
Regulatory Information
The devices contained in this data sheet have been approved by the following organizations:
UL
Recognized under UL 1577, Component Recognition
Program, File E55361.
CSA
Approved under CSA Component Acceptance Notice #5,
File CA 88324.
6
TEMPERATURE
ROOM
T
T
smax
300
200
100
smin
25
T
T
0
p
L
0
NOTE: NON-HALIDE FLUX SHOULD BE USED.
217 °C
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
160 °C
150 °C
140 °C
150 - 200 °C
t 25 °C to PEAK
60 to 180 SEC.
PREHEAT
3 °C/SEC. MAX.
t
s
50
RAMP-UP
* 260 +0/-5 °C
3 °C + 1 °C/–0.5 °C
150 °C, 90 + 30 SEC.
TIME
PREHEATING TIME
2.5 C ± 0.5 °C/SEC.
t
t
L
p
100
TIME (SECONDS)
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
15 SEC.
60 to 150 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
245 °C
TEMP.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01.
(Option 060 only)
PEAK
150
SEC.
30
SEC.
30
NOTES:
THE TIME FROM 25 °C to PEAK
TEMPERATURE = 8 MINUTES MAX.
T
NOTE: NON-HALIDE FLUX SHOULD BE USED.
* RECOMMENDED PEAK TEMPERATURE FOR
smax
WIDEBODY 400mils PACKAGE IS 245 °C
50 SEC.
= 200 °C, T
SOLDERING
200 °C
TIME
200
PEAK
TEMP.
240 °C
smin
= 150 °C
TIGHT
TYPICAL
LOOSE
230 °C
TEMP.
PEAK
250