HCNW139-000E Avago Technologies US Inc., HCNW139-000E Datasheet - Page 2

• Manufacturer Part Number: HCNW139-000E
• Description: OPTOCOUPLER DARL-OUT 8-DIP WIDE
• Manufacturer: Avago Technologies US Inc.

Specifications of HCNW139-000E

• Input Type: DC
• Package / Case: 8-DIP (0.400", 10.16mm)
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 60mA
• Data Rate: 100KBd
• Propagation Delay High - Low @ If: 5µs @ 500µA
• Current - Dc Forward (if): 25mA
• Output Type: Open Collector
• Mounting Type: Through Hole
• Isolation Voltage: 1414 V
• Minimum Forward Diode Voltage: 1.25 V
• Output Device: Darlington With Base
• Configuration: 1 Channel
• Current Transfer Ratio: 4500 %(Typ)
• Maximum Baud Rate: 100 KBps
• Maximum Forward Diode Voltage: 1.85 V
• Maximum Reverse Diode Voltage: 3 V
• Maximum Input Diode Current: 20 mA
• Maximum Power Dissipation: 135 mW
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-1612-5

The 6N139, HCPL-0701, and
CNW139 are for use in CMOS,
LSTTL or other low power appli-
cations. A 400% minimum current
transfer ratio is guaranteed over
0 to 70 C operating range for only
0.5 mA of LED current.
The 6N138, HCPL-0700, and
HCNW138 are designed for use
mainly in TTL applications.
Current Transfer Ratio (CTR) is
300% minimum over 0 to 70 C
for an LED current of 1.6 mA
Selection Guide
Note:
1. Technical data are on separate Agilent publications.
HCPL-4701
Channel
Package
Single
6N139
6N138
(300 Mil)
8-Pin DIP
[1]
Channel
Package
2731
2730
4731
HCPL-
Dual
[1]
[1]
[1]
Channel
Package
Small Outline SO-8
070A
HCPL-
Single
0701
0700
[1]
(1 TTL Unit load ). A 300%
minimum CTR enables operation
with 1 TTL Load using a 2.2 k
pull-up resistor.
Selection for lower input current
down to 250 A is available upon
request.
The HCPL-0701 and HCPL-0700
are surface mount devices
packaged in an industry standard
SOIC-8 footprint.
Channel
Package
073A
HCPL-
Dual
0731
0730
[1]
Widebody
HCNW139
HCNW138
(400 mil)
Package
Channel
Package
Single
Minimum
Input ON
Current
0.5 mA
1.6 mA
0.5 mA
40 A
(I
F
)
Minimum
2
The SOIC-8 does not require
“through holes” in a PCB. This
package occupies approximately
one-third the footprint area of the
standard dual-in-line package.
The lead profile is designed to be
compatible with standard surface
mount processes.
The HCNW139 and HCNW138
are packaged in a widebody
encapsulation that provides creep-
age and clearance dimensions
suitable for safety approval by
regulatory agencies worldwide.
400%
300%
800%
300%
CTR
Absolute
Maxi-
mum
18 V
18 V
20 V
V
7 V
CC
Single and
Hermetic
Packages
Channel
HCPL-
5701
5700
5731
5730
Dual
[1]
[1]
[1]
[1]